Solid State Technology articles from March 2007

Solid State Technology archives from March 2007

Anatomy of a fab addition.(FAB MANAGEMENT)
March 1, 2007... Ronald J. Lorefice, IBM, East Fishkill, New York For IBM's new B323 annex in Fishkill, NY, the design intent was to continue the existing material palette to unify the annex with the original building, yet ensure that new ideas and concepts...

Hot LCD market poses technology challenges.(FLAT PANEL DISPLAYS)
March 1, 2007... The growing consumer appetite for large-area flat panel displays (FPDs)--particularly for TVs, but also for notebook computers and PC monitors-presents enormous opportunities for FPD makers, but to meet demand they must first overcome some...

50th anniversary Web site.(Celebrating 50 Years of Excellence)(www.solid-statc.com)(Brief article)
March 1, 2007... Solid State Technology is celebrating its 50th anniversary with features throughout the year about the past, present, and future of semiconductor manufacturing technology. A recent update on the site is the exclusive feature, "The only...

Where should products be manufactured?(effects of globalization and international marketing)(Editorial)
March 1, 2007... With large sectors of manufacturing, including chipmaking, moving from the US and Europe to Asia, what impact is this having on national economies? For developing countries, bringing in manufacturing, and then gradually moving up the...

SEMI, VLSI add up 2006 chip, equipment numbers.(BUSINESS TRENDS)(very large scale integration)(Brief article)
March 1, 2007... Demand for new semiconductor manufacturing equipment surged in December, during what was the final fiscal month for most North American companies, according to the latest data from SEMI. Orders for equipment from North American-based...

The semiconductor lithography market expanded at nearly twice the rate of the rest of the equipment industry in 2006 to top $6.7 billion, finally eclipsing the $6.0 billion mark achieved back in 2000, according to a report from The Information Network.(WORLDWIDE HIGHLIGHTS)(Brief article)
March 1, 2007... The semiconductor lithography market expanded at nearly twice the rate of the rest of the equipment industry in 2006 to top $6.7 billion, finally eclipsing the $6.0 billion mark achieved back in 2000, according to a report from The Information...

Sematech and Tokyo Electron Limited (TEL) have entered into two multiyear joint development programs.(WORLDWIDE HIGHLIGHTS)(Sematech)(Brief article)
March 1, 2007... Sematech and Tokyo Electron Limited (TEL) have entered into two multiyear joint development programs. One will improve prospects for using 3D interconnect technology in volume manufacturing, supporting development of low-k materials for...

The Open NAND Flash Interface (ONFI).(WORLDWIDE HIGHLIGHTS)
March 1, 2007... The Open NAND Flash Interface (ONFI), a coalition of memory suppliers formed last spring to develop a chip-level standard interface for NAND flash memory, has delivered its first specification, which the group says simplifies flash controller...

Brion Technologies Inc. and Japan's TOOL Corp. have agreed to combine TOOL's LAVIS layout visualization platform with Brion's Tachyon OPC and RET/OPC verification system, in a bid to help users more easily obtain litho simulation results without difficult and complex data preparation.(WORLDWIDE HIGHLIGHTS)(Brief article)
March 1, 2007... Brion Technologies Inc. and Japan's TOOL Corp. have agreed to combine TOOL's LAVIS layout visualization platform with Brion's Tachyon OPC and RET/OPC verification system, in a bid to help users more easily obtain litho simulation results...

Ovonyx Inc. and Qimonda AG have entered into a long-term cross license agreement targeting discrete memory products using their IP related to phase-change random-access memory (PCRAM) technology.(WORLDWIDE HIGHLIGHTS)
March 1, 2007... Ovonyx Inc. and Qimonda AG have entered into a long-term cross license agreement targeting discrete memory products using their IP related to phase-change random-access memory (PCRAM) technology. The reversible phase-change memory process is...

Tokyo Electron Ltd. (TEL) has acquired Epion Corp.(WORLDWIDE HIGHLIGHTS)
March 1, 2007... Tokyo Electron Ltd. (TEL) has acquired Epion Corp., a supplier of gas cluster ion beam (GCIB) technology, for an undisclosed amount. Applications for GCIB include etching, smoothing, doping, and physical and chemical surface modification.

