Wireless Design & Development articles from March 2007

Wireless Design & Development archives from March 2007

Carriers face a tough decision.(cellular telephone services)
March 1, 2007

Bluetooth chip and reference design.(PRODUCT NEWS/ WHAT'S HOT)
March 1, 2007

Integrated platform.(PRODUCT NEWS/ WHAT'S HOT)
March 1, 2007

Single instrument addresses baseband and IF test needs.(PRODUCT NEWS/ WHAT'S HOT)
March 1, 2007

Image sensor.(PRODUCT NEWS/ WHAT'S HOT)
March 1, 2007

Cost reduction methodology for FPGA families.(WHAT'S HOT/ EMERGING TECHNOLOGIES)
March 1, 2007

Serializer/deserializer.(WHAT'S HOT/ EMERGING TECHNOLOGIES)
March 1, 2007

Infrared components.(WHAT'S HOT/ EMERGING TECHNOLOGIES)
March 1, 2007

NTP card for next-generation telecom networks.(WHAT'S HOT/ EMERGING TECHNOLOGIES)
March 1, 2007

Protect user identity.(EMERGING TECHNOLOGIES & MARKETS)(Brief article)
March 1, 2007

Partners develop a rich user experience.(EMERGING TECHNOLOGIES & MARKETS)
March 1, 2007

CSR launches Univox Mobile.(EMERGING TECHNOLOGIES & MARKETS)
March 1, 2007

Kodiak Networks and Airo Wireless partner to produce specialty devices[TM] for field workforce, government and military markets.(EMERGING TECHNOLOGIES & MARKETS)(Brief article)
March 1, 2007

Clearing the path to 3G handset RF integration: the economics of RF subsystem integration and manufacturing can be dramatically changed by embedding RF intelligence into the subsystem.(TECHNOLOGY FOCUS: RF COMPONENTS)
March 1, 2007

Over-the-Air testing of mobile devices: Over-the-Air testing helps to further ensure that a mobile device will provide good performance on a given network.
March 1, 2007

Combo FPGA/DSP moves into multi-protocol design: designers can offload a number of DSP operations onto FPGAs for highly efficient, cost savings designs.(FPGA/DSP)
March 1, 2007

Tuning Ethernet for military networks: in addition to predictable performance, reliability is a key requirement for any military network.(MILITARY ELECTRONICS)
March 1, 2007

GaAs MMIC mixers.(PRODUCT FOCUS/ MIXERS)
March 1, 2007

Active mixers.(PRODUCT FOCUS/ MIXERS)
March 1, 2007

Image reject mixer.(PRODUCT FOCUS/ MIXERS)
March 1, 2007

Passive mixer.(PRODUCT FOCUS/ MIXERS)
March 1, 2007

Downconverting mixer for 3G & WiMAX base stations.(PRODUCT FOCUS/ MIXERS)
March 1, 2007

Mixer serves IF and RF applications DC to 4 GHz.(PRODUCT FOCUS/ MIXERS)
March 1, 2007

Los-noise amplifiers.(PRODUCT FOCUS/ MIXERS)
March 1, 2007

Miniature mixers.(PRODUCT FOCUS/ MIXERS)
March 1, 2007

Ramping production shipment.(NEWS / BUSINESS)
March 1, 2007

Fixed-Mobile Convergence Alliance.(NEWS / BUSINESS)
March 1, 2007

NXP acquires cellular division.(NEWS / BUSINESS)
March 1, 2007

Global Handset Strategy.(by TriQuint Semiconductor Inc.)(Brief article)
March 1, 2007

The latest version of RFID anywhere.(NEWS / BUSINESS)
March 1, 2007

Sirenza Microdevices introduces the PowerMax[TM].(NEWS / BUSINESS)(Brief article)
March 1, 2007

