Solid State Technology articles from March 2005

Solid State Technology archives from March 2005

Special report: 2004 ITRS update: latest roadmap sharpens industry's future course.(Solid State Technology )(Brief Article)(Advertisement)
March 1, 2005... Solid State Technology worked with leaders in various technical working groups of the 2004 ITRS to highlight the most significant updates in the newest edition of the industry's roadmap, as well as major challenges to be addressed in the 2005...

Time for innovation.(Editorial)
March 1, 2005... Conditions have never been better for a surge in innovative chip-based products, perhaps even whole new industry categories. Markets are hungry for something different; technical capabilities are racing ahead of our ability to use them...

Why China will keep pushing 200mm as far as it will go.(Business Trends)(Brief Article)
March 1, 2005... While China took its first steps into 300mm wafer manufacturing in 2004, the bulk of fab expansions in the Chinese chip industry will be driven by new 150mm and 200mm plants through the rest of this decade, according to analysts and new...

SEH America Inc. will begin producing 300mm silicon wafers at its plant in Vancouver, WA, but did not specify the amount of money to be invested in new equipment or when production would begin.(USA)(Brief Article)
March 1, 2005... SEH America Inc. will begin producing 300mm silicon wafers at its plant in Vancouver, WA, but did not specify the amount of money to be invested in new equipment or when production would begin. It's part of a [yen]100 billion (US$958.5 billion)...

PowerChip Semiconductor Corp.(China)(Brief Article)
March 1, 2005... Directors of Taiwan's PowerChip Semiconductor Corp. (PSC) have approved a plan to open a 200mm wafer fab in mainland China, and will put 20% of the firm's net worth of roughly $2.1 billion into the investment, according to the Financial Times....

Sony Corp. plans to invest up to [yen] 60 billion (US $575.1 million) over the next two years to boost production capacity at Sony Semiconductor Kyushu's technology centers in Kumamoto and Kokubu.(Japan)
March 1, 2005... Sony Corp. plans to invest up to [yen]60 billion (US $575.1 million) over the next two years to boost production capacity at Sony Semiconductor Kyushu's technology centers in Kumamoto and Kokubu. The investments will go toward building new...

TSMC.(Taiwan)(Taiwan Semiconductor Manufacturing Company Ltd.)(Brief Article)
March 1, 2005... TSMC has achieved production levels of "several thousand" 300mm wafers/month using its Nexsys 90nm process technology, and will accelerate ramp-up to volume production during 2005. The process, running in Fab 12's Phase I, will be deployed in...

Infineon Technologies AG has terminated the $206 million sale of its fiberoptics unit to Finisar Corp. due to delayed filings with the SEC, and will seek to recover damages via arbitration in Germany.(Eurofocus)(Brief Article)
March 1, 2005... Infineon Technologies AG has terminated the $206 million sale of its fiberoptics unit to Finisar Corp. due to delayed filings with the SEC, and will seek to recover damages via arbitration in Germany. The company also indicated that it would...

Soitec, Bernin, France, has agreed to supply silicon-on-insulator (SOI) substrates and technical support for an R&D program at SEMATECH subsidiary Advanced Technology Development Facility.(Eurofocus)(Brief Article)
March 1, 2005... Soitec, Bernin, France, has agreed to supply silicon-on-insulator (SOI) substrates and technical support for an R&D program at SEMATECH subsidiary Advanced Technology Development Facility. The program has verified a 45nm-node multigate...

BE Semiconductor Industries NV.(Eurofocus)(Brief Article)
March 1, 2005... BE Semiconductor Industries NV (Besi), Drunen, The Netherlands, will take 7.3 million [euro] in charges and writedowns to reduce its worldwide workforce by 10%, mainly at its Dutch packaging and tooling manufacturing operations. A forecasted...

Porous low-k looks usable with sealing by etch byproduct and ALD TaN.(Technology News)(Edge Technologies)
March 1, 2005... The Japanese consortium Selete (Semiconductor Leading Edge Technologies) has demonstrated hp65nm interconnect modules showing good electrical characteristics and reliability with both porous CVD SiOC and porous spun-on MSQ, suggesting porous...