Texas Instruments Inc.(USA)(Brief article)
March 1, 2007... Texas Instruments Inc. says it will shift development of next-generation digital process technology over to foundry partners, to avoid incurring costs or activities on development for 32nm process node, and will focus internally on its analog...

Freescale Semiconductor Inc. is aligning with longtime partner IBM and its Common Platform chipmaking alliance including Chartered, Samsung, and Infineon, for future chip technology process development, including some 45nm activities.(USA)
March 1, 2007... Freescale Semiconductor Inc. is aligning with longtime partner IBM and its Common Platform chipmaking alliance including Chartered, Samsung, and Infineon, for future chip technology process development, including some 45nm activities. All of...

Cypress Semiconductor Corp.(USA)(selling of Silicon Valley Technology Center to private equity firms)(Brief article)
March 1, 2007... Cypress Semiconductor Corp. is selling its Silicon Valley Technology Center (SVTC) 65nm process R&D shop, which has hosted work on MEMS, photonics, advanced memories, and novel life-science and materials applications since 2000, to a pair of...

Canon Inc. is taking full control over its 50-50 joint venture with Toshiba Corp.(ASIAFOCUS)
March 1, 2007... Canon Inc. is taking full control over its 50-50 joint venture with Toshiba Corp. to bring to market a new display technology that promises cost and quality advantages, and is potentially the first significant opportunity to bring...

United Microelectronics Corp.(ASIAFOCUS)(Brief article)
March 1, 2007... United Microelectronics Corp. (UMC) says it will cancel about 5.74 billion shares in order to reduce its capital by about $1.75 billion and give back about $0.09/share to every one of its shareholders. Reports quoted Liu Chi-tong, CFO of UMC,...

Having finally received the green light from Taiwan's government to transfer 200mm/0.18 [micro]m technologies to mainland China, Powerchip Semiconductor Corp.(ASIAFOCUS)(Brief article)
March 1, 2007... Having finally received the green light from Taiwan's government to transfer 200mm/0.18 [micro]m technologies to mainland China, Powerchip Semiconductor Corp. says it will expand its current partnership with Japan's Renesas Technology Corp. to...

Praxair Inc.'s China unit has been tabbed to supply industrial gases, including ultrahigh-purity nitrogen, oxygen, argon, hydrogen, and helium, to Semiconductor Manufacturing International Corp.(ASIAFOCUS)(Brief article)
March 1, 2007... Praxair Inc.'s China unit has been tabbed to supply industrial gases, including ultrahigh-purity nitrogen, oxygen, argon, hydrogen, and helium, to Semiconductor Manufacturing International Corp.'s (SMIC) Fab 8 300mm/90nm facility in Shanghai,...

AZ Electronic Materials.(ASIAFOCUS)(expansion of photoresist production)(Brief article)
March 1, 2007... AZ Electronic Materials will invest about $7.8 million to expand photoresist production in Hsinchu, Taiwan, to produce semi-finished products and eliminate the need for using bulk production in Japan. Construction is slated to be completed by...

Former Philips chip unit NXP Semiconductor is ending its participation in the Crolles2 chipmaking partnership with STMicroelectonics and Freescale at the end of this year, although ST says it's still committed to the partnership.(EUROFOCUS)(Brief article)
March 1, 2007... Former Philips chip unit NXP Semiconductor is ending its participation in the Crolles2 chipmaking partnership with STMicroelectonics and Freescale at the end of this year, although ST says it's still committed to the partnership. NXP says it...

While committed to following through with 45nm work done with its Crolles2 alliance through the end of this year, ST is seeking to push ahead with 32nm development with partners and/or in the framework of an alliance.(EUROFOCUS)
March 1, 2007... While committed to following through with 45nm work done with its Crolles2 alliance through the end of this year, ST is seeking to push ahead with 32nm development with partners and/or in the framework of an alliance. The timeframe for 32nm...

Infineon Technologies AG.(EUROFOCUS)(Brief article)
March 1, 2007... In a 4Q06 financials conference call with analysts and investors, Infineon Technologies AG CEO Wolfgang Ziebart predicted "the usual negative seasonality" in 2Q, with revenues and EBIT essentially flat, while inventories are expected to ease a...