Motorola renews relationship with Freescale.(NEWS / BUSINESS)
March 1, 2007

Analog Mixed Signal Methodology Kit.(NEWS / BUSINESS)
March 1, 2007

Thermal Tweezers Nozzles.(DIGITAL HARDWARE COMPONENTS)
March 1, 2007

Motor and driver systems.(DIGITAL HARDWARE COMPONENTS)
March 1, 2007

Single-chip base station.(DIGITAL HARDWARE COMPONENTS)
March 1, 2007

Wireless Management Suite.(SOFTWARE)
March 1, 2007

Software enhancement.(SOFTWARE)
March 1, 2007

Fast measurement analysis.(SOFTWARE)
March 1, 2007

Radio transceiver module.(INTEGRATED SUBSYSTEMS)
March 1, 2007

ISM Band Transceivers.(INTEGRATED SUBSYSTEMS)
March 1, 2007

Multimedia handsets.(INTEGRATED SUBSYSTEMS)
March 1, 2007

Epoxy system.(MATERIALS)
March 1, 2007

Epoxy resin compound.(MATERIALS)
March 1, 2007

Coaxial resonator oscillators.(SIGNAL SOURCES)
March 1, 2007

Low Dropout Regulator.(POWER)
March 1, 2007

Switching power supplies.(POWER)
March 1, 2007

Pure sine wave inverter.(POWER)
March 1, 2007

Modules increase efficiency.(POWER)
March 1, 2007

WLAN power amplifiers.(POWER)
March 1, 2007

SMA Power Splitters.(POWER)
March 1, 2007

Class G amplifier.(AMPLIFIERS)
March 1, 2007

Low noise amplifier.(AMPLIFIERS)
March 1, 2007

Single-stage drive amplifier.(AMPLIFIERS)
March 1, 2007

Log video amplifiers.(AMPLIFIERS)
March 1, 2007

Hybrid coupler.(TRANSMISSION COMPONENTS)
March 1, 2007

Bluetooth single-chip.(SEMICONDUCTORS)
March 1, 2007

Video filter/driver.(SEMICONDUCTORS)
March 1, 2007

GaN semiconductor.(SEMICONDUCTORS)
March 1, 2007

FPGAs designed for high-speed applications.(SEMICONDUCTORS)
March 1, 2007

SPDT reflective switch.(SEMICONDUCTORS)
March 1, 2007

Near-infrared power laser.(SEMICONDUCTORS)
March 1, 2007

ZigBee Compliant Platform.(PLATFORMS)
March 1, 2007

EM Design Kit.(PLATFORMS)
March 1, 2007

Connector platform.(PLATFORMS)
March 1, 2007

Expanded platform portfolio.(PLATFORMS)
March 1, 2007

Platform supports real-time data streams.(PLATFORMS)
March 1, 2007

High voltage platform.(PLATFORMS)
March 1, 2007

Card-edge connectors.(INTERFACE/INTERCONNECT)
March 1, 2007

DDR2 DIMM socket for main memory applications.(INTERFACE/INTERCONNECT)
March 1, 2007

Connector features hyperboloid contact design.(INTERFACE/INTERCONNECT)
March 1, 2007

RoHS compliant Bias Tees.(INTERFACE/INTERCONNECT)
March 1, 2007

Hybrid socket adapter.(INTERFACE/INTERCONNECT)
March 1, 2007

Powerfast connectors.(INTERFACE/INTERCONNECT)
March 1, 2007

Radio network analyzers.(TEST)
March 1, 2007

UMTS optimization solution.(TEST)
March 1, 2007

Network analyzer.(TEST)
March 1, 2007

Temperature sensors.(SENSORS)
March 1, 2007

Designers can quickly dial-in performance.(TECHNOLOGY AWARD)
March 1, 2007

Broadband switch.(SEMICONDUCTORS)
March 1, 2007

I/Q demodulator.(SEMICONDUCTORS)
March 1, 2007

High performance power transistor.(SEMICONDUCTORS)
March 1, 2007

Low noise VCO.(SEMICONDUCTORS)
March 1, 2007

Broadband relays.(SEMICONDUCTORS)
March 1, 2007