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MARVELL ENABLES SEAMLESS CONNECTIVITY WITH SINGLE CHIP.

Electro Manufacturing

| June 01, 2009 | COPYRIGHT 2009 Worldwide Videotex. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan.  All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)Copyright

Marvell (NASDAQ: MRVL), Santa Clara, Calif., a leader in storage, communications, and consumer silicon solutions, supports the recently announced Bluetooth 3.0 + HS (High Speed) specification. Marvell demonstrated Bluetooth 3.0 HS at Mobile World Congress in Barcelona and at the Consumer Electronics Show in Las Vegas earlier this year. As a recognized innovator in 802.11 technologies, Marvell played a pivotal role in the development of this specification.

"Marvell has been actively involved in the creation of Bluetooth 3.0 + HS, bringing its 802.11 experience to bear on this important evolution in Bluetooth wireless technology," said Michael Foley, Ph.D., executive director, Bluetooth SIG. "The Bluetooth industry is stronger for the work Marvell has done in this area."

The Marvell(R) 88W8688 Bluetooth Wi-Fi combination chip is designed to fully support this new specification and is available now. The Marvell implementation is designed to allow the new Bluetooth radio to deliver up to 10 to 15 times the throughput of standard Bluetooth 2.1 implementations - at least 24 Mbps. Marvell solutions are differentiated by a superior 802.11 Protocol Adaptation Layer (PAL) that supports simultaneous connection of Bluetooth 3.0 and Wi-Fi using the same radio.

"Marvell customers want to deliver products with the best-in-class wireless experience," said Sameer ...

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