Intel unveils 45nm chip with high-k, metal gates.(TECHNOLOGY NEWS)
March 1, 2007... Claiming "a significant breakthrough in transistor technology," Intel Corp. says it has advanced its 45nm process technology from a SRAM test chip unveiled in Jan. 2006 into working 45nm micrprocessors, chips that incorporate a hafnium-based...

NEC leads with cost-effective 3D and ULK interconnects.(TECHNOLOGY NEWS)(NEC Electronics Inc.)(dynamic random access memory)
March 1, 2007... There are many ways to interconnect two transistors, and as the industry the looks at maximizing density and speed with continued dimension shrinks, the challenges increase. In particular, it becomes more challenging to keep manufacturing costs...

Controlling line-edge roughness in EUV resist with sturdy, small molecules.(TECHNOLOGY NEWS)(Extreme Ultraviolet lithography)(Brief article)
March 1, 2007... Tokyo Ohka and Hitachi have demonstrated patterns with 28nm half-pitch resolution, with EUV resist made using small molecules that eliminate much line-edge roughness. The relatively size of the individual polymer molecules in conventional...

Pushing the limits of CMP mechanical control.(chemical-mechanical planarization)
March 1, 2007... Any chemical-mechanical planarization (CMP) process can be conceptually separated into chemical and mechanical components. While process models have become very complex--including variables such as the contact area of a pad asperity, the slurry...

Stretching silicon mobility with strain engineering: advanced transistors: second of three parts.(EMERGING TECHNOLOGIES)
March 1, 2007... EXECUTIVE OVERVIEW Mobility engineering has become the most important lever for improving performance in sub-90nm transistors. Uniaxial strain, achieved by modifying the transistor structure, has been remarkably successful and forms the...

A sub-100nm manufacturing technique for for hot-spot removal.(YIELD MANAGEMENT)(Report)
March 1, 2007... EXECUTIVE OVERVIEW Recent advances in lithography simulation have made full-chip lithography rule checking (LRC) a mandatory inspection procedure for many fabs handling sub-100nm designs. This article proposes a hot-spot removal approach...

Exposure equipment trends in TFT-LCD manufacturing.(FPDS)(Thin Film Transistor-Liquid Crystal Display)
March 1, 2007... EXECUTIVE OVERVIEW For equipment vendors, keeping up with glass size evolution in the display industry has kept them in a condition of constantly developing larger machines, improving productivity, and limiting tool price increases between...

Freescale's process and fab strategy puts a new spin on MRAM.(CHIP FORENSICS)
March 1, 2007... EXECUTIVE OVERVIEW This month, SST presents a special preview of Chip Forensics, a new SST online column by Dick James, senior technology adviser at Chipworks. Chipworks is a specialty reverse engineering company that takes apart ICs and...

Improving particle contamination control with in-tool air ionization.(YEILD)(Cover story)
March 1, 2007... EXECUTIVE OVERVIEW The advent of nanoscale feature sizes in semiconductor devices has created a greater sensitivity to contamination by nanoscale particles. At large particle sizes, gravity and air. ow determine the particle deposition...

Managing defects in DRAM stack capacitors using in-line e-beam inspection.(METROLOGY)(dynamic random access memory)
March 1, 2007... EXECUTIVE OVERVIEW DRAM-stacked capacitor structures require high-aspect-ratio contacts, and the narrow etch process window adds risk of yield excursions whenever the contacts are not well formed. An alternative method for detecting...

Reducing cost and PFC effluent with optimized [C.sub.2][F.sub.6] chamber cleaning.(Gases/Gas Handling)(Report)
March 1, 2007... EXECUTIVE OVERVIEW While chamber cleaning efficiency continues to improve with the new generation of chemical vapor deposition (CVD) tools, cleaning that is economical and practical for reducing PFC emissions in old-generation tools...

Key to China's growth is early adoption of next-gen technologies.(ASIA-PACIFIC SECTION: CHINA)
March 1, 2007... EXECUTIVE OVERVIEW With new fabs coming on line to support what is now the world's largest market for ICs, China is positioned to continue growth in chip sales. Early adoption of new manufacturing process technologies supports the wide...

