Solid State Technology articles from October 2003

Solid State Technology archives from October 2003

Time for enlightened self-interest?(semiconductor industry standards)(Editorial)
October 1, 2003... Chipmaking has been able to track Moore's "Law" since the 1960s because of the coordinated efforts of every part of the infrastructure, from wafermaking to patterning and lithography, and on to final test. Chris Mack of KLA-Tencor has pointed...

Second quarter offers some positive signs. (2003).(Business Trends)(Industry Overview)
October 1, 2003... Worldwide sales of both semiconductor chips and silicon wafers rose in 2Q03, according to data from the Semiconductor Industry Association (SIA) and Semiconductor Equipment and Materials International's (SEMI) Silicon Manufacturers Group. ...

Chartered Semiconductor, Singapore, IBM, and Infineon, Munich, Germany, are working together to develop an advanced foundry process at 65nm, with extensions down to 45nm.(Worldwide Highlights)(Brief Article)
October 1, 2003... Chartered Semiconductor, Singapore, IBM, and Infineon, Munich, Germany, are working together to develop an advanced foundry process at 65nm, with extensions down to 45nm. The work will utilize nearly 200 engineers from the three companies at...

STMicroelectronics and Texas Instruments, along with ARM and Nokia, are joining forces to promote open standards for mobile application processors.(Worldwide Highlights)(Brief Article)
October 1, 2003... STMicroelectronics and Texas Instruments, along with ARM and Nokia, are joining forces to promote open standards for mobile application processors. The Mobile Industry Processor Interface (MIPI) Alliance aims to develop specs for various...

International Sematech. (automated materials handling system qualified).(Worldwide Highlights)(Brief Article)
October 1, 2003... International SEMATECH (ISMT), Austin, TX, says its Advanced Technology Development Facility (ATDF) has successfully qualified a 4th-generation automated material handling system with overhead transport OHT and conveyor systems within a 300mm...

Advanced Micro Devices (AMD), Sunnyvale, CA, plans to acquire the information appliances unit of National Semiconductor. (California).(USA)(Brief Article)
October 1, 2003... Advanced Micro Devices (AMD), Sunnyvale, CA, plans to acquire the information appliances unit of National Semiconductor. Terms of the deal were not disclosed. AMD will assume command of National Semi's Geode family of microprocessors, targeted...

Honeywell is seeking an injunction to put on hold Air Products' recent $300 million acquisition of Ashland's chemicals business.(USA)(Brief Article)
October 1, 2003... Honeywell is seeking an injunction to put on hold Air Products' recent $300 million acquisition of Ashland's chemicals business. Honeywell claims the purchase violates a strategic alliance between Air Products and GEM Microelectronic Materials,...

Raytheon, Lexington, MA, and IBM, Armonk, NY, have announced a deal to design and market systems for the aerospace and defense industries. (Massachusetts, New York).(USA)(Brief Article)
October 1, 2003... Raytheon, Lexington, MA, and IBM, Armonk, NY, have announced a deal to design and market systems for the aerospace and defense industries. The deal, worth up to $100 million over five years, partners IBM's custom chip and chip system design...

Qualcomm has filed a complaint against Texas Instruments, alleging that the chipmaker violated a December 2002 patent agreement over wireless semiconductor technology.(USA)(Brief Article)
October 1, 2003... Qualcomm has filed a complaint against Texas Instruments, alleging that the chipmaker violated a December 2002 patent agreement over wireless semiconductor technology. Qualcomm won't say specifically what patents are at stake, but TI has stated...

Vitesse Semiconductor Corp., San Jose, CA, has agreed to sell its Optical Systems Division to Avanex Corp., Fremont, CA, a developer of photonic processing subsystems, in an all-stock deal worth approximately $5.9 million. (California).(USA)(Brief Article)
October 1, 2003... Vitesse Semiconductor Corp., San Jose, CA, has agreed to sell its Optical Systems Division to Avanex Corp., Fremont, CA, a developer of photonic processing subsystems, in an all-stock deal worth approximately $5.9 million. As part of the deal,...

