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Chip Stacking Saves Space.(Brief Article)
Sharp Electronics (Hamburg, Germany) says it has developed the world's first three-chip stacked chip-size package. It is intended primarily for the cellular telephone market and handheld devices in the overall information and communications fields. The company began mass production last fall and says it will have production capacity for 1 million chips per month by the end of the first quarter, 2000.
Using a technology developed by Sharp, the three-chip stacked package consists of special thin silicon wafers with die-and-wire bonding. They are modified for the purpose of assembling this ...
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