New rules create opportunity for OEMs headquarted in China.(ASIA-PACIFIC SECTION: CHINA)(Company overview)
March 1, 2007... The maturation of the global semiconductor industry places a greater emphasis on economic innovation instead of just technology and productivity. At the same time, manufacturing has shifted to Asian regions. These two trends create advantages...

Revamped optical overlay metrology.(PRODUCT NEWS)
March 1, 2007... A redesign of the company's optical overlay metrology system, the Archer 100 offers >30% improvement in precision to 1.4 TMU (total measurement uncertainty) with system throughput exceeding 80wph using typical production sampling, the company...

Metal etch for sub-70nm memory.(PRODUCT NEWS)
March 1, 2007... The Opus AdvantEdge metal etch system, for etching sub-70nm aluminum interconnects in NAND flash and DRAM memory devices, offers a process-optimized five-chamber configuration (three etch, two strip) vs. standard four-chamber metal etchers. CD...

MOCVD for GaN LEDs.(PRODUCT NEWS)
March 1, 2007... The TurboDisc K-series metal organic chemical vapor deposition (MOCVD) gallium nitride (GaN) platforms target production of high-brightness blue and green light-emitting diodes (LED) and blue lasers. The K300 version features Veeco's GaNzilla...

TEOS for Si[O.sub.2] deposition.(PRODUCT NEWS)
March 1, 2007... This module, available as an upgrade to Oxford's Plasmalab System100 and System133 PECVD tools, enables delivery of TEOS (tetraethoxysilane, tetraethyl orthosilicate)-based plasma-enhanced chemical vapor deposition (PECVD) of silicon dioxide...

CMP polishing pad.(PRODUCT NEWS)
March 1, 2007... The Epic D100 CMP polishing pad for 200mm-300mm dielectric, shallow trench isolation, tungsten and copper processes can be customized to match grooving requirements in the US and Asia. Pad life is increased by 30% due to new material...

DRAM wafer probe card.(PRODUCT NEWS)
March 1, 2007... The Harmony XP wafer probe card, designed to optimize resources from today's most advanced testers (x384 and higher die-under-test), enables testing of 300mm 1GB DRAM wafers in as few as two touchdowns. It incorporates the company's MicroSpring...

Wirelessly "teaching" wafer transfers.(PRODUCT NEWS)
March 1, 2007... The WaferSense ATS uses machine vision to "see" inside semiconductor equipment to find targets that mark 200mm-300mm wafer transfer locations, such as load locks and process chambers, and wirelessly relay video and real-time coordinate data to...

Deep UV mirrors.(PRODUCT NEWS)
March 1, 2007... These deep UV enhanced mirrors, manufactured from an aluminum-based coating on a laser-quality substrate, are used for steering light sources at wavelengths through the UV, visible, and IR. Reflectance is >85% through the wide wavelength range...

Vacuum gauge module.(PRODUCT NEWS)
March 1, 2007... The IBM 401 "Hornet" ionization vacuum gauge module measures pressure from 1 x [10.sup.-9] to 5 x [10.sub.-2] Torr. An electrometer auto-zeroes to ensure that the readings are not subject to temperature drift. Filament current, emission...

Fluid dispenser.(PRODUCT NEWS)
March 1, 2007... The Axion X-1000 series dispensing system for Class 100 cleanrooms is configurable for single or dual-valve dispensing to accommodate a wide variety of fluids, processes, and applications. Features include mass-flow control and calibrated...

SLR imager for microscopes.(PRODUCT NEWS)
March 1, 2007... The E-330 micro-imaging system for microscopy includes a digital SLR camera (based on a 7.5 megapixel CMOS sensor) to show real-time frame images. Features include a 1.2x adapter, RM-1 multifunction remote control, and a multicable to link to...

Liquid dispense module.(PRODUCT NEWS)
March 1, 2007... The TakLDM FractalFill liquid dispense module incorporates controller, analytical, and delivery technologies for implementing real-time closed-loop control and dispense of multivariant chemistries for semiconductor wafer cleaning and etching...

