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3SAE demos auto fiber-stripping process.(Brief Article)
BOSTON, MA -- 3SAE Technologies has taken part in an optoelectronics packaging research effort sponsored by an international consortium of photonics industry leaders designed to demonstrate the advantages of the company's automated fiber preparation technology. Universal Instruments Corporation's Flip Chip and Optoelectronics Packaging group (Binghamton, NY) conducted the studies. Universal Instruments is developing the experimental and theoretical means to assess the consequences of damage induced in optical fibers in handling and packaging.
Fiber preparation, which usually involves mechanical blades or ultrasonic chemical cleaning, is one of the most critical …