Sipex Corp., Milpitas, CA, has signed a deal with PolarFab, a Bloomington, MN, foundry, to produce its high-end power management and interface products, as well as wafers for Silex's photo detector DVD products. (California, Minnesota).(USA)(Brief Article)
October 1, 2003... Sipex Corp., Milpitas, CA, has signed a deal with PolarFab, a Bloomington, MN, foundry, to produce its high-end power management and interface products, as well as wafers for Silex's photo detector DVD products. PolarFab also will add extra...

Hynix Semiconductor. (tariff on dynamic random access memory chips).(Eurofocus)(Brief Article)
October 1, 2003... The European Union has imposed a five-year, 34.8% tariff on Hynix Semiconductor's DRAM chips, fulfilling promises to penalize the company for alleged subsidies received by the South Korean government. Of 15 EU member nations, only France and...

ARM, Cambridge, England, and Axis Systems, Sunnyvale, CA, have signed an agreement to develop a fully integrated, system-level verification flow for ARM cores and the ARM PrimeXsys platform. (California).(Eurofocus)(Brief Article)
October 1, 2003... ARM, Cambridge, England, and Axis Systems, Sunnyvale, CA, have signed an agreement to develop a fully integrated, system-level verification flow for ARM cores and the ARM PrimeXsys platform. By the agreement, Axis will further integrate ARM...

ASM International, Amsterdam, The Netherlands, plans to relocate its R&D facilities from Espoo, Finland, to the University of Helsinki, where the two organizations will jointly develop atomic layer deposition technologies. (research and development).(Eurofocus)(Brief Article)
October 1, 2003... ASM International, Amsterdam, The Netherlands, plans to relocate its R&D facilities from Espoo, Finland, to the University of Helsinki, where the two organizations will jointly develop atomic layer deposition technologies. The move, scheduled...

Infineon, Munich Germany, plans to contract with Semiconductor Manufacturing International Corp. (SMIC) to manufacture memory chips with 0.11[micro]m processes, according to wire reports and the Taiwan Economic News.(Eurofocus)(Brief Article)
October 1, 2003... Infineon, Munich Germany, plans to contract with Semiconductor Manufacturing International Corp. (SMIC) to manufacture memory chips with 0.11[micro]m processes, according to wire reports and the Taiwan Economic News. SMIC will use 193nm...

Royal Philips Electronics. (new low temperature polysilicon modules).(Eurofocus)(Brief Article)
October 1, 2003... Royal Philips Electronics, Amsterdam, The Netherlands, has added to its line of active matrix liquid crystal display technology geared towards the next generation of mobile phones. The new low-temperature polysilicon (LTPS) module integrates IC...

Eupec Hungaria. (investment plans).(Eurofocus)(Brief Article)
October 1, 2003... Semiconductor manufacturer Eupec Hungaria will invest approximately $8.6 million to build new facilities and raise capacity. The company has also received more than $400,000 in government grants for the project, which will employ 120 people and...

Suzhou He Jiang. (production volume plans).(China)(Brief Article)
October 1, 2003... Suzhou He Jiang, a mainland Chinese chipmaker, was planning for volume production in September for its 8-in. wafers made with a 0.181[micro]m process, according to local reports. The company, headed up by former UMC execs, projects an increased...

Siemens AG will invest $30 million to expand manufacturing at its mobile communications factory in Shanghai.(China)(Brief Article)
October 1, 2003... Siemens AG will invest $30 million to expand manufacturing at its mobile communications factory in Shanghai. The facility, run with partners China Mobile and China Unicorn, is the second production location for Siemens' third-generation...

Royal Philips Electronics NV, Amsterdam, The Netherlands, and Advanced Semiconductor Manufacturing Corp. (ASMC) have expanded their joint venture to include a new $687 million semiconductor manufacturing facility, according to Dow Jones.(China)(Brief Article)
October 1, 2003... Royal Philips Electronics NV, Amsterdam, The Netherlands, and Advanced Semiconductor Manufacturing Corp. (ASMC) have expanded their joint venture to include a new $687 million semiconductor manufacturing facility, according to Dow Jones. The...