Smaller OEMs keep pace with new trends in software.(INDUSTRY FORUM)(Original equipment manufacturers)
March 1, 2007... Today, the cost of developing and maintaining soft ware is rising faster than other costs associated with semiconductor equipment design, largely due to an increased emphasis on automation and process control. Because most problems with...

How to use the Resource Guide.
March 1, 2007... Table of Contents This year's products and services are grouped into 13 major categories that are listed in the Table of Contents found on page 4. Products & Services Listings The listings are arranged alphabetically within the 13...

Products & Services Listings.
March 1, 2007... The Products & Services listings are arranged alphabetically within 13 major categories. Each company is listed in alphabetical order underneath the appropriate product listing. Resource guide advertisers are indicated by a red bullet following...

Chemicals.(Chemicals)(Directory)
March 1, 2007... Acids Lab-Pro Inc 408-745-0222 www.labproinc.com Puritan Products Inc 610-866-4225 www.puritanproducts.com Adhesion promoting Brewer Science 573-364-0300 www.brewerscience.com Gelest Inc 215-547-1015...

Handling/storage/distribution systems, chemicals/process fluids.(Chemicals)(Directory)
March 1, 2007... Cabinets, cylinder BOC Edwards 800-848-9800 www.bocedwards.com * (See ad p15) Safety Equipment Corp 650-595-5422 www.gascabinets.com Spectra Gases Inc 800-932-0624 www.spectragases.com Cabinets, storage ...

Safety products/environmental management.(Chemicals)(Directory)
March 1, 2007... Breathing units, emergency/portable domnick hunter inc 704-921-9303 www.domnickhunter.com 3M OH & ES Division 800-328-1667 www.3m.com/occsafety Fire alarms Mark Systems Inc 610-738-8100 www.marksystems.com ...

Ultrapure/DI water.(Chemicals)(Directory)
March 1, 2007... Analyzers, calorimetric Chemetrics Inc 540-788-9026 www.chemetrics.com Analyzers, ion chromatography Dionex Corp 408-737-0700 www.dionex.com Analyzers, organic carbon Mettler-Toledo Thornton Inc 781-301-8600...

Gases, specialty.(Gases/Gas Handling)(Directory)
March 1, 2007... Advanced Specialty Gases 775-356-5500 www.advancedspecialtygases.com ATMI Inc 408-933-3571 www.atmi.com Epichem Group 44-151-334-2774 www.epichem.com Dopants Air Products and Chemicals Inc 800-654-4567...

Handling/storage/distribution systems, gases.(Gases/Gas Handling)(Directory)
March 1, 2007... Analyzers, residual gas (RGAs) Ametek 302-456-4400 www.ametekpi.com Extrel CMS 412-963-7530 www.extrel.com Lambda Photometrics Ltd 44-1582-764334 www.lambdaphoto.co.uk MKS Instruments Inc 978-284-4000...

Safety/products/accessories/environmental management, gases.(Gases/Gas Handling)(Directory)
March 1, 2007... Air sampling systems/detection tubes Draeger Safety Inc 412-787-8383 www.draeger.com IMR Inc USA 727-328-2818 www.imrusa.com Breathing units, emergency/portable Draeger Safety Inc 412-787-8383 www.draeger.com ...

Crystals, growing/sawing.(Process Material)(Directory)
March 1, 2007... Crucibles, crystal growing PLANSEE SE 43-5672-600-0 www.plansee.com Quartz Scientific Inc 440-354-2186 www.qsiquartz.com Saint-Gobain Quartz PLC 44-191-262-5311 www.quartz.saint-gobain.com Super Conductor...

Ingots/boules.(Process Material)(Directory)
March 1, 2007... Quartz Dynasil Corp 856-767-4600 www.dynasil.com Quartz Scientific Inc 440-354-2186 www.qsiquartz.com Saint-Gobain Quartz PLC 44-191-262-5311 www.quartz.saint-gobain.com Technical Glass Products Inc ...

Materials.(Process Material)(Directory)
March 1, 2007... Adhesives Ablestik 310-764-4600 www.ablestik.com Adhesives Research Inc 717-235-7979 www.adhesivesresearch.com AI Technology Inc 609-799-9388 www.aitechnology.com Ashland Inc 614-790-3333 www.ashland.com ...

