Solid State Technology articles from May 2004

Solid State Technology archives from May 2004

Clarifications.(Correction Notice)
May 1, 2004... The April 2004 European Technology cover of Solid State Technology showed the Omega DSi system for deep silicon etching. (Photo courtesy of Trikon Technologies) The corrected p. 78 of Solid State Technology's 2004 Resource Guide is shown...

How can companies foster innovation?(Editorial)
May 1, 2004... Corporate executives load up on stock options, especially in high tech companies, hoping that future sales of their companies' products--or the company itself--will make them super rich. Meanwhile, the scientists and engineers back in the labs...

Business trends.(World News)
May 1, 2004... VLSI: Global equipment orders show an Asian flavor Worldwide manufacturers of semiconductor equipment followed up their banner year in 2003 right where they left off, showing "surprisingly strong" sales in the typically slow January...

IBM and Chartered have expanded their 90nm collaboration to include a "cross-foundry design enablement" program to support 90nm chip development.(Worldwide Highlights)(Brief Article)
May 1, 2004... IBM and Chartered have expanded their 90nm collaboration to include a "cross-foundry design enablement" program to support 90nm chip development. The deal, building upon existing joint development agreements, initially involves incorporating...

Samsung Electronics has joined a trio of chipmakers to focus on development of 65nm and 45nm CMOS logic processes.(USA)(Brief Article)
May 1, 2004... Samsung Electronics has joined a trio of chipmakers to focus on development of 65nm and 45nm CMOS logic processes. IBM, Chartered, and Infineon announced last fall their joint efforts on the project, centered at IBM's 300mm Advanced...

Applied Materials, Santa Clara, CA, and French substrate provider Soitec have signed a deal to jointly develop germanium-on-insulator (GeOI) and other Ge-based processes for the 45nm node and beyond.(Brief Article)
May 1, 2004... Applied Materials, Santa Clara, CA, and French substrate provider Soitec have signed a deal to jointly develop germanium-on-insulator (GeOI) and other Ge-based processes for the 45nm node and beyond. The deal will combine Soitec's Smart Cut...

Matsushita Electric Industrial Co. Ltd.(Asia Focus)(Brief Article)
May 1, 2004... Japan's Matsushita Electric Industrial Co. Ltd. reportedly will invest [yen] 120 billion ($1.1 billion) over the next three years to boost its China operations. The company, which recently announced plans to add a [yen] 130 billion ($1.21...

Shanghai Huahong NEC Electronics Co.(Asia Focus)(boost chip capacity)(Brief Article)
May 1, 2004... Shanghai Huahong NEC Electronics Co. plans to boost chip capacity by 25% to 40,000 wafers/month in 2004, and up to 100,000 wafers/month in the next three years, with funding from an upcoming IPO.

Fujitsu Ltd.(Japan)(Brief Article)
May 1, 2004... Fujitsu Ltd. is planning to build a new 300mm plant at its existing Facility in Tado, Mie prefecture, with production capability of 10,000 wafers/month by spring 2005. The $1.46 billion facility will incorporate 90nm and 65nm process...

Renesas Technology Corp. has filed a complaint in Tokyo District Court against Nanya Technology Corp.'s Japan subsidiary, alleging misuse of two memory-related patents.(Brief Article)
May 1, 2004... Renesas Technology Corp. has filed a complaint in Tokyo District Court against Nanya Technology Corp.'s Japan subsidiary, alleging misuse of two memory-related patents. The suit follows a similar complaint Renesas filed in the US in December...

Toshiba Corp.(Japan)(Brief Article)
May 1, 2004... Former Toshiba Corp. engineer Fujio Masuoka has filed a suit in the Tokyo District Court seeking [yen] 1 billion ($9.2 million) from his former employer for his contributions toward the creation of flash memory. Earlier this year, the same...

Virage Logic has signed a licensing deal with Korean foundry DongbuAnam Semiconductor for its 130nm CMOS processes, the technology's first commercial IP support.(Korea)(Brief Article)
May 1, 2004... Virage Logic has signed a licensing deal with Korean foundry DongbuAnam Semiconductor for its 130nm CMOS processes, the technology's first commercial IP support. Under the deal, DongbuAnam customers using Virage's 180nm-process memory IP also...