Amkor Technology, Chandler, AZ, and United Test and Assembly Center Ltd. (UTAC), Singapore, will join forces to offer assembly and test products and services to wafer foundries and IDMs in China. (Arizona).(China)(Brief Article)
October 1, 2003... Amkor Technology, Chandler, AZ, and United Test and Assembly Center Ltd. (UTAC), Singapore, will join forces to offer assembly and test products and services to wafer foundries and IDMs in China. UTAC will locate its China test center within...

Credence Systems Corp., Hillsboro, OR, and the Hong Kong Science and Technology Parks Corp. are partnering to establish a probe and test development center. (Oregon).(China)(Brief Article)
October 1, 2003... Credence Systems Corp., Hillsboro, OR, and the Hong Kong Science and Technology Parks Corp. are partnering to establish a probe and test development center. The facility, scheduled to open by the end of 2003, will offer test program...

Agilent Technologies. (engineering test and education center, Beijing, China).(China)(Brief Article)
October 1, 2003... Agilent Technologies, Palo Alto, CA, and the microelectronics department at Peking University have opened an engineering test and education center for system-on-chip designs. The centers will house research projects supporting three...

Taiwan Semiconductor Manufacturing Corp. (volume production to begin in 2004 in Shanghai, China).(China)(Brief Article)
October 1, 2003... Taiwan Semiconductor Manufacturing Corp. (TSMC) says it will begin volume production of 8-in. wafers at its Shanghai facility by 2004, according to a report in Interfax. Construction and equipment move in will be completed by the end of next...

Si-Soft. (research and development center, Hsinchu, Taiwan).(Taiwan)(Brief Article)
October 1, 2003... Officials in Hsinchu City, Taiwan, have officially opened a research & development center for Si-Soft, part of a nationwide project aimed at increasing the company's profile in semiconductor production and design. The center, which will house...

ChipMOS Technologies has signed an agreement to provide wafer testing and IC assembly and testing services to Renesas, Hsinchu, Taiwan. (integrated circuits).(Taiwan)(Brief Article)
October 1, 2003... ChipMOS Technologies has signed an agreement to provide wafer testing and IC assembly and testing services to Renesas, Hsinchu, Taiwan. The deal covers Renesas' mobile memory chips for use in handheld devices, and low-power memory chips for...

Barcelona Design, a Newark, CA, provider of analog synthesis technologies, has formed a partnership with UMC.(Taiwan)(Brief Article)
October 1, 2003... Barcelona Design, a Newark, CA, provider of analog synthesis technologies, has formed a partnership with UMC to develop synthesizable phase-locked-loop and analog-to-digital converter technologies for UMC's 0.18[micro]m, 0.15[micro]m, and...

Intel. (research and design center to be built in Taipei, Taiwan).(Taiwan)(Brief Article)
October 1, 2003... Intel will build a $8.7 million R&D center in Taipei, adding to the company's existing application design center. CEO Craig Barrett announced the development plans for the new Innovation Center, which complements other R&D facilities in China...

Advantest. (production line consolidation continues).(Japan)(Brief Article)
October 1, 2003... Advantest, Tokyo, Japan, planned to finish consolidating its production lines to a single location in Saitama Prefecture by September. The company says the moves will shorten lead times for semiconductor-testing equipment from 3-4 months to 2...

Canon. (next generation stepper development).(Japan)(Brief Article)
October 1, 2003... Canon plans to invest 100 billion yen ($851.6 million) to develop next-generation steppers using 60nm processes, according to the Nihon Keizai Shimbun. The company will add 300 employees for the project, scheduled to be completed by 2005. Canon...

