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MARCH PLASMA IMPROVES THROUGHPUT OF PCB PLASMA TREATMENT SYSTEM.
(Full text of a statement. Contact details follow below.)
CONCORD, Calif., Feb. 28 /PRNewswire-AsiaNet/ --
March Plasma Systems announced today the release of improved PCB panel pre-etch conditioning technology. With this new technology the company's industry proven PCB series products can dramatically increase the throughput in applications such as desmear and etchback.
Productivity improvements of more than 30% can be achieved with this new system enhancement. The new product feature will be implemented on all new PCB series shipments, and is also available for retrofit on existing systems.
(Logo: http://www.newscom.com/cgi-bin/prnh/20070228 SFW073LOGO)
The typical three plasma process steps required for high uniformity treatment in desmear and etchback applications include a pre-etch segment, a desmear or etchback segment, and a residual reactant removal segment. The PCB panel pre-etch segment is required to ensure controlled etch across each panel within an individual processing cell as well as from processing cell to processing cell. This PCB panel conditioning directly results in a more uniform plasma treatment. Minimizing the time required for each segment results in improved throughput of the PCB system. The new pre-etch conditioning technology reduces this segment's time by more than 65%, directly resulting in improved PCB system throughput.
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Source: HighBeam Research, MARCH PLASMA IMPROVES THROUGHPUT OF PCB PLASMA TREATMENT SYSTEM.