Advanced PCTF Reduces Sensor Real Estate.(Brief Article)

Remtec's plated copper on thick film (PCTF) technology allows designers to reduce package size, increase circuit density, and improve the thermal and electrical performance of microelectronic circuitry required for sensors and a variety of other devices. The PCTF process combines patterned copper-plated images with air-fireable thick films on ceramics for the manufacture of metalized ceramic substrates, chip carriers, and packages. Special features of the technology include thick plated copper (0.001-0.010 in.), fine thick-film lines (0.002 in.), copper-plated through holes and castellations, solid metal plugs (thermal vias), multilayers, integrated resistors, capacitors, and …