Solid State Technology articles from October 2004

Solid State Technology archives from October 2004

Tomorrow's technologists.(Editorial)
October 1, 2004... It's no secret that most middle-school and high-school students in the US have little interest in math and science. Young people in this country simply do not view technology careers as "cool." In 2001, SEMI launched an innovative program to...

SIA charts 2H04 course, wary of inventories, utilization rates.(Business Trends)(Brief Article)
October 1, 2004... Solid but slowing global demand is in store for the semiconductor industry in 2H04, with the outlook very much dependent upon a continued rise in capacity utilization and chip inventories, according to the Semiconductor Industry Association...

Intel Corp.(Worldwide Highlights)(Brief Article)
October 1, 2004... Intel Corp. said it has finished installation of what it claims is the world's first pilot line for extreme-ultraviolet (EUV) lithography in an effort to move the technology out of R&D and on track for 32nm IC production by 2009. The integrated...

Infineon Technologies AG and Taiwan's Winbond Electronics Corp. have expanded their partnership for DRAM manufacturing to include 90nm DRAM trench technology and 300mm production processes.(Worldwide Highlights)
October 1, 2004... Infineon Technologies AG and Taiwan's Winbond Electronics Corp. have expanded their partnership for DRAM manufacturing to include 90nm DRAM trench technology and 300mm production processes. The two also will jointly develop and sell specialty...

ATMI Inc., Danbury, CT, is continuing its divestiture of noncore operations with the sale of its fabrication plant parts-cleaning business to Delaware-based Materials Support Resources Inc.(USA)
October 1, 2004... ATMI Inc., Danbury, CT, is continuing its divestiture of noncore operations with the sale of its fabrication plant parts-cleaning business to Delaware-based Materials Support Resources Inc. Terms of the deal, which includes operations at five...

Semiconductor Industry Association.(USA)(seeks proposals for study of cancer )(Brief Article)
October 1, 2004... The Semiconductor Industry Association (SIA) is soliciting proposals for an independent study of cancer risk among US semiconductor wafer-fab workers from the 1960s to the present. The study, reviewing data on more than 200,000 workers...

Renesas Technology Corp.(China)(Brief Article)
October 1, 2004... Japanese chipmaking JV Renesas Technology Corp. will spend [yen] 30 billion ($275.7 million) over the next three years to boost its presence in China, according to the Nihon Keizai Shimbun. About 60% of the investment will go to its chip...

Officials from the $1.5 billion Hong Kong Science and Technology Park say space has been filled to 75% capacity and by next year will be 100% filled, thanks to an influx of new tenants including Philips and Omron, and agreements with mainland chip-design centers, according to a story in The Standard.(Hong Kong)(Brief Article)
October 1, 2004... Officials from the $1.5 billion Hong Kong Science and Technology Park say space has been filled to 75% capacity and by next year will be 100% filled, thanks to an influx of new tenants including Philips and Omron, and agreements with mainland...

AMD.(India)(Brief Article)
October 1, 2004... AMD is set to begin operations in a new design facility in Bangalore, according to the Asia Pulse Businesswire. The 40,000 sq. ft. facility, part of a $5 million investment plan to triple AMD's domestic work force to 120 engineers by the end of...

NEC Electronics Corp. has consolidated the operations of its ULSI manufacturing engineering and advanced SoC line operating divisions under one roof.(Japan)(NEC Fabserve Ltd)(Brief Article)
October 1, 2004... NEC Electronics Corp. has consolidated the operations of its ULSI manufacturing engineering and advanced SoC line operating divisions under one roof. The new subsidiary, NEC Fabserve Ltd., located in Sagamihara, Japan, will offer advanced...

Creditors of South Korean chipmaker Hynix Semiconductor Inc. reportedly have approved plans for a $2.0 billion chipmaking operation in China, as part of a joint venture with STMicroelectronics and the Chinese government.(Korea)
October 1, 2004... Creditors of South Korean chipmaker Hynix Semiconductor Inc. reportedly have approved plans for a $2.0 billion chipmaking operation in China, as part of a joint venture with STMicroelectronics and the Chinese government. Under the plan,...

Powerchip Semiconductor Corp.(Taiwan)(Brief Article)
October 1, 2004... Powerchip Semiconductor Corp. plans to spend about $2 billion to build a third 300mm facility in Taiwan, according to a Dow ]ones report. The company already has one 300mm facility on-line and another under construction, with combined monthly...