The Korean government plans to invest 180 billion won ($153 million) to build a pair of nanotechnology centers over the next five years, according to the Ministry of Commerce, Industry, and Energy.(Korea)(Brief Article)
May 1, 2004... The Korean government plans to invest 180 billion won ($153 million) to build a pair of nanotechnology centers over the next five years, according to the Ministry of Commerce, Industry, and Energy. The plan calls for selection of business...

Intel.(Korea)(R&D center to work with the Ministry of Information and Communication and the Electronics and Telecommunications Research Institute)(Brief Article)
May 1, 2004... Intel has established an R&D center in Seoul, South Korea, to work with the Ministry of Information and Communication and the Electronics and Telecommunications Research Institute, on development of wireless communications and digital home...

Malaysian-American Electronics Industry Group.(Malaysia)(exports )(Brief Article)
May 1, 2004... Electronics exports grew 13.8% in 2003 to $15.2 billion, and are expected to grow another 23% in 2004, thanks to increased demand for communications gear and computers as well as stabilizing chip ASPs. The Malaysian-American Electronics...

Malaysia reportedly is planning to export the "MM" chip, about 5x smaller than conventional RFID chips, by the end of 2004.(Malaysia)(Brief Article)
May 1, 2004... Malaysia reportedly is planning to export the "MM" chip, about 5x smaller than conventional RFID chips, by the end of 2004. The Malaysian government purchased the technology from Japanese semiconductor developer FEC Inc. in September 2003. The...

UMCi, the Singapore-based 300mm fab of United Microelectronics Corp. (UMC), said it has started volume production with "good wafer yields" of copper interconnect-based chips for FPGA and wireless communications.(Singapore)(Brief Article)
May 1, 2004... UMCi, the Singapore-based 300mm fab of United Microelectronics Corp. (UMC), said it has started volume production with "good wafer yields" of copper interconnect-based chips for FPGA and wireless communications. The company installed back...

UMC has agreed to buy the chipmaking unit of Silicon Integrated Systems Corp. (SiS) for $321 million.(Taiwan)(SiS Microelectronics Corp)(Brief Article)
May 1, 2004... UMC has agreed to buy the chipmaking unit of Silicon Integrated Systems Corp. (SiS) for $321 million. SiS Microelectronics Corp., spun off in December 2003 with a 200mm factory and capital of about $240.5 million, will turn its energies toward...

Investments in TFT-LCD will rise 5% in 2004 to top $9.2 billion, overtaking semiconductors as Taiwan's fastest growing and most profitable sector in the next five years, according to the Ministry of Economic Affairs (MOEA).(Taiwan)(Brief Article)
May 1, 2004... Investments in TFT-LCD will rise 5% in 2004 to top $9.2 billion, overtaking semiconductors as Taiwan's fastest growing and most profitable sector in the next five years, according to the Ministry of Economic Affairs (MOEA). Six of the world's...

Infineon Technologies AG.(joined the X Initiative promoting the new X-architecture chip design process)(Brief Article)
May 1, 2004... Infineon Technologies AG, Germany, has joined the X Initiative, a semiconductor supply-chain consortium promoting the new X-architecture chip design process, and has successfully fabricated a 130nm test chip. The X-architecture orients a chip's...

Royal Philips Electronics of The Netherlands and Japan's Matsushita Electric Industrial have joined IMEC's sub-45nm CMOS research program.(Eurofocus)(Brief Article)
May 1, 2004... Royal Philips Electronics of The Netherlands and Japan's Matsushita Electric Industrial have joined IMEC's sub-45nm CMOS research program. Matsushita and IMEC had been jointly developing high-k gate stacks for the sub-65nm node; Philips is...

A new research consortium aims to study polymer-based electronics with an eye toward integrated consumer electronics.(Eurofocus)
May 1, 2004... A new research consortium aims to study polymer-based electronics with an eye toward integrated consumer electronics. The PolyApply project, spearheaded by France's STMicroelectronics along with 20 partners from European industries and research...

Software uses lens aberrations to enhance images.(Technology News)
May 1, 2004... Lithographers have fought long and hard to diminish the unwanted effects of lens aberrations on optical imaging in advanced semiconductor processes, but Nikon Corp. is using software to reverse this situation. The company is selectively using...