Immersion litho tests: no hidden problems.(immersion lithography)
March 1, 2005... The next big step for 193nm ArF immersion lithography development will be fully equipped pilot lines in 2005. Immersion-related defectivity issues in functioning devices will be defined in those pilot lines. This follows early split-lot...

Film monitoring of engineered substrates.(SOI)
March 1, 2005... The industry is seeing a gradual migration from standard silicon (Si) substrates to engineered substrates [1, 2]. The types of engineered substrates currently used in production and being studied for future use include silicon-on-insulator...

Physics and process drive etch performance at 45nm.(Cover feature: etch)
March 1, 2005... OVERVIEW Next-generation scaling is translating into more exacting specifications for many processes in semiconductor manufacture. For dielectric etch, new materials, thinner layers, complex stacks of dissimilar films, and tighter...

Diverse CMP needs require a dielectric selectivity platform.(chip-level multiprocessing)
March 1, 2005... OVERVIEW It is likely the 45nm technology node will see the introduction of new materials and integration schemes. For the early adopters, the choice of materials, applications, and integration schemes is fragmented across the leading-edge...

Choosing the right ionization gauge for high-vacuum processes.(Vacuum Technology)
March 1, 2005... OVERVIEW The selection of high-vacuum gauge technologies for measurements in pressure-dependent semiconductor processes can affect overall cost and manufacturing yields depending on the application and the environment in tool chambers....

UV-assisted processing for advanced dielectric films.(Ultraviolet assisted thermal processing)
March 1, 2005... OVERVIEW Ultraviolet-assisted thermal processing (UVTP) is emerging as a viable film-modification technology for advanced dielectric applications. As a post-deposition process, UVTP enhances dielectric film properties by combining UV...

Nanoimprint lithography enables patterned tracks for high-capacity hard disks.(Data Storage)
March 1, 2005... OVERVIEW Advances in nanoimprint lithography (NIL) are being employed to introduce new manufacturing processes for next-generation thin-film disks, which use patterned substrates for land-and-groove structures that magnetically isolate...

Calendar.(Calendar)
March 1, 2005... APRIL 2005 11-12--ASMC--Munich, Germany. The 16th Annual Advanced Semiconductor Manufacturing Conference and Workshop addresses challenges and trends of semiconductor manufacturing, from 300mm to nanoscale devices, factory automation, and...

SEMICON[R] Europa 2005: April 11-15, Munich, Germany.
March 1, 2005... Exhibition Hours Tuesday, April 12 10 am-5 pm Wednesday, April 13 10 am-5 pm Thursday, April 14 10 am-4 pm SEMICON Europa (sponsored by trade organization SEMI) will be held from Monday, April 11-Friday, April 15, at the...

E-beam system.(SEMICON[R] Europa 2005 Products)
March 1, 2005... The SB351 DW direct-write electron-beam (e-beam) system uses a variable-shaped beam for patterning down to 45nm feature sizes. "Write-on-the-fly" mode has been combined with a 300mm precision stage that has a 310x310mm travel range and flexible...

Getter thin films.(SEMICON[R] Europa 2005 Products)
March 1, 2005... The PaGe getter thin-film line, including PaGeLid and Rel-Hy, removes impurities by chemical sorption of all active gases in hydrogen-sensitive packages, microelectronic hermetic devices in ceramic or metallic packages, and wafer-level...

Flip-chip system.(SEMICON[R] Europa 2005 Products)
March 1, 2005... The 8800 FC Smart Line links three machine modules: the 8800 FC Smart Line flip-chip bonder with integrated dispenser, a curing station with integrated electrical testing, and an optical-inspection/reject-marking unit. A dual-head dispensing...

Yield management software.(SEMICON[R] Europa 2005 Products)
March 1, 2005... YieldView 2.9 provides fab-wide integration and analysis of defect data generated by tools in the WaferView team. The software acts as a central database for recipes, defect classes, and alarm rules for inspection consistency, as well as...

sSOI wafers.(SEMICON[R] Europa 2005 Products)
March 1, 2005... 300mm strained silicon-on-insulator (sSOI) wafers for partially depleted (>35nm thick) CMOS IC architectures exhibit a strain value of 1.5GPa with homogeneity of [+ or -] 7% over the wafer. The strained Si layer is 200A thick, with a surface...