Elpida Memory, Tokyo, Japan, a DRAM JV between NEC and Hitachi, was planning to take over NEC's production facility in Hiroshima as a wholly-owned subsidiary by September 1.(Japan)(Brief Article)
October 1, 2003... Elpida Memory, Tokyo, Japan, a DRAM JV between NEC and Hitachi, was planning to take over NEC's production facility in Hiroshima as a wholly-owned subsidiary by September 1. Hiroshima Elpida Memory Inc. will lease equipment and receive nearly...

Powerchip Semiconductor Corp.(Japan)(Brief Article)
October 1, 2003... In other news, Elpida and Powerchip Semiconductor Corp., Hsinchu, Taiwan, have extended a previous agreement to exchange foundry services for chip manufacturing processes. Powerchip will implement Elpida's 0.10[micro]m and 0.09[micro]m...

Hynix Semiconductor.(Korea)(to immediately ramp up production of its new 500MHz 256Mbit DDR SDRAM chips)(Brief Article)
October 1, 2003... Hynix Semiconductor, Seoul, Korea, says it will immediately ramp up production of its new 500MHz 256Mbit DDR SDRAM chips, built on the company's 0.13[micro]m processes. The memory devices are targeted at gamers, who tend to require higher...

Silicon Storage Technology Inc. (SST).(Malaysia)(Brief Article)
October 1, 2003... Silicon Storage Technology Inc. (SST), Sunnyvale, CA, has entered into an agreement with Malaysian foundry 1st silicon to license SST's 0.25[micro]m SuperFlash technology. The foundry will use the technology for manufacturing embedded flash...

The Semiconductor Complex Ltd. (SCL).(India)(Brief Article)
October 1, 2003... The Semiconductor Complex Ltd. (SCL) can now boast India's first facility built specifically to produce micro-electro mechanical systems (MEMS). The company's facility in Mohali was chosen as the national foundry for MEMS by the National...

United Microelectronics Corp. (UMC) says it will buy Infineon's 30% stake in their chip manufacturing joint venture for between $100 million and $130 million, giving it 80% ownership in the 12-in. lab in Singapore.(Singapore)(Brief Article)
October 1, 2003... United Microelectronics Corp. (UMC) says it will buy Infineon's 30% stake in their chip manufacturing joint venture for between $100 million and $130 million, giving it 80% ownership in the 12-in. lab in Singapore. UMC's cumulative investment...

Kulicke & Soffa.(Middle East)(Brief Article)
October 1, 2003... Kulicke & Sofia, Willow Grove, PA, has agreed to sell its sawing equipment and hard material blades operations in Israel to unnamed third parties. The company says its Semitec dicing blades business in Santa Clara, CA, is not for sale. The...

Tower Semiconductor.(Middle East)(Brief Article)
October 1, 2003... Tower Semiconductor, Migdal Haemek, Israel, says it has received $2.5 million from wafer and financial partners towards its Fab 2 project, and received a commitment for another $20.4 million. Under the financing deal, Tower will distribute over...

Tungsten emitters modify Planck's law.(Technology News)
October 1, 2003... Researchers at Sandia National Laboratories, Albuquerque, NM, have shown that tungsten lattice filaments when heated emit remarkably more energy in the near-infrared range than solid tungsten filaments. Currently, the output is keyed to the...

APC and e-Diagnostics with SECS.(Technology News)
October 1, 2003... As a subcontractor to a NIST project, Cimetrix, Salt Lake City, UT, has signed on to enable connectivity that will help shake out new equipment data acquisition (EDA) standards. Dating from late 2001, NIST "e-Manufacturing Security Framework to...

An ALD with CVD throughput?(Technology News)
October 1, 2003... What do you do when you have two conflicting requirements in ALD processing--throughput and maintainability--but only one process knob: residence time (the time that a flowing gas spends inside the chamber)? You develop a second process knob,...

Photoblanks for advanced lithography.(Front End Of Line)
October 1, 2003... Photomask specifications for advanced KrF and ArF lithography tools require improvements in both glass substrate quality and coating development. These improvements are being driven by several factors, including the demanding CD requirements of...

