Solid State Technology articles from July 2006

Solid State Technology archives from July 2006

The economics of sub-45nm chipmaking.(Web Exclusives)
July 1, 2006... Tough challenges facing process tool vendors in the shift toward sub-45nm chip features will require imaginative solutions. At The ConFab event recently, Masayuki Tomoyasu, Tokyo Electron Ltd.'s director of development and planning,...

Enabling new service provider business models with the IP Multimedia Subsystem.(EDITORIAL)(Editorial)
July 1, 2006... Over the past 30 years, the solar industry has made a I number of false starts, and the underlying photovoltaics (PV) technology has gained a reputation for being impractical without government subsidies. However, recent advances and conditions...

Capex big spenders swell ranks in 2006.(BUSINESS TRENDS)
July 1, 2006... Membership in the elite group of chipmakers spending at least $1 billion will expand to 16 companies this year, with memory firms particularly aggressive in their capacity investments, according to IC Insights Inc. According to initial...

Total silicon wafer area shipments were 1884 million sq. in. (MSI) in 1Q06, up 3% from 4Q05 and nearly 29% from a year ago, according to data from SEMI.(market research)(Brief article)
July 1, 2006... Total silicon wafer area shipments were 1884 million sq. in. (MSI) in 1Q06, up 3% from 4Q05 and nearly 29% from a year ago, according to data from SEMI. Since early 2005, wafer demand has slowed from 8%9% quarterly growth to 3%-4% now, but...

Applied Materials Inc., Santa Clara, CA, and Japan's Dainippon Screen Mfg. Co. Ltd. (DNS) are forming a joint venture to offer track technologies for semiconductor manufacturing.(WORLDWIDE HIGHLIGHTS)
July 1, 2006... Applied Materials Inc., Santa Clara, CA, and Japan's Dainippon Screen Mfg. Co. Ltd. (DNS) are forming a joint venture to offer track technologies for semiconductor manufacturing. New company Sokudo Co. Ltd. (52% DNS-owned) will incorporate...

Nantero Inc., Phoenix, AZ, and ON Semiconductor will continue development efforts to integrate carbon nanotubes into CMOS fabrication.(product development)(Brief article)
July 1, 2006... Nantero Inc., Phoenix, AZ, and ON Semiconductor will continue development efforts to integrate carbon nanotubes into CMOS fabrication, work that was being done at LSI Logic's facility in Gresham, OR, which ON acquired earlier this year.

China Resources Logic has proposed a $113 million buyout offer to double its 26% ownership in semiconductor foundry CSMC Technologies to a majority stake.(China Resources Logic acquisitions)(Brief article)
July 1, 2006... China Resources Logic has proposed a $113 million buyout offer to double its 26% ownership in semiconductor foundry CSMC Technologies to a majority stake. The company hopes to bolster its plans "to become an influential player in the PRC...

Renesas Technology Corp. and Nanya Technology Corp. have settled four pending lawsuits alleging patent infringement by Nanya's DRAM products.(ASIAFOCUS)
July 1, 2006... Renesas Technology Corp. and Nanya Technology Corp. have settled four pending lawsuits alleging patent infringement by Nanya's DRAM products, and have signed an undisclosed cross-licensing agreement.

Chartered Semiconductor Manufacturing Ltd. is ready to deliver new microprocessors utilizing 300mm/90nm process technologies to partner Advanced Micro Devices (AMD), several months earlier than expected, according to a Reuters report.(ASIAFOCUS)
July 1, 2006... Chartered Semiconductor Manufacturing Ltd. is ready to deliver new microprocessors utilizing 300mm/90nm process technologies to partner Advanced Micro Devices (AMD), several months earlier than expected, according to a Reuters report. The...

Having completed Cadence Design Systems' qualification, TSMC and UMC say their 65nm process technologies are ready for chip designs utilizing the X Architecture.(Cadence Design Systems product information of chip designs )(Brief article)
July 1, 2006... Having completed Cadence Design Systems' qualification, TSMC and UMC say their 65nm process technologies are ready for chip designs utilizing the X Architecture, which utilizes diagonal interconnects instead of traditional right-angle layout...

Formosa Komatsu Silicon Corp.(Formosa Komatsu Silicon Corp joint ventures )(Brief article)
July 1, 2006... Formosa Komatsu Silicon Corp., a silicon-wafer making venture between Taiwan's Formosa Plastics Group and Japan's Komatsu Electronic Materials Co. Ltd., plans to start pilot production at its first 300mm wafer fab in November, starting with...

