Tessera and NEC Electronics Sign Technology Licensing Agreement -- Agreement Reflects Tessera's Commitment to the Global Adoption of its Advanced Packaging Technologies.

SAN JOSE, Calif. -- Tessera Technologies, Inc. (Nasdaq:TSRA), a leading technology developer and services provider for semiconductor chip-scale and multi-chip packages (CSPs and MCPs), today announced that it has signed a new technology licensing agreement with NEC Electronics Corporation (TSE:6723), one of the world's ten largest semiconductor manufacturers. NEC Electronics utilizes Tessera's technology in a broad range of semiconductor devices, including application specific integrated circuits (ASICs), application specific standard products (ASSPs) and logic devices. These semiconductors are integrated into a variety of products, such as wireless communications devices, consumer products, and computing electronics.

"NEC has a longstanding history of technology leadership, and NEC Electronics Corporation, established as a separate company in 2002, continues in the same tradition," said Kirk Flatow, Tessera's senior vice president, marketing and sales. "Tessera's advanced packaging technologies make it possible to build high performance, miniaturized electronics at a lower cost. We look forward to supporting NEC Electronics' current and future product requirements with the highly innovative packaging technologies Tessera has developed over the past decade and continues to introduce today."

As part of the agreement, NEC Electronics has licensed Tessera's technology for use by both NEC Electronics and its subcontractors. The technology available to NEC Electronics covers a broad range of chip-scale and multi-chip package types, including integrated circuit devices packaged in "face-down," "face-up," "fold-over," "stacked," and "system-in-package" (SiP) formats, utilizing many different types of materials, including packages using either tape and laminate substrates. These package types are marketed by Tessera as MicroBGA(R) for face-down orientations, MicroBGA-F for face-up ...