Solid State Technology articles from July 2005

Solid State Technology archives from July 2005

Detecting profile excursions using spectroscopic ellipsometry.(Brief Article)
July 1, 2005... The capability of a spectroscopic ellipsometry-based profile technology is evaluated as a new metrology tool to monitor polysilicon gate processes at the 130nm and 90nm nodes. This study has proven that the tool can consistently flag different...

The urgent need for process collaboration.(Editorial)
July 1, 2005... Makers of advanced microchips have been doing a magnificent job of bringing 300mm wafer labs on stream and ramping to even better yields than they had hoped for as they moved from 130nm to 90nm. Toolmakers have been cooperating by designing...

Chipmakers deliver surprise 1Q inventory burnoffs.(BUSINESS TRENDS)
July 1, 2005... The value of surplus chip stockpiles in the electronics supply chain plunged 51.5% from 4Q04 to $500 million in 1Q05, according to iSuppli Corp., far outpacing the analyst firm's estimates of a 25% drop. Excess inventory levels had grown to...

Semi Silicon Manufacturers Group.(Brief Article)
July 1, 2005... Total worldwide silicon-wafer area shipments slipped to 1465 million sq. in. (MSI) in 1Q05, down 1.4% from 4Q04 and 4.2% from 1Q04, according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry....

Semiconductor Industry Association (USA).(Brief Article)
July 1, 2005... Supporting university R&D on microchip technology contributes to economic prosperity and national security, according to chip industry representatives lobbying Congress to appropriate $20 million for the Focus Center Research Program (FCRP) for...

Semiconductor Manufacturing International Corp. (SMIC) and Singapore-based United Test and Assembly Center Ltd. (UTAC) have agreed to form a joint venture to provide assembly and testing services in Chengdu, targeting memory and logic.(China)
July 1, 2005... Semiconductor Manufacturing International Corp. (SMIC) and Singapore-based United Test and Assembly Center Ltd. (UTAC) have agreed to form a joint venture to provide assembly and testing services in Chengdu, targeting memory and logic. SMIC...

Samsung Electronics Co. Ltd.(develops new diagnostic software ESCORT )(Brief Article)
July 1, 2005... Samsung Electronics Co. Ltd. has developed new diagnostic software to detect design errors before moving into the prototype stage. ESCORT (Estimation of Chip Performance on Process Tolerance) simulates early stages of product development to...

MagnaChip Semiconductor Ltd.(company sales and earnings)(Brief Article)
July 1, 2005... MagnaChip Semiconductor Ltd., the former nonmemory business of Hynix Semiconductor spun off last year, reported a 1Q05 net loss of $31.3 million on sales of $213.4 million, vs. a net loss of $23.8 million on $243.6 million in sales in 4Q04....

STATS ChipPAC Ltd.(to offer 300mm electroplated wafer-bumping services )(Brief Article)
July 1, 2005... Semiconductor packaging design/assembly/ test provider STATS ChipPAC Ltd. plans to begin offering 300mm electroplated wafer-bumping services in 3Q05, by using consigned equipment at Taiwan Semiconductor Manufacturing Co. (TSMC). The company...

Royal Philips Electronics.(EUROFOCUS)(Brief Article)
July 1, 2005... Royal Philips Electronics, Amsterdam, The Netherlands, has regrouped its semiconductor division into four units: a new unit for automotive and identification applications; and mobile and personal; home; and multimarket semiconductor...

Exotic new nonvolatile memories look to challenge flash on cost.(TECHNOLOGY NEWS)
July 1, 2005... Some of those exotic new technologies being explored as alternatives to flash memory when conventional scaling hits a wall from 45nm now look like they may likely challenge traditional flash on cost before that, thanks to focus on new...

Elpida plans to use phase-change capacitors in DRAMs next year.(Brief Article)
July 1, 2005... Alternative technologies for memory that can also be erased and rewritten will take a little longer, but apparently not as long as once thought. While Intel and STMicroelectronics may be pursuing phase-change memory as a mainstream replacement...

Samsung eases production of resistive memory with CMOS-compatible materials.(complementary metal oxide semiconductors, Samsung Electronics Company Ltd.)
July 1, 2005... Although Samsung seems to be working on almost all potential varieties of new memory, it's talking with the most enthusiasm about its version of resistive memory. This discussion suggests Samsung's OxRRAM process could be the candidate to...

Chemistry and process challenges in advanced materials processing.(FRONT END OF LINE)
July 1, 2005... The push of leading-edge manufacturing technologies toward sub-0.1[micro]m feature sizes places extreme performance demands on manufacturing processes and equipment. Improved device performance requirements have led to the examination of...

