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(From Business Times (Malaysia))
TELEKOM Malaysia Bhd will issue its proposed RM4 billion bonds at the latest by June next year, its vice-president of corporate finance Gazali Harun said.
The company had earlier said that it expected to issue the debt papers in the third quarter of this year. The proceeds would be used to refinance Telekom's bridging loan to pay for its acquisition of cellular company Celcom Sdn Bhd.
Speaking at the Capital Market Summit 2003 in Kuala Lumpur yesterday, Gazali said Telekom was mindful that the borrowing rates for bonds had risen, and was closely monitoring and strategising to issue the bonds at the best possible …