Substrates, non-semiconductor.(Process Material)(Directory)
March 1, 2007... Alumina Cera-Circuits Inc 408-727-0100 www.fjaind.com Morgan Advanced Ceramics 44-1788-539-259 www.morganadvancedceramics.com Aluminum nitride ceramic Cera-Circuits Inc 408-727-0100 www.fjaind.com ...

Substrates, semiconductor.(Process Material)(Directory)
March 1, 2007... CdTe Optical Semiconductors Inc 914-739-0048 Epitaxial Silicon Sense Inc 603-891-4248 www.siliconsense.com Umicore 32-14-24-57-02 www.substrates.umicore.com Gallium arsenide M/A COM 978-442-5000...

Substrate surface preparation.(Process Material)(Directory)
March 1, 2007... Baths, acid PCT Systems Inc 510-657-4412 www.pctsystems.com Cutoff machines, wafer South Bay Technology Inc 949-492-2600 www.southbaytech.com Edge rounding equipment, wafer Accretech USA Inc 201-651-6700 ...

Materials, alloys/metals.(Process Materials)(Directory)(Table)
March 1, 2007... MATERIALS, ALLOYS/METALS Antimony Arsenic Brazing, Company gold/silver Alfa Aesar 978-521-6300 www.alfa.com Bayville Chemical...

Abatement systems.(Contaminination Control)(Directory)(Brief article)
March 1, 2007... Gases BOC Edwards 800-848-9800 www.bocedwards.com * (See ad p15) Ebara Technologies 916-920-5451 www.ebaratech.com Hitachi High Technologies America 877-327-3824 www.hitachi-hta.com Chemicals BOC...

Cleanrooms/supplies/accessories.(Contaminination Control)(Directory)
March 1, 2007... Air flow sensors/systems Fab-Tech Inc 802-655-8800 www.fabtechinc.com Air handling systems/components Air Innovations 800-825-3268 www.cleanroomsystems.com Fab-Tech Inc 802-655-8800 www.fabtechinc.com McGill...

Device/substrate handling systems/accessories.(Contaminination Control)(Directory)
March 1, 2007... Boats/carriers, silicon carbide Poco Graphite Inc 940-393-4439 www.poco.com Saint-Gobain Advanced Ceramics 508-795-4259 www.crystar.com Boats/carriers, wafer/substrate Amicon Plastics 713-988-8200...

Surface/parts cleaning equipment.(Contaminination Control)(Directory)
March 1, 2007... Abrasive blasting/cleaning equipment Comco Inc 818-841-5500 www.comcoinc.com Maxi-Blast Inc 574-233-1161 www.maxiblast.com Cleaners, gas phase FSI International Inc 952-448-5440 www.fsi-intl.com * (See ad...

Chemical mechanical planarization.(Fabrication/Process Technology)(Directory)
March 1, 2007... Polishers Abrasive Technology 740-548-4100 www.abrasive-tech.com Dongjin Semichem Co Ltd 82-31-353-6340 www.dongjin.com Entrepix Inc 602-426-8677 www.entrepix.com MR Semicon Inc 505-899-8183...

Deposition.(Fabrication/Process Technology)(Directory)
March 1, 2007... Cleaning systems, plasma ATV Technology Inc 978-664-1948 www.atv-tech.com Aurion Anlagentechnik GmbH 49-6182-9628-0 www.aurion.de Mattson Technology Inc 510-657-5900 www.mattson.com Plasmatic Systems Inc ...

Diffusion/oxidation/annealing.(Fabrication/Process Technology)(Directory)
March 1, 2007... Annealing systems, furnace Amtech Systems Inc 480-967-5146 www.amtechsystems.com Centrotherm Technologies 978-777-9859 www.centrothermtech.com Centrotherm Thermal Solutions GmbH & Co KG 49-7344-918-0...

Epitaxy.(Fabrication/Process Technology)(Directory)
March 1, 2007... Epitaxial reactor systems Veeco Instruments Inc 516-677-0200 www.veeco.com Epitaxial reactor tubes/quartzware/accessories Applied Precision LLC 425-557-1000 www.appliedprecision.com PLANSEE SE 43-5672-600-0...