Wafer manufacturing issues for III-V optoelectronics.(COMPOUND SEMICONDUCTORS)
July 1, 2005... Optoelectronic devices using III-V compound semiconductor materials are increasingly central to optical communications. One of the III-V materials systems on which they are based--indium phosphide (InP)--is of particular importance because it...

Fabrication and assembly of 3D MEMS devices.(MEMS)
July 1, 2005... The ability to integrate mechanical elements with supporting electronics on a micro scale has bolstered micro-electromechanical systems (MEMS) as an enabling technology, sparking interest in an impressive range of applications. The fabrication...

Meeting challenges for engineering the gate stack.(GATE STACK ENGINEERING)
July 1, 2005... OVERVIEW Precise interfacial layer control and film compositional control are needed to extend SiON layers with high nitrogen content for 32nm node high-performance (HP) logic devices, as well as when Hf-based films at the 65nm node are...

Introduction of stress requires stress metrology methods.(METROLOGY SERIES, PART III)
July 1, 2005... OVERVIEW Although stress has been used to increase carrier mobility for the past several years, its measurement and control have also proven difficult. With the increasing demands on IC manufacturers to get more mileage out of each...

Organic growth on pattern side of reticles gives rise to new progressive mask defects.(CONTAMINATION CONTROL)
July 1, 2005... OVERVIEW Unexplained progressive mask defects continue to plague and puzzle semiconductor manufacturers. Even if new reticles are determined to be clean upon arrival from mask shops, some photomasks show catastrophic defect growth over the...

Development to manufacturing using integrated scatterometry.(METROLOGY)
July 1, 2005... OVERVIEW Integrated scatterometry will be an essential part of the monitoring and control in product manufacturing at the 65nm node and beyond. Several integrated scatterometry applications are being developed and implemented-, while many...

Options at the 45nm node include engineered substrates.(MATERIALS)
July 1, 2005... OVERVIEW Compatibility with existing design methodology dictates the continued use of planar transistors at the 45nm technology node. Engineered substrates, however, offer a way to significantly enhance prior node performance through back...

Data collection and networking capabilities enable pump predictive diagnostics.(VACUUM TECHNOLOGY)
July 1, 2005... OVERVIEW Predictive diagnostics techniques are applied to networked vacuum systems in wafer-processing applications using an array of data collection, mining, and advanced analysis concepts. By utilizing data collection and networking...

S/D extension formation for sub-65nm transistors.(IMPLANTATION)
July 1, 2005... OVERVIEW The increasing demand for high-performance computers and the widespread use of more complex consumer products continue to fuel the scaling of leading-edge logic devices. In particular, CMOS FETs must be scaled laterally as well as...

Removal of metal carbonyl and moisture impurities through POU purification of CO gas.(GASES/GAS HANDLING)
July 1, 2005... OVERVIEW An elaborate testing methodology is used to study the impurity removal characteristics of point-of-use carbon monoxide gas purifiers. Test results demonstrate efficient removal of impurities, such as harmful metal carbonyls and...

Improving yield at 65nm using Cu thickness monitoring and control.(CMP)
July 1, 2005... OVERVIEW The dual-damascene process used to create copper interconnect exhibits nonuniformities in both Cu deposition and removal rates that, if not closely controlled, result in structures of varying thickness or unwanted residual...

Inspection tool extends to critical etch layers.(PRODUCT NEWS: SEMICON[R] West 2005)
July 1, 2005... The Puma 9000 tool series provides scattering physics with high-resolution imaging to deliver highly sensitive patterned-wafer inspection without sacrificing throughput. Its Streak technology combines a linear mukipixel sensor with a...

Single-wafer ion implanter addresses 65nm node.(PRODUCT NEWS: SEMICON[R] West 2005)
July 1, 2005... The Optima MD single-wafer ion implanter platform provides high productivity for mid-dose implant applications at the lowest energy ranges, especially high-tilt HALO processes. The system's energy range of 500eV-750keV allows well and channel...

System images defects with sub-30nm sensitivity.(PRODUCT NEWS: SEMICON[R] West 2005)
July 1, 2005... The UVision inspection system reportedly allows chipmakers to find critical defects that have been previously undetectable with other brightfield inspection systems. Featuring laser-based 3D ultrabrightfield technology, the system combines...

System integrates etching and metrology for 65nm and below.(PRODUCT NEWS: SEMICON[R] West 2005)
July 1, 2005... The Telius SP integrated etch system addresses the 65nm node and beyond. Integration enables an etch reactor with integrated metrology to offer wafer-by-wafer measurement for critical dimension (CD). It also provides profile information for...

XRD enables detection of defects on surface and wafer bulk.(PRODUCT NEWS: SEMICON[R] West 2005)
July 1, 2005... The BedeScan digital x-ray inspection tool identifies and quantifies structural defects in semiconductor wafer substrates and epilayers up to 300mm. The tool uses nondestructive x-ray diffraction (XRD) to locate a wide range of anomalies,...

