Solid State Technology articles from September 2007

Solid State Technology archives from September 2007

450mm wafers: how to scratch that seven-year itch.(EDITORIAL)
September 1, 2007... Every seven years or so the semiconductor industry shifts to a larger wafer size. Analysis shows that the economic gain from continually shrinking circuit features begins to run out of steam in that time frame, and chipmakers get a seven-year...

A-P growth at expense of Japan and US, but not Europe.(BUSINESS TRENDS)(Asia-Pacific)(Brief article)
September 1, 2007... A report from IC Insights Inc. indicates the continued shift of semiconductor production to the Asia-Pacific region is pulling marketshare away from the Japanese and Americas regions. IC companies based in the Americas accounted for nearly...

SEMI.(WORLDWIDE HIGHLIGHTS)(Semiconductor Equipment and Materials International)(Brief article)
September 1, 2007... SEMI's midyear forecast for 2007 capital equipment revenue predicts sharply reduced growth for the next three years--1.1%, 6.5%, and 4.4% for 2007, 2008, and 2009, respectively, vs. a prior forecast of 3.7%,13.3%, and 5.4%.

InterCrossIP Management LLC says it has signed exclusive worldwide licensing agreements with Scottish specialty chemical manufacturer Ceimig Ltd. and Simon Fraser U. in Burnaby.(WORLDWIDE HIGHLIGHTS)
September 1, 2007... InterCrossIP Management LLC says it has signed exclusive worldwide licensing agreements with Scottish specialty chemical manufacturer Ceimig Ltd. and Simon Fraser U. in Burnaby, British Columbia, to commercialize thin-film "photochemical metal...

Cadence Design Systems has acquired DIM firm Invarium.(USA)
September 1, 2007... Cadence Design Systems has acquired DIM firm Invarium, a developer of lithography modeling and pattern-synthesis technology.

KLA-Tencor has quietly acquired FabSolve LLC.(USA)
September 1, 2007... KLA-Tencor has quietly acquired FabSolve LLC, a US firm with "design-based metrology" software that can be used for in-line metrology in semiconductor manufacturing.

IBM and SUSS MicroTec are ramping pilot production of a controlled collapse chip connection new process (C4NP) line at East Fishkill, NY.(USA)
September 1, 2007... IBM and SUSS MicroTec are ramping pilot production of a controlled collapse chip connection new process (C4NP) line at East Fishkill, NY, claiming 99.7% yields.

Vesta Technology.(USA)
September 1, 2007... SEMATECH's Advanced Technology Development Facility (ATDF) and Vesta Technology say they have developed a non-damaging process that allows deposition of plasma-enhanced TiN films at 30% lower temperatures than conventional methods, and a "super...

Silterra Malaysia.(ASIAFOCUS)(Silterra Malaysia Sdn. Bhd.)(Brief article)
September 1, 2007... Silterra Malaysia is undertaking a three-stage plan to pump up capacity across a range of process technologies (0.18[micro]m-65nm), including plans to build a new $1.5-$2.0 billion 300mm wafer fab capable of 20k-25k wafers/month.

Sony.(ASIAFOCUS)(Brief article)
September 1, 2007... Sony plans to invest [yen] 60 billion (US ~$489 million) over three years at the Kumamoto Technology Center of subsidiary Sony Semiconductor Kyushu, as part of a shift in strategic focus from CCD image sensors to CMOS versions, according to the...

ProMOS Technologies.(ASIAFOCUS)(Brief article)
September 1, 2007... ProMOS Technologies reportedlyhas signed a US ~$630 million loan with a group of 13 banks to help support accelerated expansion of its third 300mm factory in Taiwan.

Tower Semiconductor.(ASIAFOCUS)(Brief article)
September 1, 2007... Tower Semiconductor has obtained commitments for $100 million in funding to purchase tools for a capacity expansion at its Fab 2 200mm site, primarily for [less than or equal to]0.13-micron process technologies.

UMC.(ASIAFOCUS)
September 1, 2007... UMC and SEMATECH's ATDF are extending their yearlong collaboration to evaluate manufacturability and commercialization potential for "emerging technology products."

Qimonda AG.(EUROFOCUS)(Brief article)
September 1, 2007... Qimonda AG says it is sampling ultralow-power 512Mbit DRAM devices for mobile applications, using a 75nm low-power trench technology, that consume just 20% the power of equivalent-density standard DRAMs.

Soitec.(EUROFOCUS)(Brief article)
September 1, 2007... After an initially optimistic outlook, SOI wafer supplier Soitec now says fiscal 1H08 sales "will be below the previous year by around 15%" and FY08 sales may be lower prior year as well (372.0 million [euro]).

Big push coming on two routes to 3D.(TECHNOLOGY NEWS)
September 1, 2007... Three-dimensional (3D) chip packaging using through-silicon vias (TSV) will sweep across the industry over the next 3-5 years, enabling very compact packaging with much better performance, based on presentations and discussions at SEMICON West....

