Expansion modules deliver bus-independent I-O capability. (GreenSpring Computers introduces Industry Packs) (Technology Trends: Boards) (product announcement)

Expansion Modules Deliver Bus-Independent I/O Capability

Offering more address space and control functions than Intel's iSBX Multimodule is the Industry Pack, a next-generation I/O module standard from GreenSpring Computers. Like the iSBX, Industry Pack attempts to standardize the physical characteristics and interface definition of piggy-back I/O modules. Comprising only the I/O interface circuitry needed for a specific function, these small circuit boards mount "piggy-back" on a CPU or other interface board.

Industry Packs are similar in concept to iSBX modules, but the interface provides much more address space and additional control functions. The iSBX …