Immersion litho hot topic at SPIE.(Technology News)
May 1, 2004... Dominating many of the presentations and discussions at this year's Microlithography Symposium and Exhibition was immersion lithography. Thus far, no "show-stopper" has emerged that would prevent further development and eventual production use...

Creating a better mass flow meter.(Front End Of Line)
May 1, 2004... The mass flow meter (MFM), in its current design, is good but has limitations--especially as process requirements change. Standard configurations in MFM designs are being challenged by a need to provide more reliable and accurate readings in...

A vacuum roll-to-roll process for manufacturing OLEDs.(Flat-Panel Displays)(organic light-emitting diode)
May 1, 2004... There is a transformation brewing in the world of flat-panel displays driven by a new solid-state device called organic light-emitting diode (OLED). Because these devices produce light, rather than reflect or transmit it, they have the...

USJ formation: annealing beyond 90nm.(Thermal Processing)(ultrashallow junctions)(Cover Story)
May 1, 2004... OVERVIEW The formation of ultrashallow junctions (USJ) poses major challenges as device technology approaches the 65nm node. Three approaches for the formation of advanced USJ structures are described and the sheet resistance (R.sub.S) and...

Early results show much promise for immersion.(Lithography series: Part II)
May 1, 2004... OVERVIEW In the past year, a great deal of hope has been placed on immersion lithography technology to extend 193nm optical wavelength step-and-scan systems beyond 65nm processes for IC manufacturing. This article describes the results of...

USJ and strained-Si formation using infusion doping and deposition.(Implant)(ultra-shallow junctions)
May 1, 2004... OVERVIEW Infusion doping is a new technique for doping silicon with a gas-cluster ion beam source. The high total energy of the ionized gas cluster is concentrated into a region on the order of 100 [Angstrom] dia. The process produces...

Using APC for wafer-to-wafer control in CMP.(CMP)(Chemical Mechanical Polishing)
May 1, 2004... OVERVIEW A new integrated APC algorithm, combined with onboard metrology, improves CMP process control and equipment [C.sub.pk] (improving [C.sub.p] by ~80% and [C.sub.pk] by ~88%), and reduces wafer-to-wafer nonuniformity (WTWNU) in...

Haze control: reticle/environment interactions at 193nm.(Contamination Control)
May 1, 2004... OVERVIEW Until recently, the sole measure of a reticle's cleanliness prior to use was inspection. As new mask processes are introduced and exposure wavelengths shrink, the science of cleaning has taken a giant leap forward. Residuals on...

[Hf.sub.x][Al.sub.y][O.sub.z] ALD used to fabricate MIM capacitors.(Deposition)
May 1, 2004... OVERVIEW Alternative dielectric materials that would replace silicon dioxide for applications such as gate-dielectric transistor and integrated passive metal-insulator-metal (MIM) capacitors have to pass the stringent and complex...

KrF system addresses sub-100nm design nodes.(Product News)
May 1, 2004... The ELS-7010 krypton fluoride (KrF) excimer light source is designed for volume-production lithography applications at the 248nm wavelength. With 40W optical output power and 4kHz pulse repetition rate, the system delivers a high level of...

PECVD system has throughput >60 substrates/hr.(Product News)
May 1, 2004... The AKT-40K PECVD system is used for manufacturing seventh-generation (1800x2200[mm.sup.2] class) TFT-LCD panels primarily for large, high-resolution flat-panel televisions. The system reportedly provides 30% reduction in N[F.sub.3] consumption...

Optical CD metrology tool provides inline transistor control.(Product News)
May 1, 2004... The SpectraCD 100 uses broadband spectroscopic ellipsometry with reflective optics across a continuous wavelength spectrum from 190-800nm to detect process issues that require extreme sensitivity, such as resist footers in gate structures. The...

DIO3 system offers "environmentally friendly" alternative.(Product News)
May 1, 2004... The LIQUOZON Smart ozonated-water delivery system delivers ultrapure ozonated water (DIO3) for wafer and substrate cleaning during IC and thin-film processing. The self-contained system, which generates DIO3 at the point of use to eliminate...

Chemical filter housing.(Literature showcase)
May 1, 2004... The space-saving Chemlock[TM] PFA Housing permits faster, easier and safer cartridge changeouts. The housing locks the cartridge into the bowl, allowing the bowl and cartridge to be removed as a single unit. A 1/4 turn locks the cartridge in...

