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OSAKA FIRM DEVELOPS BETTER WAY TO POLISH QUARTZ WAFERS.
HIGASHI OSAKA, March 1 Asia Pulse - Kashiwara Machine Mfg. Co. has developed a way to polish 300mm-diameter quartz wafers with high precision and efficiency.
The new process involves half the usual number of steps and simplifies the task of wastewater treatment because it does not involve the use of cerium oxide as a polishing material.
Other non-cerium-based polishing procedures are relatively ...
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Source: HighBeam Research, OSAKA FIRM DEVELOPS BETTER WAY TO POLISH QUARTZ WAFERS.