Successful use of low-k films requires measuring Young's modulus.(Interconnect)
October 1, 2003... IC manufacturers switching over to low-k interlevel dielectric (ILD) materials from Si[O.sub.2] and fluorinated silica glass (FSG) have encountered a variety of problems, including delamination, peeling, and cracking. Many of these arise from...

Sub-100nm interconnects using multistep plating.(Cover Article)
October 1, 2003... OVERVIEW Electroplating sub-100nm Cu interconnects using large electrolyte baths faces limitations in the area of defect control repeatability and gap-fill consistency. A modular plating cell design with an independent electrolyte...

Challenges in gate stack engineering.(Device Scaling)
October 1, 2003... OVERVIEW The rapid scaling requirements projected by the International Technology Roadmap for Semiconductors (ITRS) pose several key challenges that are very much dependent on device application. Though progress has been made in the areas...

Planarizing difficult topographies using contact planarization.(Planarization)
October 1, 2003... OVERVIEW Chemical mechanical planarization has the ability to planarize interlayer dielectric layers, tungsten layers, and even metal layers of aluminum and copper to adequately meet current industry needs. However, its compatibility with...

Phase-shifting methods at 65nm: a comparison of AAPSM and CLM.(Lithography)(alternating aperture phase-shift mask)
October 1, 2003... OVERVIEW Traditionally, the shrink of semiconductor IC devices has been enabled primarily through the reduction of the exposure wavelength. Optical lithography capabilities, however, have been extended to the sub-100nm regime through heavy...

Novel technology for handling very thin wafers.(Automation/Robotics/Wafer Handling)
October 1, 2003... OVERVIEW Increasing use of very thin, flexible wafers for IC manufacturing brings with it extremely challenging automated handling problems. Individually, vacuum--or Bernoulli-based end-effectors cannot solve all problems. But the...

Using numerical simulation to optimize 300mm FOUP purging.(Vacuum Technology/Applications)(front-opening unified pods)
October 1, 2003... OVERVIEW The front-opening unified pod is synonymous with 300mm wafer handling and contamination control. However, simple intuitive purging of these pods apparently does not provide wafer cleanliness compatible with high yields. Rigorous...

Metal deposition in power semiconductors.(Deposition)
October 1, 2003... OVERVIEW Among transistor manufacturers, perhaps the main measure of technical excellence is [RDS.sub.ON], the resistance of the transistor in its on state. This value needs to be as low as possible to improve current carrying capability,...

Meeting industry needs with laser micromachining.(Assembly/Packaging)
October 1, 2003... OVERVIEW Laser micromachining is just beginning to be used in semiconductor manufacturing. Some of the more applicable areas are found in assembly and packaging. As the benefits become more apparent for this arena, laser processing will...

Plasma treatment system offers flexible gas dynamics.(Product News)
October 1, 2003... The FlexTRAK automated plasma system is capable of both direct and downstream ion-free plasma processing for treating a broad range of semiconductor devices. The FlexTRAK is a high-throughput plasma system with flexible gas dynamics, and is...

Ion implanters can process 300 wafers/hr.(Product News)
October 1, 2003... Three additions to the VIISta single wafer platform of ion implanters can process more than 300 wafers/hr. VIISta 80HP high-current, VIISta 810EHP medium-current, and VIISta 3000HP high-energy tools drive down cost of ownership due to their...

Diaphragm valves meet ultrahigh-purity standard.(Product News)
October 1, 2003... DRP series ultrahigh-purity fluoropolymer diaphragm valves meet or exceed SEMI Standard F57-0301 for ultrahigh-purity polymer system components. DRP series valves are now available with a multi-turn, manually adjustable actuator for precise...

Metrology system measures both linewidth and overlay dimensions.(Product News)
October 1, 2003... The INNOVA 200 metrology system measures alignment between layers on shrinking wafer geometries. INNOVA 200 measures both linewidth and overlay dimensions, making it especially effective in determining overlay alignment. This system also offers...