Photochemical filtration.(Literature showcase)
May 1, 2004... PCM family of advanced point-of-use photolithography filters is designed to significantly reduce on-wafer defects. PCM membranes reduce microbubbles in TARC and microbridge defects in 193nm photo-resist. It is stable in most photochemical...

Compact capacitance vacuum gauge.
May 1, 2004... The Model 720 offers a 0-5VDC or 0-10VDC output that is linear with pressure and independent of gas consumption. Provided reading accuracy is [+ or -] 0.5%, with an optional accuracy of [+ or -] 0.25%. Vacuum pressure ranges include 2-150kPa,...

Smart Butterfly Valve.(Literature showcase)
May 1, 2004... The Intellisys[TM] Smart Butterfly valve is a high performance integrated downstream chamber pressure control system. It is designed to control Dam nigh throughput systems with extremely snort process cycles and processes requiring a slower...

Gas purification system.(Literature showcase)
May 1, 2004... The stand-alone Aeronex[R] INFINITY[TM] gas purification system removes gases such as [H.sub.2]O, [O.sub.2] CO, C[O.sub.2], and non-methane hydrocarbons to Mykrolis Tel: 877-695-7654 www.mykrolis.com Circle 208 ...

VAT, Inc. Product line brochure.(Literature showcase)
May 1, 2004... VAT's newest product line brochure profiles the most extensive line of vacuum valves manufactured today. VAT offers 1,000+ standard valves for a wide variety of applications. VAT combines innovation state-of-the-art Manufacturing, quality...

Reduce costs with FREE measurement and control designer CD.(Literature showcase)
May 1, 2004... Up to 64 percent of your test and measurement application costs are spent on configuration and development time. In addition to hundreds of development resources this FREE CD helps you select the best software and hardware for your system...

Power supply catalog.(Literature showcase)
May 1, 2004... Comdel's new RF and DC power supply catalog covers a full range of RF generators in frequencies from 20 kHz to 80 MHz with selected topographies to 150 MHz and power levels from 100 to 100,000 Watts. Configurations include custom packaging for...

Tool mounted RF power.(Literature showcase)
May 1, 2004... The compact CB series RF generators feature a solid-state design and proven Comdel RF amplifier technology providing precise and repeatable power control and low cost of ownership. The CB series is available in power ranges from 50 to 5000...

Liquid-crystal polymer.(Literature showcase)
May 1, 2004... Liquid-crystal polymers make it possible to produce JEDEC-and MIL-specified hermetic plastic packages for semiconductor devices. Lower dielectric constant and loss properties allow high-frequency performance, and thin wall construction provides...

Signal-integrity probe station.(Literature showcase)
May 1, 2004... The PSI 1920 is a flexible probing station for signal-integrity probing apps on PCBs, fixed-pitched BGAs, semiconductor devices, and hybrid ceramics. The station accommodates up to three manipulators per adjustable platen, and the...

Specialty coating systems 1/30/03.(Literature showcase)
May 1, 2004... This literature features the new SCS G3 Spincoat Series. The spincoat models are available in 8, 12, and 15-inch programmable units and an 8-inch non programmable unit. Models offer precision and program flexibility to meet customer...

All-new TALON.(Literature showcase)
May 1, 2004... Cee[TM], a division of Brewer Science, introduces the most flexible coat/ develop/bake/chill tool in it's class. Industry leading uniformity, Nonlinear processing plus dispense and configuration options for MEMS configurability. Multi-axis...

Zenith Etch--integrated vacuum and abatement.(Literature showcase)
May 1, 2004... Zenith Etch is an integrated vacuum and abatement system designed for dielectric etch applications. It is available with up to four EPX500Z Drypumps to meet the demanding requirements of 300 mm etch tools while offering reliability in a...

Hydride purification media.(Literature showcase)(Aeronex SK )(Brief Article)
May 1, 2004... The Aeronex SK purification media purify hydride gases such as ammonia, arsine, phosphine, germane, and silane. The SK media are iron-free to eliminate the release of carbon monoxide, and offer an increase of 163% in oxygen capacity and a 20%...

Correction.(Literature showcase)(Correction Notice)
May 1, 2004... On the following page, please note the omitted page 78 of the SST 2004 Resource Guide. To access the entire Resource Guide, please go to www.solidstate.com.

