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Wafer-Stacking 3D Circuit Interconnections.
Electronic Visions Inc. (3701 E. University Dr., Phoenix, AZ 85034; Tel: 602/437-9492, Fax: 602/437-9435) has developed the world's first 8-in. (200-mm) "face-to-face" wafer bond aligner with SmartView for use in advanced wafer stacking research at the Focus Center-New York, Rensselaer: Interconnections for Gigascale Integration (Troy, NY). Electronic Visions' SmartView bond aligner will be used to develop advanced 3D multi-wafer stacks. As reported in last month's issue of MTN, the company was working with the University of Albany to develop these 8-in. wafer bond aligners. Now they are expanding their applications to research and development of the fabrication process.
These Electronic Visions EV640 bond aligners are equipped with SmartView technology that allows Focus Center-New York (FC-NY) researchers to achieve micron-level alignment between both the top and bottom wafers using visible- light technology. The bond aligner's 8-in. wafer capability allows FC-NY to take advantage of the IC industry's standard 8-in. manufacturing infrastructure. Prior to using Electronic Vision's SmartView system, micron level alignment of multiwafer 3D interconnects was not practical.
The Focus Center-New York was established with funding from the Semiconductor Industry Association (SIA), DARPA, and the State of New York as part of the multi-university consortium that is investigating various options in design, materials, and processes to address the roadblocks to achieving gigascale device integration. With these new aligners and bonders, their discoveries and inventions are enabling the semiconductor industry to transcend limits on interconnects.
"Wiring semiconductor circuits with the EV640 Smart View system will permit a significant reduction in circuit routing density and help keep interconnects from limiting IC speed. It will also allow us to interconnect two radically different semiconductor technologies into one structure," says John ...
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