VAT, Inc. product line brochure.(Literature Showcase)
October 1, 2003... VAT's newest product line brochure profiles the most extensive line of vacuum valves manufactured today. VAT offers 1,000+ standard valves for a wide variety of applications. VAT combines innovation, state-of-the-art Manufacturing, quality...

Etch, develop, clean-100.(Literature Showcase)
October 1, 2003... Provides an affordable solution for many solvent--and aqueous-based applications. Features an all-Teflon[R] fluid path with manifold mounted valves and a digital process controller w/twenty 51 or fifty 20 step programs. Includes Adjustable...

Stackable clean process ovens.(Literature Showcase)
October 1, 2003... This compact design allows two or three ovens to be stacked on top of one another, saving floor space, while still maintaining ergonomically acceptable loading heights. Units are available with or without HEPA filtration for operating...

Free Catalog CD fluid filtration, purification and process control.(Literature Showcase)
October 1, 2003... Microelectronics Catalog CD-ROM provides 400+ pages covering the full range of Mykrolis products. Includes components and subsystems for liquid and gas delivery, filtration, purification, vacuum measurement and process control that are critical...

Scanner for 80nm devices.(Products)
October 1, 2003... The NSR-S307E ArF scanner is targeted for mass production of advanced 80nm devices and development of 65nm devices. This system combines a 0.85 NA projection lens with a newly developed, high-production platform, which improves resolution and...

High-performance polyimide brochure.(Literature Showcase)
October 1, 2003... Brochure describes Pyropel HD high-purity thermoset polyimide plastic, ideal for components subject to high temperatures or chemical attack. Pyropel HD meets semiconductor outgassing and ionic purity requirements and offers engineering plastic...

Delta F oxygen analyzers.(Literature Showcase)
October 1, 2003... The Nano Trace II Oxygen Analyzer features a 75 parts per trillion LDL. With minimal required maintenance, the 0-2 parts per billion range output can continuously follow the oxygen contaminants in the system. The addition of logging...

All-new TALON.(Literature Showcase)
October 1, 2003... Cee[TM], a division of Brewer Science, introduces the most flexible coat/ develop/bake/chill tool in it's class. Industry leading uniformity. Non-linear processing plus dispense and configuration options for MEMS configurability. Multi-axis...

2003 optics catalog.(Literature Showcase)
October 1, 2003... Edmund Optics' new 2003 catalog contains over 10,000 products, including over 300 new products ranging from crystalline optics to elliptical beamsplitters to motion meter cameras. Choose from our extensive inventory or work with our engineers...

Subscribe to National Instruments newsletters.(Literature Showcase)
October 1, 2003... Packed full of product information, industry news, and customer application successes, NI gives you valuable technical information for creating your measurement and automation solution based on industry-standard technology. For your FREE...

On-Tool Dry Pump(tm).(Literature Showcase)
October 1, 2003... The On-Tool Dry Pump[TM] is an innovative, compact dry vacuum pump that mounts directly to a semiconductor process tool. Offering up to 100 [m.sup.3]/h pumping speed, the On-Tool Dry Pump is one of the smallest dry pumps in the industry,...

Specialty coating systems 1/30/03.(Literature Showcase)
October 1, 2003... This literature features the new SCS G3 Spincoat Series. The spincoat models are available in 8, 12, and 15-inch programmable units and an 8-inch non-programmable unit. Models offer precision and program flexibility to meet customer...

Helium leak detector.(Products)
October 1, 2003... The UL5000 helium leak detector provides testing flexibility, high sensitivity, and fast response leak testing results in the low minimum sensitivity ranges. Designed for high efficiency in the fab for testing components, subassemblies, large...

Lithography source.(Products)
October 1, 2003... This Collimated Plasma Lithography (CPL) source is provided by a laser-produced plasma x-ray. The x-ray point source uses patented Brite-light high-power, picosecond-class, diode pumped solid-state lasers to bombard a copper tape and generate...