AMD.(semiconductor production facilities )(Brief article)
July 1, 2006... AMD plans to spend an additional $2.5 billion over the next three years to boost output at its semiconductor production facilities in Dresden, Germany, by converting some 200mm capacity to 300mm and building a new cleanroom to handle growing...

European microelectronics consortium IMEC and Riher, a French supplier of molecular beam epitaxy (MBE) technology for compound semiconductors, are collaborating to introduce germanium (Ge) and III-V materials for CMOS scaling beyond the 22nm manufacturing node.(partnerships of IMEC and Riher)(Brief article)
July 1, 2006... European microelectronics consortium IMEC and Riher, a French supplier of molecular beam epitaxy (MBE) technology for compound semiconductors, are collaborating to introduce germanium (Ge) and III-V materials for CMOS scaling beyond the 22nm...

"Bulking up" with direct silicon bonding.(information of silicon wafers)
July 1, 2006... Layer-transfer technology is becoming more important as the demand for high-performance applications requiring enhanced semiconductor functions increases, and other applications such as MEMS and packaging continue to expand. A recently...

AIN wafers commercially available, quality and price improving.(TECHNOLOGY NEWS)(Crystal IS Inc. produces ~300[micro]m thick wafers from aluminum nitride boules)(Product/service evaluation)
July 1, 2006... The world's largest aluminum nitride (AlN) single-crystal boules are now being grown and sliced into 2-in. wafers ready for epitaxial growth. Crystal IS Inc., Green Island, NY, has announced the limited availability of ~300[micro]m thick wafers...

Microwaves cook up batch RTP.(TECHNOLOGY NEWS)
July 1, 2006... Start-up company DSG Technologies uses microwave heating in its Axom-200/300 thermal processing batch tool for applications such as low-temperature curing, Cu annealing, low-temperature ozone oxidation, and low-temperature nitridation. While...

Scientists apply "laser" focus to strip hydrogen from silicon.(TECHNOLOGY NEWS)
July 1, 2006... Researchers from the U. of Minnesota, Vanderbilt U., the U. of Tennessee, and Oak Ridge National Laboratory have developed a method to strip hydrogen atoms from silicon surfaces, a process that could enable production of silicon devices at...

Microgram scales provide resolution for nanometer-era process control.(TECHNOLOGY NEWS)
July 1, 2006... Dynamic sensing and compensation technology converts a precise mass-balance into an atomically precise one. With microgram resolution and repeatability in automated systems in the 10-milligram range, weight measurement tools from Metryx are...

The Open Modeling Coalition creates a new effective current source model.
July 1, 2006... EXECUTIVE OVERVIEW New models are needed to account for the process variations in nanometer-era silicon manufacturing, so that new chips can be designed with acceptable yield and performance without requiring costly re-spins. The Silicon...

Targeting 45nm with improved SiON films and extended gate dielectrics.(Special Report: PART I: GATE-STACK ENGINEERING)(Silicon oxynitride)(nano metre)(Cover story)
July 1, 2006... EXECUTIVE OVERVIEW Silicon oxynitride gate-stack dielectrics are reaching limits for use beyond 65nm technology. But replacing them with high-k materials--which would enable higher current when the transistor is on and lower leakage when...

Optimizing gate dielectrics using laser-spike annealing.(Special Report: Part II: GATE-STACK ENGINEERING)
July 1, 2006... EXECUTIVE OVERVIEW For the past several years, the need for advanced gate-stack materials has been listed by SEMATECH as one of the top technical challenges faced by the semiconductor industry [1]. These new materials will help reduce gate...

Combining seed layers enables the use of HAR copper interconnects.
July 1, 2006... EXECUTIVE OVERVIEW The lower resistivity of copper vs. aluminum facilitates denser and faster ULSI devices with on-chip copper interconnects. However, the shrinking dimensions with each new technology generation rapidly increase the RC...

An alternative dopant-measurement method for analyzing ULE implant.(ultra low energy)
July 1, 2006... EXECUTIVE OVERVIEW This article describes an alternative dose-measurement method of analyzing ultra-low energy (ULE) ion implantation. The new technique, which entails the spatial and temporal separation of sampling and ionization by using...

Evaluating topcoat options for immersion litho resists.(RESISTS)
July 1, 2006... OVERVIEW Three resist systems are commonly available for 193nm immersion lithography: resist with solvent-soluble topcoat, resist with an aqueous developer-soluble topcoat, and special 193i immersion resist needing no topcoat at all. This...

Auto CD-SEM edge-placement error for OPC and process modeling.(DESIGN FOR MANUFACTURING)
July 1, 2006... EXECUTIVE OVERVIEW OPC models for leading-edge lithography must be calibrated with empirical data, and the measure of mismatch between design-intent and CD-SEM data is termed edge-placement error (EPE). A new methodology of EPE measurement...