System uses darkfield and brightfield for edge and backside inspection.(PRODUCT NEWS: SEMICON[R] West 2005)
July 1, 2005... The Reflex MC EBI is a wafer-inspection system for combined edge and backside defect inspection on unpatterned 300mm wafers. Two metrology modules are housed in one ultracompact MetriCube enclosure with its own mini-environment and two loading...

Open-architecture tester addresses cost and space with smaller SoC platform.(PRODUCT NEWS: SEMICON[R] West 2005)
July 1, 2005... The T2000 test platform has incorporated the smaller MS mainframe, a 125MHz high-speed digital test module, and a 500mA multiple power-supply module for testing mid-range SoC devices. It uses test modules that perform high-speed test and very...

Macrodefect tool reduces inspection time/wafer to ~30 sec.(PRODUCT NEWS: SEMICON[R] West 2005)
July 1, 2005... The WaferView 320 Turbo macrodefect inspection tool offers ultrahigh-throughput inspection of all wafer surfaces, providing manufacturers the opportunity to recover more wafers before they undergo irreversible processing steps. Each dual...

Integrated flow controller.(PRODUCT NEWS: SEMICON[R] West 2005)
July 1, 2005... The NT integrated flow controller (IFC) Model 6510 provides automated closed-loop flow control with a small footprint for point-of-use chemical blending and dispense applications. The IFC uses its reduced footprint to save space in liquid...

Defect data-analysis solution.(PRODUCT NEWS: SEMICON[R] West 2005)
July 1, 2005... DMS Decision software manages and analyzes all-surface, advanced macrodefect data. Automated wafer-level defect classification (ADC), automated wafer dispositioning, and patented sampling strategies, combined with all-surface management and...

Process-equipment leveling device.(PRODUCT NEWS: SEMICON[R] West 2005)
July 1, 2005... The WaferSense ALS is a wireless, wafer-like leveling tool that enables lab engineers to quickly and easily measure the levelness and coplanarity of wafer-processing equipment and make necessary adjustments. Thin and lightweight, it is handled...

Ask the expert.
July 1, 2005... Q My LPCVD silicon nitride process has hit its limit at 680[degrees]C. How can I reduce my thermal budget without sacrificing film quality? A Maintaining film performance and quality while managing a thermal budget is a challenge faced by...

CMP outsourcing services.(PRODUCT NEWS: SEMICON[R] West 2005)(Brief Article)
July 1, 2005... A chemical mechanical planarization (CMP) foundry offers services for all materials and wafers up to 200mm, from product prototyping to high-volume manufacturing. Services rendered have included outsourced CMP production for IDMs; development...

Filter for semiconductor processes.(PRODUCT NEWS: SEMICON[R] West 2005)(Brief Article)
July 1, 2005... The Lithoguard-12 cabinet filtration system provides S[O.sub.2] control for ArF scanners, filtering ambient chemistry down to parts-per-trillion. High-performance AMC filtration was validated in independent testing. The system features...

Contamination-monitoring tools.(PRODUCT NEWS: SEMICON[R] West 2005)(instrument industry )(Brief Article)
July 1, 2005... A new generation of surface photovoltage (SPV) tools allows measurements of Fe contamination down to

Contamination analyzer.(PRODUCT NEWS: SEMICON[R] West 2005)(analytical instruments)(Brief Article)
July 1, 2005... A photochemical organic contamination (POC) analyzer continuously monitors contaminants such as nonmethane hydrocarbons and siloxanes and provides real-time results. With detection limits in the low parts-per-billion range, the analyzer can...

Package assembly work cell.(PRODUCT NEWS: SEMICON[R] West 2005)(Brief Article)
July 1, 2005... The MRSI-M5 assembly work cell provides advanced assembly solutions for complex epoxy die attach and eutectic and flip-chip bonding, in the semiconductor and electronic packaging markets. The entire machine base is formed of a cast polymer...

Mass flow controller.(PRODUCT NEWS: SEMICON[R] West 2005)(control valves)(Brief Article)
July 1, 2005... The Aera PI-980 series pressure-insensitive mass flow controller (MFC) is suited for etch, CVD, PVD, and diffusion applications. Its design integrates traditional thermal flow technology with a pressure sensor, temperature sensor, and patented...

Wire-bonding capillary.(PRODUCT NEWS: SEMICON[R] West 2005)(Brief Article)
July 1, 2005... The Nexxus capillary increases wire-bonding process productivity by reducing the number of assists related to wire-bonding capillary failures. Fewer assists allow a more robust bonding process, with higher uptime. The capillary is suitable for...

