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Micro pitch interconnects.(Packaging & Interconnects)

ECN-Electronic Component News

| October 01, 2005 | COPYRIGHT 2005 Advantage Business Media. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan.  All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)Copyright

Samtec's sub-millimeter micro pitch interfaces on .5 mm (.197"), .635 mm (.025"), and .8 mm (.0315") pitch are said to provide the features of traditional blade and beam construction. The BTH/BSH Series with .5 mm (.0197") pitch systems are available for .5 mm (.197") board spacing and for low profile applications (LTH/LSH Series) with a 2.31 ...

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Source: HighBeam Research, Micro pitch interconnects.(Packaging & Interconnects)

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