Microlithography World articles from November 2006

Microlithography World archives from November 2006

Errata.(Correction notice)
November 1, 2006... In the August 2006 MLW article, "Characterizing scanner illuminators to match OPC," on p. 15, an incorrect equation was substituted for a correct one. Equation 2b should have read: [MATHEMATICAL EQUATION NOT REPRODUCIBLE IN ASCII] ...

The impact of laser spectrum on lithography: the laser spectrum is best parameterized for lithography by the width that contains 95% of the energy. This E95 width can be reduced and stabilized through improved optics and gas management.
November 1, 2006... Lithographers know that the spectrum of the laser providing light to their exposure tool affects the critical dimensions (CD). However, there has not been much information on which parameter of the spectrum is most important, much less on how...

Microlithography for on-chip high-Q inductors: on-chip passive electronic components can be integrated into advanced wafer-level packaging and patterned using proximity mask aligners.
November 1, 2006... On-chip passives such as high-Q inductors in radio frequency (RF) devices have become key components for modern wireless communication systems. Current backend-of-line (BEOL) RF technologies are limited, by nature, to thin conductor lines and...

Improving 90nm FPGA chips with an alternating phase-shift mask: existing nonphase-compliant chip designs can be made using a dark field alternating phase shift gate mask if proper EDA steps are taken. Gate width and line-end shortening are both reduced, improving yield and performance.
November 1, 2006... Can higher chip performance really be achieved by implementing alternating phase shift mask (Alt-PSM) technology on an existing design? Usually, a product can find reasonable performance improvement through a gate shrink. However, reducing the...

Pattern collapse.(The Lithography Expert)
November 1, 2006... Not long ago, defining what an acceptable resist profile looked like was relatively easy. First and foremost, the feature must have the correct critical dimension (CD) within some given tolerance. The more enlightened lithographers might also...

Sematech touts sub-45nm dual-oriented features using 193i litho.(NEWS & PRODUCTS)(Brief article)
November 1, 2006... At the 3rd annual International Symposium on Immersion Lithography in Kyoto, Japan (Oct. 2-5), researchers from Sematech North in Albany, NY, said they have successfully patterned features narrower than 45nm (half-pitch) in multiple...

Fujitsu, Advantest form e-beam litho JV.(NEWS & PRODUCTS)
November 1, 2006... Fujitsu Ltd. and Advantest Corp. plan to form a JV to develop an electron beam direct-write lithography for use with Fujitsu's 65nm and 45nm process technologies. The JV aims to develop process technologies (300mm/65nm, and eventually 45nm)...

Nikon inks deals with Brion, Synopsys.(NEWS & PRODUCTS)
November 1, 2006... Nikon Corp. and Synopsys Inc. are collaborating to develop "manufacturing-aware" OPC and RET lithography simulation models for 45nm and below semiconductor process technologies. Initial work will focus on developing and optimizing litho...

ASML, Sematech qualifying RET for sub-45nm designs.(NEWS & PRODUCTS)
November 1, 2006... Sematech and its manufacturing-oriented subsidiary, the International Sematech Manufacturing Initiative (ISMI), will incorporate ASML Holding NV's RET technology to qualify imaging performance of advanced logic patterns, metrology structures,...

Cadence debuts "litho-aware" flow for third-party tools.(NEWS & PRODUCTS)
November 1, 2006... Cadence Design Systems Inc., collaborating with Brion Technologies and Clear Shape Technologies, has developed what it calls a "lithography-aware" design flow that links resolution enhancement technologies with physical design and verification....

JSR buys Sokudo track tool.(NEWS & PRODUCTS)
November 1, 2006... As part of its plan to upgrade its facilities to 300mm capabilities, JSR Micro Inc. has purchased a 300mm RF3 track system from Sokudo Co. Ltd. for 65-45nm node manufacturing, and for 45nm R&D involving ArF, multilayer materials, chemical...

Ultratech upgrades litho tools.(NEWS & PRODUCTS)
November 1, 2006... Ultratech Inc.'s 200mm Unity GOLD system provides 150- and 200mm wafer packaging for flat-panel display applications, while the 300mm Unity Platinum provides 200mm and 300mm wafer processing capabilities for high-volume chip manufacturing.

Shows & conferences.
November 1, 2006... SEMICON Japan December 6-8 * Chiba, Japan SEMI's exhibition of semiconductor equipment and materials will showcase various tools and technologies, including mask and reticle manufacturing equipment, exposure, direct-write equipment,...

Cargo cults and the innovation economy.(EDITORIAL)
November 1, 2006... One thing really mystified the people of the South Pacific when the colonists first appeared: "Where did they get all their stuff?" Masses of it seemed to arrive magically as cargo on ships. The cargo included lovely cloth and iron tools, not...