CMP metrology tool.(PRODUCT NEWS: SEMICON[R] West 2005)(Brief Article)
July 1, 2005... The NanoXam system measures dishing of wide lines and erosion of fine-line arrays for copper and tungsten CMP-process monitoring and characterization. The noncontact design uses low-noise interferometry to measure both scribe line monitors and...

Plasma generator.(PRODUCT NEWS: SEMICON[R] West 2005)(Brief Article)
July 1, 2005... The Astron hf-s high-power remote plasma system cleans undesired deposits from process chamber walls. Based on low-field toroidal plasma technology, the plasma source provides increased power to run N[F.sub.3] flows up to 15slm and alternative...

Fluorescence microscopy system.(PRODUCT NEWS: SEMICON[R] West 2005)(Brief Article)
July 1, 2005... The TCS 4PI microscope allows 3-7x higher axial resolutions of structures. The system uses a phase- and wavefront-corrected interferometer system linked to a confocal scanner to enable four- to sevenfold increased axial resolution over confocal...

Plasma etch system.(PRODUCT NEWS: SEMICON[R] West 2005)(Brief Article)
July 1, 2005... The BenchMark inductive coupled plasma (ICP) etcher is a high-performance plasma-processing system capable of deep reactive-ion etching (DRIE) and low-temperature [Si.sub.3][N.sub.4] and Si[O.sub.2] deposition. The system accommodates a variety...

Lithography filter system.(PRODUCT NEWS: SEMICON[R] West 2005)(Brief Article)
July 1, 2005... The ex2600 is a filter system designed for 193nm step-and-scan lithography tools, including both conventional and immersion-based systems. It is intended for use as the primary filtration system on the latest generation of step-and-scan...

Portable particle counter.(PRODUCT NEWS: SEMICON[R] West 2005)(monitoring systems)(Brief Article)
July 1, 2005... The SOLAIR 1100+ particle counter offers a sensitivity of 0.10[micro]m and a flow rate of 1.0CFM (28.3lpm), and features long-life enhanced active cavity laser technology that reportedly provides higher power, purged optics, a better...

Screw-rail for positioning applications.(PRODUCT NEWS: SEMICON[R] West 2005)(hardware)(Brief Article)
July 1, 2005... The Mini ScrewRail is appropriate for use in the semiconductor industry; applications include picking or positioning discreet components, including fine-pitch devices and BGAs. It consists of a precision rolled lead screw, supported by sealed...

Vacuum chuck.(PRODUCT NEWS: SEMICON[R] West 2005)(Brief Article)
July 1, 2005... The Metapor vacuum chuck can hold 100, 200, and 300mm wafers without causing deformations and meets stringent inspection requirements. It is air-permeable over the entire surface due to its microporous structure, which allows elimination of...

Series 95 control/isolation system.(LITERATURE showcase)(Control valves)(Brief Article)
July 1, 2005... VAT now offers a combined Series 61.2 butterfly control valve and Series 12.1 isolation gate valve a single piece valve body. Provides excellent pressure control vacuum isolation and serviceability. Saves valuable system space reduces vacuum...

iGX drypump series.(LITERATURE showcase)(vacuum pumps)(Brief Article)
July 1, 2005... The BOC Edwares iGX Dry vacuum Pump Series provides a versatile, reliable high-performance Dry vacuum pump platform for applications from loadlock and wafer handling to meta etch and ion implant. Compact size and low vibration allow the iGX to...

Electrical/optic seals.(LITERATURE showcase)(Brief Article)
July 1, 2005... Standard and custom hermetic designs. Low or high pressures or vacuums. Any cable type or pin connector may be specified. Circular or rectangular seals including micro D-sub. Design flexibility, low cost, compact sizes, high corrosion...

Cassette-based loadlock system.(PRODUCT NEWS: SEMICON[R] West 2005)(Brief Article)
July 1, 2005... The Carousel 200, a compact, high vacuum-compatible, cassette-based loadlock system delivers wafers or other flat substrates from a SEMI standard or custom cassette into a process module. Magnetically coupled dual linear-drive mechanisms, an...

Manual PTFE valve.(PRODUCT NEWS: SEMICON[R] West 2005)(dymatrix NMV valve )(Brief Article)
July 1, 2005... The Dymatrix NMV valve has a needle plug with PTFE diaphragm seal, allowing for precise linear flow control. Constructed from high-purity PTFE, the valve is suited for HP chemical processing and CMP applications. Its design features a diaphragm...

DFM issues new rules for IDMs, foundries: Solid State Technology asked industry execs to comment on the proliferation of DFM solutions and their integration into the product flow.(PERSPECTIVES)
July 1, 2005... Design-for-manufacturing: Who is buying? Michel Villemain, VP, marketing, circuit edit and mask repair division, FEI Co., Sunnyvale, California The industry has always practiced design-for-manufacturing (DFM)--even back when the...