Lam decloaks its C3 linear cleaner for ultra-thin films.(TECHNOLOGY NEWS)
September 1, 2007... Lam Research Corp. has finally revealed some details of the technology inside its new linear atmospheric cleaner, first hinted at more than a year ago. Jeff Marks, VP of new businesses for Lam Research Corp., explained to SSTthat the C3 tool...

Intevac goes linear with entry into the dielectric etch market.(TECHNOLOGY NEWS)(Brief article)
September 1, 2007... Since its inception in 1991 (via a LBO spinoff from Varian Semi Equip. Assoc.), Intevac Inc. has been focused on magnetic disk media sputtering/coating technology. In recent years, ~40-50 seniorlevel managers and technologists have joined the...

SURFmonitor breaking waves of defects.(TECHNOLOGY NEWS)
September 1, 2007... KLA-Tencor's Surfscan [SP2.sup.XP] was released earlier this year (SST April 2007, Tech News, p.29) initially to inspect defects on bare wafers. Now the company has added a SURFmonitor haze analysis capability, an add-on option to either a SP2...

Enabling yield in automated material handling systems.(CONTAMINATION CONTROL)
September 1, 2007... EXECUTIVE OVERVIEW Automation systems have three objectives: 1) they must handle each wafer carefully enough to prevent wafer breakage, the goal being 100% wafer yield; 2) they must minimize the generation and/or transfer of particles to...

Silicon remains a contender in flexible electronics.(EMERGING TECHNOLOGIES)
September 1, 2007... EXECUTIVE OVERVIEW Though much of the excitement surrounding flexible electronics is focused on organic semiconductors, silicon remains an important contender for this emerging niche. With layer transfer techniques and ink-jet resist...

Step-and-flash imprint lithography for patterning interconnect dielectrics.(MATERIALS)
September 1, 2007... EXECUTIVE OVERVIEW Step-and-Flash Imprint Lithography (SFIL) has been extended to provide the capability to pattern two or more levels--such as a metal line and a metal via--with a single template. Sacrificial imprint material (SIM)...

Strain-enhanced scaling of HK+MG CMOSFETs.(GATE STACK ENGINEERING)
September 1, 2007... EXECUTIVE OVERVIEW Recent advancement in high-k and metal gate (HK+MG) technology has allowed improvements in gate control owing to the aggressive scaling of equivalent oxide thickness (EOT), which has not been possible with conventional...

Creating 193nm immersion resists with embedded top barriers.(RESIST)
September 1, 2007... EXECUTIVE OVERVIEW Immersion lithography is advancing from a separately coated topcoat to a topcoat-free resist approach using an additive to convert a dry resist into an immersion formulation. We have developed photo-switchable and...

Addressable array technology for systematic yield monitoring at 65nm.(DFM/YIELD MANAGEMENT)
September 1, 2007... EXECUTIVE OVERVIEW Yield, once dominated by random defects, is increasingly dominated by systematic issues at 65nm and below. However, while the semiconductor industry has an established method for monitoring and improving random...

Attendees choose 'best- in-show' products.
September 1, 2007... Solid State Technology and sister magazine Advanced Packaging have named the winners of the fifth annual Attendees' Choice Awards competition at SEMICON West 2007. These awards spotlight companies' technologies on both the wafer processing and...

Wafer coating.(PRODUCTS NEWS)
September 1, 2007... WaferBOND HT-250 coating can be used in high-volume device manufacturing and in advanced packaging processes for flash memory, image sensors, and power device manufacturing. The coating allows device substrates to be temporarily bonded to a...

ArF laser light source.(PRODUCT NEWS)
September 1, 2007... The XLR 600i 90W argon fluoride (ArF) laser light source is designed to enable volume immersion and double patterning lithography at the 32nm node and beyond. The source relies on a recirculating ring architecture that replaces the conventional...

Wafer defect inspection/ classification.(PRODUCT NEWS)
September 1, 2007... The eDR-5200 wafer defect review and classification system, used with KLA-Tencor inspection tools, enables fabs at the 45nm node and beyond to produce a greater number of higher quality defect Paretos per hour, allowing engineers to take rapid...

Magnetically levitated turbopumps.(PRODUCT NEWS)
September 1, 2007... The HiMag 3400 magnetically levitated turbopumps with integrated drive electronics can be employed in critical processes, such as particulate contamination, high gas loads, and corrosive gases, since their high backing vacuum compatibility is...

PECVD system.(PRODUCT NEWS)
September 1, 2007... The Producer BLOk II PECVD system delivers advanced barrier low-k technology required for creating faster, more power-efficient logic chips at the 45nm node and beyond. Used in conjunction with ultralow-k dielectrics, such as Applied's Black...

KrF lithography system.(PRODUCT NEWS)
September 1, 2007... The Twinscan XT-1000 scanner is a KrF lithography system that extends cost-efficient KrF technology to resolutions that previously required more expensive ArF technology. The XT:1000's high numerical aperture of 0.93 can resolve 80nm device...

Ultra-low leakage measurements.(PRODUCT NEWS)
September 1, 2007... VersaTile probe cards operate from -65 [degrees] to 300 [degrees]C for an ultra-low leakage for measuring of currents and to increase test throughput during wafer level reliability tests such as HCI, NBTI, TDDB, and BTS. The low-leakage,...

