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Both semiconductors and PWBs have fine features affected by changes in the composition of the plating solution, thereby creating a high demand for process control techniques. An old standard for monitoring plating additive in PWB manufacturing might find new life meeting these demands.
The electrodeposition of copper is well known, and has been used for many years in general metal finishing, as well as in printed circuit manufacture. Its use in the semiconductor industry especially as part of the Damascene process for wafer metalization, introduces new criteria. Rapid miniaturization and increased complexity of manufactured chips are placing ever-increasing ...