Rutherford backscattering, systems/targets.(Test, Metrology & Inspection)(Directory)
May 1, 2004... SemiTest Inc 978-667-8783 www.semitest.com Rutherford backscattering, systems/targets National Electrostatics Corp 608-831-7600 www.pelletron.com Spectrum Acton Research Corp 978-263-3584 www.acton-research.com...

Bluetooth-enabled metrology system.(Product News)(ISIS 5 module)(Brief Article)
May 1, 2004... The compact ISIS 5 module acquires temperature data from Process Probe instrumented wafers and communicates it through Bluetooth MicroNet technology to Thermal TRACK 5 software on a SensArray-qualified PDA. The ISIS 5 module is available in...

Spray coater for 3D lithography.(Product News)(AltaSpray coater)(Brief Article)
May 1, 2004... A 3D lithography system combines the AltaSpray coater--for conformal layers over topography of up to several hundred microns with LEGO optics for large depth-of-focus imaging. AltaSpray resist deposition enables conformal coats across flat and...

Integrated machine-vision system.(Product News)(NetSight II)(Brief Article)
May 1, 2004... The NetSight II integrated machine-vision system is designed for rapid deployment in plant floor applications in a compact, 8x7x3-in. package. The system combines a processing engine with a camera interface, flexible software, and industrial...

Semiautomatic printer for hybrid apps.(Product News)(MX-2 semiautomatic screen and stencil printer)(Brief Article)
May 1, 2004... The MX-2 semiautomatic screen and stencil printer is designed for thick-film, hybrid, and solar cell applications. The standard machine is equipped with an x-, y-, and [theta]-adjustable print table and a vacuum circuit. A pneumatic cylinder...

Measurement device with laser scanner.(Product News)(Laser ScanArm)(Brief Article)
May 1, 2004... The Laser ScanArm is a seven-axis, contact/noncontact measurement device with an integrated laser scanner to digitize without removing either the hard probe or laser scanner. Users can collect simple point variations with the arm's hard probe,...

Diode-pumped green lasers.(Product News)(Brief Article)
May 1, 2004... The DM Series of diode-pumped Nd:YLF Q-switched green lasers offer high pulse energy at high repetition rates in a compact, hands-free system. Three models are available with pulse energies of 30mJ, 20mJ, and 10mJ at 1kHz and 527nm. Optional...

Dry film photoresist.(Product News)(WB Series )(Brief Article)
May 1, 2004... WB Series dry film photoresist for wafer bumping is applied in one step, with no solvents or drying required. The dry film photoresist process flow consists of lamination, edge trimming, bake, exposure, bake, developing, and bake--fewer steps...

Ozone generator.(Product News)(Series OG-5000)(Brief Article)
May 1, 2004... The Series OG-5000 ozone generator produces high-purity ozone gas for applications including CVD, ALD, oxide growth, wet processing, photoresist removal, and more. A controlled electrical discharge produces the ozone gas; ppm levels of a...

Copper electroplating system.(Product News)(SABRE NexT copper dectrochemical deposition system)(Brief Article)
May 1, 2004... The SABRE NexT copper dectrochemical deposition system is enhanced with a proprietary single-step chemistry that reportedly provides reproducible fill at advanced nodes, with reduced defects and an optimal profile for CMP. A new anode cell...

Wafer prober.(Product News)(P-12XLn+ 300mm wafer prober )(Brief Article)
May 1, 2004... The P-12XLn+ 300mm wafer prober targets multidie memory probing and high-speed logic device applications, offering 1.8 [micro]n accuracy. Optional features include thermal systems with -65 to +300[degrees]C operating temperatures, probe-card...

Flash annealing system.(Product News)(FLASH-300 annealing system)(WaferMasters Inc.)(Brief Article)
May 1, 2004... The FLASH-300 annealing system forms ultra shallow transistor junctions ([less than or equal to] 15nm) for high-performance memory and microprocessor devices. A single process chamber with RTP flash technology activates ion-implanted dopants,...

DC/RF test system.(Product News)(S680DC/RF parametric test system)(Brief Article)
May 1, 2004... The S680DC/RF parametric test system controls 300mm wafer processes in 200mm test times with the SimulTest parallel-test software option for measuring up to nine devices within a single probe touchdown. The system has identical, high-resolution...