United Microelectronics Corp.(Taiwan)(Brief Article)
October 1, 2004... Taiwan foundry United Microelectronics Corp. has unveiled an enhanced prototyping program for verification of SoC designs on its 130-90nm process technologies. The Shuttle Express, available by November, performs logic and/or design changes...

FEI Co.(Eurofocus)(Brief Article)
October 1, 2004... FEI Co., Hillsboro, OR, has opened a new facility in Eindhoven, The Netherlands, to focus on R&D for nanotechnology applications. The NanoPort center will be open to outside scientists and FEI developers to jointly research and develop nano...

Tokyo Electron Ltd.(Eurofocus)(signs research agreement with CEA Leti)(Brief Article)
October 1, 2004... Tokyo Electron Ltd. (TEL) and European research organization CEA Leti have agreed to jointly research and develop front-end-of-line CMOS process technology, focusing on new materials for CMOS gate stacks. The research, to be conducted at Leti's...

MEMS technology enables low-cost mini-SEM.(Technology News)(microelectromechanical systems)
October 1, 2004... Researchers from Horiba Ltd., Ulvac Inc., and Tokyo U. have developed a shoe-box sized scanning electron microscope that seems inexpensive to make, and uses low voltages that should not damage or build up charge on sensitive materials. Keys to...

IMEC launches three-pronged effort to replace embedded SRAM.(Technology News)(Interuniversity MicroElectronics Cente)
October 1, 2004... The IC industry is facing a major cache crunch. Embedded memory requirements for next-generation processors and system-on-chip (SoC) designs are expected to push far beyond the feasible limits of the venerable six-transistor SRAM and today's...

Customizing CMP.(Interconnect)
October 1, 2004... The increasing number of CMP consumables suppliers has led to many possible combinations of pads, copper, and barrier slurries. When packaged together in one process, these components must be compatible; however, the burden for ensuring such...

SOI wafers: fabrication techniques and trends.(silicon-on-insulator)
October 1, 2004... Introduced as an alternative CMOS technology in 1978, silicon-on-insulator (SOI) offered the potential for high speed, low power consumption, soft-error reduction, latch-up immunity, manufacturing process simplification, and improved scaling....

Nickel silicide formation using low-temperature spike anneal.(Thermal Processing)(Cover Story)
October 1, 2004... Overview The manufacture and future development of integrated circuits and devices face many technological challenges, some of which are materials-related, while others are related to process integration. This work presents an example of...

Monitoring Cu ECD using laser-based SAW measurements.(Metrology)(surface acoustic wave)
October 1, 2004... OVERVIEW An optical technique based on the laser generation of surface acoustic waves allows noncontact monitoring of electroplated copper thickness on product wafers. The technique is extended to monitor variations in copper resistivity...

Using tunable diode laser spectroscopy to detect trace moisture in ammonia.(Gases/Gas Handling)
October 1, 2004... OVERVIEW Detection of moisture contamination in hydride gases, such as ammonia used for epitaxial growth, has become a significant concern for manufacturers of III-V compound semiconductors. The presence of moisture in N[H.sub.3] can...

MEMS, head, and packaging applications using through-mask Cu deposition.(Deposition)(copper)
October 1, 2004... OVERVIEW Through-mask electrodeposition is receiving increased attention in microelectronic applications. The focus of this work was to develop a new copper bath and process for high-rate deposition, which meets the general process...

Handling reliability improves with in situ diagnostics.(Automation/Robotics/Wafer Handling)
October 1, 2004... OVERVIEW Wafer-handling systems in semiconductor process equipment can significantly limit overall tool reliability. Lack of objective, real-time measurements for mechanical performance and calibration of handlers can lead to unpredictable...

Implant tool shows flexibility in range.(Product News)
October 1, 2004... The second-generation Ultra tool family is an upgradeable suite of 200-300mm high current, low energy implant systems that can operate in a range of beam currents from 4.5-7mA, allowing users to select or upgrade beamlines based on...

Turbo pumps offer easy peripheral installation.(Product News)
October 1, 2004... The TPH 1201 turbo pump provides pumping at 1200 liter/see for [N.sub.2] and Ar throughput of 22mbar liter/sec. The TPH 2303 provides [H.sub.2] pumping at 1900 liter/see and heavy gas throughput at 2750sccm/mbar liter/see for nitrogen. Both...

System inspects up to 150wph.(Product News)
October 1, 2004... The WaferView 325 system provides automated detection and classification of yield-robbing defects on the front, back, and edge of 300mm wafers, replacing multiple inspection and review systems for lower cost-of-ownership. An onboard integrated...

