Samsung Electronics Company Selects Axcelis 300MM Photostabilization System; FusionPS3 Chosen for CD Control Capabilities in DUV Resist Applications.

Business/Technology Editors

BEVERLY, Mass.--(BUSINESS WIRE)--Sept. 11, 2001

Axcelis Technologies, Inc., (NASDAQ: ACLS), today announced that Samsung, a world-leading DRAM supplier, has chosen the FusionPS3 photostabilization system to qualify 300mm manufacturing processes on its Mass Production Simulation (MPS) line in Kyunggi-Do, Korea. The system was installed in July.

Samsung chose the system for its photoresist pre-treatment capability for pre-dry via etch applications. Photostabilization of deep UV resists increases critical dimension (CD) control and minimizes process variations. This results in improved device quality, increased yields and significant cost savings to IC manufacturers.

"The FusionPS3 allows chipmakers to maintain CDs while focusing on the challenges of introducing 300mm manufacturing processes, increasingly smaller feature sizes, and a wide array of new materials," said Michael Dreyer, vice president and general manager of Axcelis Technologies' photoresist processing group. "As the pioneer of photostabilization technology, we were the first to bring the process to 300mm and DUV resist applications. Samsung is a longstanding Axcelis customer, and we're proud to play an integral role in the launch of their 300mm high-volume production program."

Axcelis designed the FusionPS3 for 0.18 micron and below manufacturing processes on 300mm wafers. By exploiting the natural photochemical properties of resist, the FusionPS3 maximizes intermolecular reactions, thereby delivering consistent and stable resist characteristics. Along with minimizing process variations and increasing CD control, the system improves resist/layer etch selectivity.

The FusionPS3 offers leading-edge resist curing capabilities on a dual-chamber platform. The design enables wafer-handling and auxiliary service modules to be operated side-by-side, with the flexibility for simultaneous processing of different recipes. Each chamber has full electrical and mechanical isolation. This allows operators to access one module for processing, while accessing the other for service. The result is maximum machine uptime, high productivity and low cost of ownership.