Inspection system add-ons.(Product News)(Brief Article)
May 1, 2004... The EdgeCheck option and wafer backside quality monitor work with ADE's existing FIT inspection tools/AWIS inspection systems in identify and sort on-wafer edge defects and backside particles during the surface inspection process. With the...

Epoxy adhesive.(Product News)(Master Bond EP35)(Brief Article)
May 1, 2004... Master Bond EP35 is a two-component, contact and room-temperature curing, high-temperature resistant epoxy adhesive, suitable for bonding to metals, glass, ceramics, wood, vulcanized rubber, and many plastics. The epoxy produces high-strength...

RF SoC test system.(Product News)(Brief Article)
May 1, 2004... An RF SoC test solution tests next generation wireless devices used in wireless LAN, Bluetooth, cellular, GPS, and other applications. The system has an RFIC IQ analog option for a relative amplitude accuracy of [+ or -] 0.05dB and a relative...

X-ray inspection system.(Product News)
May 1, 2004... The WBI-FOX meets automated standards for 200mm and 300mm wafers with a customized handling system to prevent human interface with the wafers, flexible recipes that adjust to specific wafer characteristics, and summarized inspection results in...

BTU International.(People)(Brief Article)
May 1, 2004... BTU International has appointed Tom Nash as VP of marketing, overseeing corporate marketing and working closely with the executive team on strategy to expand the company's product and customer base. Nash served most recently as president of...

International Sematech.(People)(Brief Article)
May 1, 2004... International SEMATECH (ISMT) has named Charles Ramiller of IBM as director of its Front End Processes Division. Ramiller will serve a three-year assignment at ISMT, lending his experience in developing processes and equipment, leading...

IEEE CPMT Society.(People)(Brief Article)
May 1, 2004... The IEEE CPMT Society has named a new president and several officers for 2004: Philip Garrou will take over for outgoing president Rao R. Tummala. Garrou has authored two texts on microelectronics and co-authored more than 75 peer-reviewed...

TriQuint Semiconductor VP David McQuiddy and Anadigics Inc. chairman and co-founder Ronald Rosenzweig were among those honored for contributions to the semiconductor field with an Industry Pioneer award from the Compound Semi Industry Outlook 2004 panel.(People)(Brief Article)
May 1, 2004... TriQuint Semiconductor VP David McQuiddy and Anadigics Inc. chairman and co-founder Ronald Rosenzweig were among those honored for contributions to the semiconductor field with an Industry Pioneer award from the Compound Semi Industry David...

PowerDsine.(People)(Brief Article)
May 1, 2004... PowerDsine has named Kenneth Levy as chairman of its board of directors. Levy is currently the chairman at KLA-Tencor, having founded KLA Instruments, which merged with Tencor Instruments in 1976; he is also a director emeritus of SEMI. He will...

Andigilog.(People)(Brief Article)
May 1, 2004... Andigilog has named Bill Sheppard, former VP of Intel's Technology and Manufacturing group, as its CEO. He previously served on the company's board of directors, and has contributed to several venture-backed startups, including Microlab and...

Princeton Lightwave Inc.(People; appointments)(Brief Article)
May 1, 2004... Princeton Lightwave Inc. has appointed three senior executives in R&D and operations: Alka Swanson, executive VP in charge of sales, marketing, and business development; Sabbir Rangwala, VP of products and operations; and Mark Itzler, CTO. All...

Calendar.(Calendar)
May 1, 2004... * JUNE 2004 1-4--EIPBN--San Diego, CA. The 48th International Conference on Electron, Ion and Photon Beam Technology & Nanofabrication is co-sponsored by the American Vacuum Society, in cooperation with the IEEE Electron Devices Society...

High-k gate deposition: ALD or CVD? Solid State Technology asked executives to comment on the advantages and disadantages of ALD vs. CVD techniques for gate dielectrics.(Perspectives)(atomic layer deposition)(chemical vapor deposition)
May 1, 2004... CVD and even PVD are still on the table Luigi Colombo, TI Fellow, director of high-k development, Texas Instruments Inc., Dallas, Texas The replacement of SiON gate dielectric is an onerous task. The industry will have to develop a new...