PVD tool is convertible for 200/300mm applications.(Product News)
October 1, 2004... The Timaris 300mm physical vapor deposition (PVD) tool, developed for MRAM production, shows barrier repeatability/control down 0.1 [Angstrom] and 18wph throughput with two deposition modules. Each module can easily be converted for 200mm or...

Zenith Etch--integrated vacuum and abatement.(Product News)
October 1, 2004... Zendh Etch is an integrated vacuum and abatement system designed for dielectric etch applications. It is available with up to four EPX500Z Drypumps to meet the demanding requirements of 300 mm etch tools while offering reliability in a...

Power supply catalog.(Product News)
October 1, 2004... Comdel's new RF and DC power supply catalog covers a full range of RF generators in frequencies from 20 KHz to 80 MHz with selected topographies to 150 MHz and power levels from 100 to 100,000 Watts. Configurations include custom packaging for...

Pendulum control valve VAT Series 65.1.(Product News)
October 1, 2004... VAT's newest generation pendulum control valve for corrosive down-stream applications will on display at Semicon West. The Series 65.1 offers: extended control range; compact--control and isolation valve with integrated control until; high...

Tool mounted RF power.(Product News)
October 1, 2004... The compact CB series RF generators feature a solid-state design and proven Comdel RF amplifier technology providing precise and repeatable power control and low cost of ownership. The CB series is available in power ranges from 50 to 5000...

Reduce costs with free measurement and control designer CD.(Product News)
October 1, 2004... Up to 64 percent of your test and measurement application costs are spent on configuration and development time. In addition to hundreds of development resources, this FREE CD helps you select the best software and hardware for your system...

Residue remover.(Products)
October 1, 2004... Baker REZI-68 is an aqueous, post-ash residue remover that is effective for removing metal-organic residues and sidewall polymers from metal and via structures with a spray tool, bath system, or single-wafer toot. It operates at temperatures...

Brushes for CMP clean.(Literature showcase)
October 1, 2004... Planarcore[TM] PVA brushes utilize patented innovations in molded through-the-core design, eliminating PVA expansion, slippage, runout or nodule density change. The PVA brush core evenly distributes the flow throughout the length of the brush,...

Hydride gas purifiers.(Literature showcase)
October 1, 2004... Aeronex[R] SK Series hydride gas purifiers for compound and semiconductor applications eliminate impurities and remove moisture in ammonia to Mykrolis Tel. 877-695 7654 www.mykrolis.com www.aeronex.com Circle 240 ...

Disposable chemical filters.(Literature showcase)
October 1, 2004... QuickChange[R] disposable tilters are designed for use with any aqueous-based chemical. Shipped water-wet, they require no IPA prewetting procedures preventing alcohol/ chemical interaction. This avoids potential sources of contamination, and...

Chemical filter housing.(Literature showcase)
October 1, 2004... The space-saving Chemlock[TM] is available in two housing forms; PFA housing for high temperature and corrosive materials, and a new polypropylene housing for low temperature non-corrosive materials. Both housings permit faster, easier and...

4-in-1 failure system.(Literature showcase)
October 1, 2004... The Nanome|x high-powered, nanofocus, 4-in-1 failure analysis system performs nondestructive testing on complex semiconductor devices and integrated electronic assemblies, and is also suitable for micromechanics and material testing. The system...

Chip component trim system.(Literature showcase)
October 1, 2004... The TrimSmart W778 is a high-throughput laser trim system specifically for use in adjusting resistive values of current-generation thin-film chip resistors and resistor networks. The system uses a laser wavelength that produces a very low TCR...

Ion beam source.(Literature showcase)
October 1, 2004... The Diamonex G-2 CD source offers substrate cleaning, etching, ion-assisted deposition, and direct deposition in a high-current, low-energy, broad-beam source. It has a gridless design that provides high densities of low voltage ions without...

Benchtop x-ray system.(Literature showcase)
October 1, 2004... The Verifier benchtop x-ray system is an entry-level, low-cost, closed-cabinet solution with a 29x32in. footprint. The system is portable and has a 80kV, 33[micro]m microfocus x-ray tube, and is suited for inspection, failure analysis, and...

Specialty coating systems 1/30/03.(Literature showcase)
October 1, 2004... This literature features the new SCS G3 Spincoat Series. The spincoat models are available in 8, 12, and 15-inch programmable units and an 8-inch non-programmable unit. Models offer precision and program flexibility to meet customer...