X-ray metrology tool.(SEMICON[R] Europa 2005 Products)
March 1, 2005... The BedeMetrix-L is a multipurpose process R&D metrology tool for advanced semiconductor manufacturing that incorporates enhanced small-spot measuring capability for wafers from 50-300mm. This allows measurement of sub-100[micro]m test pads in...

Noncontact measurement system.(SEMICON[R] Europa 2005 Products)
March 1, 2005... The noncontact V-Q tool is an in-line monitoring/characterization system that can replace traditional hard-probe and mercury C-V measurements for gate-dielectric materials. Full wafer-mapping capability reveals inhomogeneity of oxide...

Chemical management system.(Literature showcase)
March 1, 2005... The CR-288 is a point-of-use liquid-chemical concentration system designed to monitor and control the concentrations of liquid process chemicals. The system is fully compatible with all liquid-chemical manufacturing processes, with current...

Polymer-reduction system.(Literature showcase)
March 1, 2005... The hot [N.sub.2] solution (HNS) reduces polymer production in exhaust pipes of semiconductor deposition, etch, and ion-implant systems. The HNS normalizes the inside of piping and the exhaust gas stream to the same temperature, while...

Heating elements for process furnaces.(Literature showcase)
March 1, 2005... The full line of Ultra Performance vertical replacement heating elements for semiconductor processing systems is compatible with a range of OEM vertical furnaces. The elements feature an interlocking spacer design with end caps that increase...

Prober conversion kit.(Literature showcase)
March 1, 2005... A low-temperature conversion kit for automatic probers gives 200mm tools the ability to conduct moisture-free tests at temperatures down to -55[degrees]C. The kit includes a ThermoChuck temperature-controlled precision platform; a sealing kit;...

Singulation system.(Product News)
March 1, 2005... The SBS 9100 package singulation system allows choice of the most suitable cutting engine from various saw engines with plug-and-play configurations. A pattern-recognition alignment feature offers both one-point and multipoint alignment. Two...

Ultrafast piezo-scanner.(Product News)
March 1, 2005... The PXY 16 OEM two-axis, linear piezo-scanner provides a positioning and scanning range up to 16 m, and has a centrally located free aperture to allow moving optics. To avoid creep and hysteresis, the piezo-scanner can be equipped with a...

Metrology: a case of multiples: Solid State Technology asked industry experts to comment on the proliferation of metrology tools and what, if anything, can be done to mitigate the drawbacks.(Perspectives)
March 1, 2005... Process complexity drives proliferation of metrology methods Alain C. Diebold, SEMATECH, Austin, Texas Tomorrow's ICs will incorporate new, nonclassical CMOS devices and more complex interconnection. In turn, these devices and...

Chemicals.(2005 Resource Guide)
March 1, 2005... Chemicals Acids Air Products Electronic Chemicals 760-930-0273 www.airproducts.com/apec Corco Chemical Corp 215-295-5006 Eastman Chemical Co 423-229-1698 www.eastman.com * J T Baker 908-859-2151...

Gases/gas handling.(2005 Resource Guide)
March 1, 2005... Gases, Commodity Argon Air Liquide America LP 972-301-5200 www.aifliquide.com * BOC Edwards 800-848-9800 www.bocedwards.com (see ad p15) Hydrogen Air Liquide America LP 972-301-5200 www.airliquide.com...

Process materials.(2005 Resource Guide)(Directory)
March 1, 2005... Crystals, Growing/Sawing Crucibles, crystal growing Heraeus Quartz America LLC 512-251-5530 www.heraeus.quartztech.com Morgan Advanced Ceramics 603-598-9122 www.morganadvancedceramics.com PLANSEE...

MEMC: technology is built on us.(Corporate Profile)(Company Profile)
March 1, 2005... MEMC is a leading global supplier of silicon wafers, with over 40 years of silicon experience and leadership. MEMC silicon wafers... the foundation of technology. LEADERSHIP MEMC maintains a leadership role in the silicon wafer...

Contamination control.(2005 Resource Guide)
March 1, 2005... Abatement Systems Gases * BOC Edwards 800-848-9800 www.bocedwards.com (see ad p15) CS Clean Systems AG 49-89-96-24-00-0 www.cscieansystems.com EBARA Technologies Inc 916-920-5451 www.ebaratech.com ...

