Chip packagers develop wafer-level technology.

Taipei, Jan. 29, 2002 (CENS)--At least two integrated circuit (IC) chip packagers in Taiwan, including Chipbond Technology Corp. and Advanced Chip Engineering Technology Inc. (ACE), are developing wafer-level chip packaging (WLP) technology

Wu Fei-nan, president of Chipbond, said that with WLP technology, chip packaging can be done directly on the wafer rather than after the chips are cut, reducing defects and cutting costs. Chipbond has patented over 10 WLP technologies under its ChipBGA brand

Wu said that both of his company's major local competitors, Advanced Semiconductor Engineering, Inc. (ASE) and Siliconware Precision Industries Co., Ltd., are using …