New user guide for vibration control.(Literature showcase)
October 1, 2004... New User Guide from Kinetic Systems, Inc. for high performance vibration control equipment. The color catalog provides information and a selection process for Vibration Isolation Workstations, Optical Tables, Platforms, Islands, Mounts,...

POCO implant materials and components.(Literature showcase)
October 1, 2004... High performance ZEE implant components from Poco Graphite can improve implant yield and reduce cost of ownership by extending the source life, improving beam stability and reducing particles, POCO offers 3 additional graphite grades for use in...

Reliable and dust-free, dry vacuum.(Literature showcase)
October 1, 2004... The low cost XtraDry dry pump is designed to replace scroll pumps where reliability and contamination are a concern. XtraDry derivers high reliability, low particulate generation and reduced maintenance in a simple piston design. It features...

Automation solutions for semiconductor and flat panel display manufacturing.(Literature showcase)
October 1, 2004... Aerotech's new brochure presents solutions including planar air-bearing mechanics for smooth velocity control and superior dynamic geometric characteristics; linear, rotary, lift, and goniometric stages; and mechanics for clean room, vacuum,...

SHI APD cryopump advantage.(Literature showcase)
October 1, 2004... SHI Cryogenics Group offers a new brochure featuring APD cryopumps. The six page 3 panel brochure provides an overview of the features and benefits of APD Cry-opumps. Our engineers continue to explore the latest cryopump technology to provide...

TEC controller.(Literature showcase)
October 1, 2004... The Series 850 rack-mounted thermoelectric cooler (TEC) controller offers full PID linear temperature control coupled with autotuning to provide long-term temperature stability of Reference no. 410

Defect management software.(Literature showcase)
October 1, 2004... Klarity SSA (spatial signature analysis) software for use with defect management systems provides automated classification and root cause analysis of defect clusters and patterns to improve fab-wide process control. The software imports wafer...

Gas analysis system.(Literature showcase)
October 1, 2004... The TGA320 trace gas analyzer, a maintenance-free measuring system for continuous monitoring of ammonia concentration, incorporates Omnisens' laser-based photo acoustic detection system for a detection limit of 0.1ppb and a large dynamic range....

Wafer-carrier technology upgrade.(Literature showcase)
October 1, 2004... ViPRR II (variable input-pressure retaining ring) CMP wafer-carrier technology is now available for upgrade on IPEC 372 and 472 CMP platforms, offering edge exclusion to 3mm, controlled zone back pressure, gimbal technology that ensures optimal...

Integrated MEMS technology.(Literature showcase)
October 1, 2004... Nanomech technology integrates micro electromechanical systems (MEMS) elements with standard CMOS semiconductor processes for nonvolatile embedded memory products, as an alternative to standard embedded fuse, flash, and EEPROM designs. Memory...

Slide for linear motion apps.(Literature showcase)
October 1, 2004... The RGS 10000 slide builds on the original RGS 6000 platform, handling dynamic axial loads up to 100 lb. and speeds >60ips. The slide is compact, self-contained, and reportedly backlash and maintenance free, making it suitable for...

Multistage ejector pump.(Literature showcase)
October 1, 2004... The P2010 multistage ejector vacuum pump is suited for applications requiring light and reliable pick-ups. The pump measures only 1.08 in. high and weighs 0.54 oz., but can generate a vacuum of 24.9 inHg at a feed pressure of only 26psi,...

Remote plasma source.(Literature showcase)
October 1, 2004... The Litmas RPS 1501 is a fully integrated, remote, inductive plasma source and power delivery system that features a high-conductance, low surface-area, linear geometry. It is designed for wafer pre-clean, photoresist strip, and gate-dielectric...

Pinch valves for CMP.(Literature showcase)
October 1, 2004... Dymatrix PV Series pinch valves for CMP slurry applications feature a long-lasting tube material and innovative flow-through design that enable an extended life cycle (>2 million cycles) and eliminate stress and particle cohesion. The compound...

Calendar.(Calendar)
October 1, 2004... NOVEMBER 2004 9-12--electronica 2004--Munich, Germany. The show will feature the latest components, assemblies, electronic production. and photonics technologies, and various user forums, including "The World of MEMS." Info: For...

What's fueling the materials business? Solid State Technology asked materials experts to discuss the new dynamics driving the materials business.(Perspectives)
October 1, 2004... Continuing trends force materials suppliers to keep the lid on costs Lita Shon-Roy, John Housley, Steve Holland, Karey Holland, Techcet Group LLC, Genoa, NV Materials required for producing semiconductor devices are supported by a...