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Qualified for filament winding applications, EP29LP-1 exhibits physical strength that enhances component resistance to thermal shock. It adheres to various substrates, including optical fibers and fibrous reinforcements, and has bond strength of greater than 3,500 psi. With peak exotherm as low as 50[degrees]C, this 2-part, optically clear epoxy is resistant to chemicals and offers compound flow, setup, and handling properties suited for large potting and encapsulating applications.
Hackensack, NJ. October 27, 2009-Master Bond's newly developed EP29LP-1 epoxy is an attractive potting compound for use in large potting and encapsulating …