Fabrication/process technology.(2005 Resource Guide)
March 1, 2005... CIM/CAM, Process Control Manufacturing Software Design/manufacturing, assembly/packaging Harmonic Drive Technologies 978-532-1800 www.harmonic-drive.com Design/manufacturing, automation Genmark Automation Inc ...

FSI International, Inc.(Corporate Profile)
March 1, 2005... Global support. Local service. More surface conditioning options. Facts you can trust. FSI International, Inc. has set the standards for innovative, extendable and flexible surface conditioning cleaning solutions for more than 30 years....

Machinery, tools & equipment.(2005 Resource Guide)
March 1, 2005... Automation/Wafer Handling/Robotics Automatic guided vehicles SICK Inc 800-352-7425 www.sickusa.com Machine vision CyberOptics Semiconductor Inc 503-495-2200 www.cyberopticssemi.com SICK Inc 800-352-7425...

Digital piezo amplifier series d-Drive.(Machinery, Tools & Equipment)(Piezosystem Jena GmbH)(Brief Article)
March 1, 2005... piezosystem jena introduces their new generation of digital piezo amplifier line d-Drive[R] which combines the highest positioning accuracy with a unique handling comfort: the features can be controlled by a PC or directly with the front panel....

Vacuum technology.(2005 Resource Guide)(Directory)
March 1, 2005... Vacuum Systems/Accessories Bell jars and fixtures * BOC Edwards 800-848-9800 www.bocedwards.com (see ad pt5) CHA Industries 510-683-8554 www.chaindustries.com CTI-Cryogenics 508-337-5000...

Displays.(2005 Resource Guide)
March 1, 2005... Manufacturing Machinery/Equipment/Accessories Carriers, quartz United Silica Products Inc 973-209-8854 www.unitedsilica.com Chemicals, specialty Gelest Inc 215-547-1015 www.gelest.com * J T Baker ...

Test, metrology & inspection.(2005 Resource Guide)
March 1, 2005... Analyzers Air Biotest Diagnostics Corp 973-625-1300 www.biotestusa.com Climet Instruments Co 909-793-2788 www.climet.com Dionex Corp 408-737-0700 www.dionex.com Molecular Analytics Inc 410-472-7300...

Carl Zeiss SMT: corporate profile.(Company Profile)
March 1, 2005... Carl Zeiss SMT and its divisions serve the global semiconductor manufacturing and testing equipment markets with leading-edge optical and E-beam technology. Products range from top level systems and components for lithography productions tools...

Jordan Valley.(Jordan Valley Semiconductors, Inc.)
March 1, 2005... The Company Jordan Valley Semiconductors, Inc. provides metrology solutions for thin films based on novel, rapid, non-contacting, and non-destructive x-ray technologies. JVX tools are used by major semiconductor manufacturing companies...

Back end production.(2005 Resource Guide)(Directory)
March 1, 2005... Bonding/Die Attach Adhesives, die attach Ablestik 310-764-4600 www.ablestik.com Alphasem AG 41-71-637-6363 www.alphasem.com Epoxy Technology 978-667-3805 www.epotek.com SUSS MicroTec SA 33-4-50-35-83-92...

Industry services.(2005 Resource Guide)
March 1, 2005... Analytical Services Chemical analysis Evans Analytical Group 408-530-3500 www.eaglabs.com The M&P Lab 518-382-0082 www.the-mandp-lab.com Northern Analytical Laboratory Inc 603-429-9500 www.northernanalytical.com ...

Manufacturers' representatives.(2005 Resource Guide)(Directory)
March 1, 2005... Chemicals Chemicals, miscellaneous Eastman Chemical Co 423-229-1698 www.eastman.com Handling, storage/distribution systems Eastman Chemical Co 423-229-1698 www.eastman.com Contamination Control Cleanroom...

Consultants.(2005 Resource Guide)(Directory)
March 1, 2005... Areas of Concentration Chemicals F&F Associates 781-444-5499 The McIlvaine Co 847-784-0012 www.mcilvainecompany.com Cleanrooms, design/construction Abbie Gregg Inc 480-446-8000 www.abbiegregg.com ...

Trade Names.(2005 Resource Guide)
March 1, 2005... The Trade Names section is an alphabetical listing of products and services commonly known by a commercial name or name/model number combination, followed by a short description and the name of the service. Further information on the...