Etch.(Fabrication/Process Technology)(Directory)
March 1, 2007... Baths, wafer etch FSI International Inc 952-448-5440 www.fsi-intl.com * (See ad p36, 37) HEATEFLEX CORP 626-599-8566 www.heateflex.com Imtec Acculine Inc 408-745-7800 www.imtecacculine.com PCT Systems Inc...

Etch, dry systems/accessories.(Fabrication/Process Technology)(Directory)
March 1, 2007... Batch Axic Inc 408-980-0240 www.axic.com PVA TePla AG 49-89-905-03-0 www.pvatepla.com Tokyo Electron Ltd (TEL) 512-424-1000 www.tel.com Etching systems, automatic/wet, singular/batch Materials and...

Ion implantation.(Fabrication/Process Technology)(Directory)
March 1, 2007... Accessories Carbone Lorraine Composants SAS 33-1-41-85-45-14 www.carbonelorraine.com Potentials Inc 512-251-4602 www.potentialsinc.com Super Conductor Materials Inc 845-368-0240 www.scm-inc.com Controller, beam...

Lithography equipment.(Fabrication/Process Technology)(Directory)
March 1, 2007... Artwork generators, photomasks Benchmark Technologies 781-246-3303 www.benchmarktech.com IMT Masken und Teilungen AG 41-44-943-1900 www.imtag.ch Micronic Laser Systems AB 46-8-638-52-00 www.micronic.se ...

Lithography systems.(Fabrication/Process Technology)(Directory)
March 1, 2007... Aligners EV Group 43-7712-5311-0 www.evgroup.com Direct-step-on-wafer (DSW/Stepper) H&L Associates 613-828-1462 www.trilicium.ca/hl_index.php Tokyo Electron Ltd (TEL) 512-424-1000 www.tel.com E-beam (direct...

Photoresists.(Fabrication/Process Technology)(Directory)
March 1, 2007... Antireflective coating (ARC) Solid State Equipment Corp 215-328-0700 www.ssecusa.com DUV AZ Electronic Materials (Germany) GmbH 49-611-962-8563 www.az-em.com JSR Micro Inc 408-543-8800 www.jsrmicro.com ...

Photoresist equipment.(Fabrication/Process Technology)(Directory)
March 1, 2007... Coaters/accessories Laurell Technologies Corp 215-699-7278 www.laurell.com Rite Track 513-881-7820 www.ritetrack.com Solid State Equipment Corp 215-328-0700 www.ssecusa.com Coater/developer tracks, integrated ...

Software, equipment/tool control.(Fabrication/Process Technology)(Directory)
March 1, 2007... Automatic equipment control (AEC) As One Technologies Inc 952-996-0084 www.as1tech.com ErgoTech Systems Inc 505-662-5156 www.ergotech.com KUKA Real Time Products 714-505-1485 www.kukacontrols.com Automatic...

Software, manufacturing control, CIM/CAM.(Fabrication/Process Technology)(Directory)
March 1, 2007... Computer integrated manufacturing process/control (CIMPAC) JMI Software Consultants Inc 215-293-9221 www.jmisoftware.com Valor Computerized Systems 949-586-5969 www.valor.com Controllers, process station Berkeley...

Software, process/yield control, DFM.(Fabrication/Process Technology)(Directory)
March 1, 2007... Data management/analysis Inspex Inc 978-667-5500 www.inspex.com JMP A Business Unit of SAS 877-594-6567 www.jmp.com Soto Technologies 512-251-0113 www.sototech.com Wright Williams & Kelly Inc 925-399-6246...

Thin film.(Fabrication/Process Technology)(Directory)
March 1, 2007... Capacitors/inductors/resistors/circuits BI Technologies 714-447-2300 www.bitechnologies.com Mantis Deposition 44-1844-260160 www.mantisdeposition.com State of the Art Inc 814-355-8004 www.resistor.com 3M...

Thin film coatings.(Fabrication/Process Technology)(Directory)
March 1, 2007... Adherence test equipment Quad Group Inc 509-458-4558 www.quadgroupinc.com Antireflection CVI Laser LLC 505-296-9541 www.cvilaser.com eSource OPTICS 774-280-2350 www.esourceoptics.com INRAD a PPGI Co ...