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<a href="http://www.accessmylibrary.com/coms2/summary_0286-5989020_ITM" title="Facts and information about A review of filling high-density, high aspect ratio vias in a high-volume production setting: A study of microvia hole filling material requirements and machine process capability based on performance test results obtained from several PCB facilities.">A review of filling high-density, high aspect ratio vias in a high-volume production setting: A study of microvia hole filling material requirements and machine process capability based on performance test results obtained from several PCB facilities.</a>
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A review of filling high-density, high aspect ratio vias in a high-volume production setting: A study of microvia hole filling material requirements and machine process capability based on performance test results obtained from several PCB facilities.
We belong to a highly interdependent industry, comprised of circuit designers, material suppliers, circuit board manufacturers, service bureaus, and OEMs. Global competition drives us to manufacture products with higher density, enhanced electrical and thermal performance, all at a lower cost, with shorter lead-time. One of the developing technologies that would enable both size reduction and enhanced functional performance is utilization of filled high aspect ratio vias (Ref. 1).
The directives for bringing this technology to fruition are reliability, cost and throughput capability. For practical purposes, we need to break down the via-filling technology into ...
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