Metal-matrix structural components.(PRODUCT NEWS)
September 1, 2007... These AlSiC structural components include end effectors for automated wafer fabrication machinery and other robotic components. The structural material reportedly has the strength and stiffness of steel at one third the density. AlSiC materials...

Lid-seal material for flip-chip.(PRODUCT NEWS)
September 1, 2007... The EA-6900lid-seal material (heatspreader) must withstand higher processing temperatures associated with lead-free BGA attach and MSL testing, due to new RoHS regulations. This microelectronic adhesive is formulated to withstand repeated...

High-flow turbomolecular pump.(PRODUCT NEWS)
September 1, 2007... The STP-XA4503C turbomolecular pump is said to provide equipment manufacturers with the maximum available vacuum performance and smaller inlet port options. The pump is based on a new platform design with features to improve thermal management....

WEC filter.(PRODUCT NEWS)
September 1, 2007... The QuickChange ATE wet etch and clean filter is rated to 30nm retention and is a non-dewetting Teflon liquid filter. It is for sub-65nm road map applications in critical front-end cleans as well as a variety of wet etch and stripping...

Seal for PECVD process tools.(PRODUCT NEWS)
September 1, 2007... The Chemraz 513 Extensis seal provides an extended life for PECVD process tools and reduces equipment downtime. The involved manufacturing technology can make seals of practically limitless sizes. The seal's Dovetail cross-section design...

Liquid particle counters.(PRODUCT NEWS)
September 1, 2007... The NanoCount 50 is an ultra-small footprint liquid particle counter with a sensitivity of 50nm. The unit measures 9 x 6 x 9 in. and includes the sensor, counting electronics, and flow meter all housed in a NEMA rated enclosure. Lighthouse...

ArF and KrF scanners.(PRODUCT NEWS)
September 1, 2007... Two new lithography DUV scanners, the NSR-S310F ArF scanner and the NSR-S210D KrF scanner, are built on the Tandem Stage platform, which is said to enable productivity improvements and enhanced overlay performance. The S310F is an advanced ArF...

Pads for reduced defect levels.(PRODUCT NEWS)
September 1, 2007... The IC1000 AT defect reduction pad uses a patented groove design optimized for both wafer-scale and groove-scale fluid mechanics. The constant-area groove removes localized pressure on wafers to minimize scratches and defects. The IC1000 AT...

Data analysis software.(PRODUCT NEWS)
September 1, 2007... The Discover data analysis system provides capture and analysis of process performance information. It meets the needs of both process engineers requiring comprehensive methods of data analysis and operators that need to quickly and accurately...

Smart I/O module.(PRODUCT NEWS)
September 1, 2007... The 2612 smart I/O module allows for simultaneous measurement of up to four 350 strain gauges permodule.Twovoltage sense lines for the bridge input provide a true 6-wire measurement with 200nV resolution at a 6Hz rate. The micro-controller...

FT-IR metrology system.(PRODUCT NEWS)
September 1, 2007... The ECO 3500 FT-IR metrology system incorporates a Spartan equipment front-end solution from Asyst Technologies Inc., a spectrometer, and enhanced analytical software. An enhanced software interface provides full SEMI E95 compliant access. The...

Coat/develop track system.(PRODUCT NEWS)
September 1, 2007... The RF3S coat/develop track system delivers the technology and productivity requirements of 45nm and beyond immersion and dry lithography. It provides

Overlay control tool software.(PRODUCT NEWS)
September 1, 2007... The Vector Raptor (V R) software product is an overlay control tool that is designed to address problems introduced by double patterning and sub-45nm process node technology. VR provides an object-oriented, fully-interactive graphic interface...

Enabling yield at 45nm: managing process variability.(INDUSTRY FORUM)
September 1, 2007... With the industry moving toward manufacturing at the 45nm half-pitch, new strategies that go beyond the Bossung curve, first introduced in 1977, are required to ensure manufacturability. The issues emerging now are that VV the time to reach...

The great race: flash vs. magnetic storage.(Editorial)
September 1, 2007... Probably one of the most exciting technology races of all time is now underway, and all of us will benefit from the super efforts of both contenders. Unfortunately, most of us know little about the giant steps in technology that are making this...

What challenges remain to achieve heat-assisted magnetic recording?(HAMR)
September 1, 2007... OVERVIEW Hard-disk drive (HDD) technologists estimate that perhaps a factor of 1000 growth in a key data storage metric, areal density (AD), is possible, in principle, by cleverly engineering several candidate novel approaches to their...

Will the HDD market be swept by hybrid hard drives?(Portable Storage)
September 1, 2007... OVERVIEW Solid-state drives will have a very hard time competing against hard-disk drives because of their price difference, and the advent of the hybrid drive will make it even harder. Suddenly PC purchasers have four choices when...

Fab-wide process control needed for reduced disk drive magnetic spacing.(Cover Feature: HDD Slider Processing)
September 1, 2007... OVERVIEW There are several ways that improved process and metrology tools can reduce variation and improve the absolute value of the magnetic spacing in thin-film heads. Yet tighter tolerances also require careful attention to parameters...