Wafer probe station upgrade.(Products)
October 1, 2003... The Summit B series of 200mm semiautomatic and manual summit probe stations are an upgrade to existing Summit 11000 and 12000 series, and provide new probing capability and improved usability. All Summit B stations can be upgraded in the field;...

ProChem, Inc.(Products)
October 1, 2003... ProChem, Inc. is pleased to announce the release of its new Research Chemicals catalog. The catalog contains over 2500 chemical products ranging from pure elements, alloys, ACS reagents, standardized solutions, solvents, rare-earths, ultrapure...

Nanomanipulation and scanning stages.(Product News)
October 1, 2003... PicoCubes are small, multi-axis, closed-loop, piezo nanomanipulation and scanning stages for applications including nanotechnology, semiconductor, and data storage test equipment. P-363 PicoCube xy and xyz piezo stages are ultra-high...

Soft wall cleanrooms.(Product News)
October 1, 2003... Series 575 softwall cleanrooms provide a free standing cleanroom environment for Class 100,000 to Class 10, and can provide open spans up to 32 ft. with no center supports. Units come complete with motorized ceiling HEPA filters, lights, a...

30mm motors.(Product News)
October 1, 2003... RE30 motors use powerful rare earth magnets to maximize torque available in a 30mm diameter package. A patented rhombic moving coil design provides for long life, low electrical noise, fast acceleration, and high efficiency. Maximum efficiency...

Air-bearing wafer-positioning system.(Products News)
October 1, 2003... The DynamYX GT 300mm air-bearing wafer positioning system offers high throughput and flexibility through six axis of precision motion control, including an integrated three axis tip/tilt stage. The stage is constructed of silicon carbide, with...

Ellipsometry system.(Product News)
October 1, 2003... The ultra-II fifth-generation focused beam ellipsometry system delivers measurement accuracy, long-term reproducibility, and tool-to-tool matching needed for process control measurements in manufacturing at 90nm and 65nm processing nodes. For...

High-speed laser twin sensor.(Product News)
October 1, 2003... The LTS is a long-range laser twin sensor that tracks object displacements or running profiles at high speeds up to 200kHz. Applications include measuring of surface roughness and thickness of thin coatings. Thickness variations as fine as...

Cross roller translation stages.(Product News)
October 1, 2003... These lines of 1.75--and 2.62-in. cross roller translation stages are rated for over 100 million in. of travel at the specified load, which is claimed to be 10x that of comparable ball bearings. Applications include microscopy, machine vision...

Particle detection system for reticles.(Product News)
October 1, 2003... Pollux is a particle detection system for reticles that can be positioned in each critical area of the tab to requalify reticles. Risk of contamination can be minimized because reticles do not have to be transported to a central area for...

Micro test equipment.(Product News)
October 1, 2003... The model 5848 Micro-Tester is for testing micro-electronic devices, MEMS, photonic, and other small components. The 5848 provides load and displacement measurement capability combined with good cyclic performance. Applications include...

Retrofit kit for wafer ID.(Product News)
October 1, 2003... The In-Sight 1700 series prober retrofit kit features In-Sight 1700 series wafer readers, which read alphanumeric and 2-D matrix codes for the purpose of tracking wafers through production processes. The kit comes with all hardware, software,...

Ink jet nozzle, high precision laser drilling services.(Product News)
October 1, 2003... These ink jet nozzles and other high-precision laser drilling services in polymers, glass, ceramics, sapphire and metals are achieved using UV DPSS lasers with one hole at a time drilling at a high repetition rate, or parallel processing of...

High throughput, high precision tool addresses 90nm technology.(Product News)
October 1, 2003... The NRM-3100 high throughput, high precision metrology tool is designed to accommodate the 90nm lithography node and beyond. It is designed to measure lithographic exposure overlay precision with respect to the previous exposure layer. The...

High sensitivity liquid optical particle counter.(Product News)
October 1, 2003... The HSLIS series of in situ liquid optical particle counters, used for measuring filter efficiency and particulate contamination in ultra-pure water and process chemicals, now comes with Ethernet capability, which can lower overall costs by...