Searching for greater fab productivity with 300mm Prime.(FAB MANAGEMENT)(standard mechanical interface)(work-in-process)
July 1, 2006... EXECUTIVE OVERVIEW The ability to improve IC manufacturing costs has been one of the great success stories of the semiconductor industry. The dramatic reduction in cost per transistor has been enabled by vast technology innovation. Recent...

2D, 3D X-ray inspection system.(PRODUCT NEWS)
July 1, 2006... The Cougar-SMT X-ray inspection system can image components in 2D and 3D for thorough inspection of applications requiring high magnifications, such as MEMS/MOEMS, semiconductor packages, and high-density interconnects. It includes a microfocus...

Step-and-repeat litho system.(PRODUCT NEWS)
July 1, 2006... The JBX-6300FS is a spot-beam, vector-scan, step-and-repeat lithography system designed for high volume direct patterning on wafers, capable of writing minimum linewidths of 8nm. Wafers with diameters ranging from 2-8 in. can be accommodated,...

HDD, MRAM metrology.(PRODUCT NEWS)
July 1, 2006... The MRW3 is a third-generation magnetic metrology system for measuring magnetic properties of hard-disk drive (HDD) recording heads and magnetoresistive random-access memory (MRAM) on product wafers for production control and early detection of...

Steam purification, delivery.(PRODUCT NEWS)
July 1, 2006... The Intaeger system produces ultrahigh-purity steam and process control by boiling de-ionized water, removing contaminants such as dissolved gases, eliminating metallic impurity sources, and reducing particle sources. The company claims purity...

Ellipsometry-based thin-film metrology.(PRODUCT NEWS)
July 1, 2006... The $3000 and $2000 ellipsometry-based metrology systems, for [less than or equal to] 0.18[micro]m 300mm and 200mm device fabrication, are designed for thin-film (thickness 20-20,000[Angstrom]) metrology, with modules for thin-film, CMP, etch,...

New photochemical dispensing system.(PRODUCT NEWS)
July 1, 2006... The IntelliGen Mini Dispense System for new and retrofit applications features a two-stage dispense technology so that filtration occurs at an independent rate of dispense, enabling the use of 10mm and below filter pore sizes for maximum defect...

Wet chemistry analysis.(PRODUCT NEWS)
July 1, 2006... The WetSpec 200 is an in-line wet chemistry analyzer for real-time monitoring of chemical concentrations of liquids in wet processes. The system supports up to eight channels in parallel, measuring different chemistry components. The software...

DRIE etching tool.(PRODUCT NEWS)
July 1, 2006... The AMS 200 I-Productivity DRIE tool offers silicon etch rates of up to 32 [micro]m/ min. Hardware and proprietary design improvements have been made to the vacuum pumping lines, process chamber, wafer chucks, and pressure control system. Gas...

Ultrasmall metrology system.(PRODUCT NEWS)
July 1, 2006... The LittleFoot metrology system offers an ultrasmall footprint (84x119cm) that is 64% smaller than earlier generation n&k systems, thanks to a new wafer handling mechanism. Capabilities include film thickness measurement and determination of...

Confocal laser scanning microscope.(PRODUCT NEWS)
July 1, 2006... The LEXT OLS3000 confocal laser scanning microscope is designed for submicron imaging, with 0.12[micro]m linewidth resolution and magnification power of 120-14,400x. The company says ideal 2D measurement applications are 1.5mm-1[micro]m widths,...

Turbomolecular pump.(PRODUCT NEWS)
July 1, 2006... The STP-XA4503C turbomolecular pump, for use with electron microscopes, metrology systems, and lithography systems, offers high performance in the process pressure range of high vacuum to 2000sccm process flow, with enhanced throughput for all...

Helium ion microscope.(PRODUCT NEWS)
July 1, 2006... The LookingGlass LG-2 helium ion microscope uses helium ions in a beam as the imaging particles. Because ions can be focused into a smaller probe size and have less sample interaction, the system can generate higher-resolution images with more...

Optical fiber thermometer.(PRODUCT NEWS)
July 1, 2006... The OR4000 line of optical fiber thermometers offers noncontact temperature measurement for RTP, HDP-CVD, MO-CVD, UV cure, and a variety of other semiconductor processes. It has multichannel capabilities and supports read rates up to 2KHz. The...

Ozonated water delivery system.(PRODUCT NEWS)
July 1, 2006... The Liquozon Loop03 ozonated water delivery system is an ultracompact standalone system offered as an alternative to existing semiconductor cleaning technologies, offering up to 12 L/min of DI[O.sub.3] at ozone concentrations to 40/75 ppm, with...

Lab capillary rheometer.(PRODUCT NEWS)
July 1, 2006... The RheoCapillary laboratory capillary rheometer determines the flow behavior of a wide range of materials, measuring shear viscosity, extensional viscosity, wallslip, melt fracture, and rupture with a variety of dies and accessories. A twin...

Burn-in-with-test system.(PRODUCT NEWS)
July 1, 2006... The LM-1 Logic and Memory Burn-In System is a burn-in-with-test system that can be customized for different device types during the same burn-in cycle, such as high and low-power logic devices, flash memories, DRAMs, and SRAMs. The system has...

Integrated control loop.(PRODUCT NEWS)
July 1, 2006... The EZ-ZONE ST integrated control loop combines temperature control, power control, safety shut-down, and power disconnect in a single package. It features a PID temperature controller already connected to a high amperage solid-state relay with...

Benchtop ph meter.(PRODUCT NEWS)
July 1, 2006... The Orion 2-Star benchtop pH meter features up to three-point calibration, auto calibration compatible with NIST and DIN buffers, and a 50-point data log to store information within the unit. Measurement range is pH0-14.999, with 0.1-0.001...

Flip-chip placement platform.(PRODUCT NEWS)
July 1, 2006... The AdVantis XS is a flip-chip placement platform designed for high-end assembly applications in semiconductor and standard surface mount assembly. It offers a 4-spindle and/or 7-spindle head, specialized component feeders, and high-resolution...

Scriber/breaker.(PRODUCT NEWS)
July 1, 2006... The DM-8510 scriber/breaker is designed to separate III-V wafers (GaAs, GaN, and InP) and ceramic substrates during manufacturing of LEDs, power laser diodes, RF micro devices, and MEMS. It can separate wafers up to 150mm in diameter, with an...

Heat-curing epoxy.(PRODUCT NEWS)
July 1, 2006... The EP17 one-component heat-curing epoxy adhesive/sealant is a flowable paste used to bond a variety of substrates including metals, glass, ceramics, vulcanized rubbers, and many plastics. It has a service operating range of -300-600[degrees]F,...

Mercury probe system.(PRODUCT NEWS)
July 1, 2006... The CV92M mercury probe system tests blanket wafers up to 200mm dia., forming contacts on a limited number of sites on the wafer or on small pieces. Contact areas are 3E-5 [cm.sup.2] to 0.5 [cm.sup.2], with contact area repeatability >2%....

Real-time process refractometer.(PRODUCT NEWS)
July 1, 2006... The PR-23-M real-time process refractometer measures the concentrations of process liquids such as HF, HCl, KOH, IPA, PGMEA, NMP, N[H.sub.4]OH, [C.sub.2][H.sub.6][O.sub.2], and C[H.sub.3]COCH to help prevent out-of-spec chemicals from...

Electrical test tool.(PRODUCT NEWS)
July 1, 2006... The Eliminator 6 electrical test tool eliminates test points required by flying probe test (FPT) systems, enabling fixtureless, quick test preparation for high-volume production electrical test. Applications include substrates, IC packages, and...

Line of achromatic lenses.(PRODUCT NEWS)
July 1, 2006... The Tech Spec line of achromatic lenses, consisting of two optical components cemented together to form an achromatic doublet, incorporate a multilayer broadband antireflection coating designed to minimize reflections in the visible spectrum....

Piezoelectric nanopositioning controller.(PRODUCT NEWS)
July 1, 2006... The E-761 PCI-bus piezoelectric nanopositioning controller is for closed-loop piezoelectric positioners and scanners. Features include polynomial linearization and coordinate transformation, with 32-bit DSP and 24-bit D/A converters for...

Particle filters.(PRODUCT NEWS)
July 1, 2006... The MaxP particle filters are designed to capture contaminants that harm mass spectrometer helium leak detectors (MSLD) and associated vacuum pumps, minimizing the loss of performance from leak detectors and pumps, while extending the system...

Perfluoroelastomer seal material.(PRODUCT NEWS)
July 1, 2006... The Chemraz 551 perfluoroelastomer seal material is specifically designed for wet surface preparation in semiconductor processes, as an alternative to similar applications that require broad chemical resistance and higher temperature tolerance....

Containing wafer costs while customizing CMOS.(INDUSTRY FORUM)(complementary metal oxide semiconductor)
July 1, 2006... In the late 1980s and early 1990s, CMOS became increasingly standardized as dimensions shrunk from 1[micro]m to 0.8[micro]m, then from 0.6[micro]m to 0.5[micro]m, and then At the 0.25[micro]m generation, processes for different applications...