Solid State Technology articles from July 2003

Solid State Technology archives from July 2003

What's next? pervasive intelligence? (Editorial).(Electronics industry)
July 1, 2003... Looking back, it's easy to recall that the huge "killer" applications for electronics that led to booms in the semiconductor industry were obvious. But in the early phases, it wasn't always that easy to predict that something would turn out to...

BOC Edwards. (Corporate Profile).
July 1, 2003... BOC Edwards is a leading supplier of integrated solutions for the manufacture of microelectronics devices, including silicon semiconductors, compound semiconductors and fiat panel displays. Partnering with fabs, foundries and process tool...

Chip sales unchanged, B-to-B drops in April. (Business Trends).(Worldwide sales of semiconductors )
July 1, 2003... Worldwide sales of semiconductors totaled $12.1 billion in April, essentially the same total as March, but a 9.7% increase from April 2002 revenue of $11.3 billion, according to data from the Semiconductor Industry Association (SIA). SIA...

Worldwide highlights.(World Semiconductor Council called on China to open its market fully to all foreign semiconductor products)(Brief Article)
July 1, 2003... The World Semiconductor Council (WSC) recently called on China to open its market fully to all foreign semiconductor products. Specifically, the WSC urged China, which is a member of the World Trade Organization (WTO), to honor its WTO...

Brooks Automation Inc. (World News: USA).(will not acquire Berkeley Process Control)(Brief Article)
July 1, 2003... Brooks Automation Inc., Chelmsford, MA, said privately held Berkeley Process Control Inc. has terminated its agreement for Brooks to acquire Berkeley, a transaction that was targeted for completion by the end of CY02. The companies have...

National Semiconductor. (World News: USA).(Brief Article)
July 1, 2003... National Semiconductor, Santa Clara, CA, will cut about 340 jobs and close a business unit as part of its efforts to reduce costs. The company will close down a unit that makes components for cell phones, and is in discussions to sell its...

EBARA Technologies Inc. (World News: USA).(Joins SiLKnet Alliance data network to develop CMP processes with SiLK semiconductor dielectric films )
July 1, 2003... EBARA Technologies Inc., Sacramento, CA, the US subsidiary of EBARA Corp., Japan, has joined the SiLKnet Alliance data network to develop CMP processes with SiLK semiconductor dielectric films on its FREX CMP tool platforms. The SiLKnet...

The MEMS Industry Group (MIG). (World News: USA).(joined by Micralyne Inc. and Fairchild Semiconductor )(Brief Article)
July 1, 2003... The MEMS Industry Group (MIG), a trade association representing the MEMS and microstructures industries, has added Edmonton, Alberta-based Micralyne Inc. and South Portland, ME-based Fairchild Semiconductor to its roster of 40 members.

Cascade Microtech Inc. (World News: USA).(licensed rf measurement technology to Tokyo Seimitsu)(Brief Article)
July 1, 2003... Cascade Microtech Inc., Beaverton, OR, has licensed rf measurement technology to Tokyo Seimitsu Co. Ltd. The company said the technology transfer will lead to faster and more accurate rf testing of advanced semiconductor devices during...

Motorola Inc. (World News: China).(donates equipment and money to stop SARS)(Brief Article)
July 1, 2003... Motorola Inc., Schaumburg, IL, has donated $1.48 million worth of communications equipment and employee donations to China in support of the effort to combat the spread of SARS. Resources donated by Motorola will be mainly delivered to the...

Intel Corp. (World News: India).(planning Indian design facility)(Brief Article)
July 1, 2003... Intel Corp., Santa Clara, CA, plans to invest $41 million in India to set up a facility where it will design and develop a new generation of microprocessors. The company said it hopes to more than double the number of engineers it employs in...

Hitachi Chemical Co. Ltd. and JSR Corp. (World News: Japan).(Joint formation of Consortium for Advanced Semiconductor Materials and Related Technologies )(Brief Article)
July 1, 2003... Ten Japanese manufacturers of semiconductor materials, including Hitachi Chemical Co. Ltd. and JSR Corp., have formed the Consortium for Advanced Semiconductor Materials and Related Technologies (CASMAT), according to a report published in...

Renesas Technology Corp. (World News: Japan).(proposing to other domestic firms that they collaborate on the construction of semiconductor mass production lines)(Brief Article)
July 1, 2003... Renesas Technology Corp., Tokyo, has begun proposing to other domestic firms that they collaborate on the construction of semiconductor mass production lines compatible with 300mm silicon wafers. The company aims to ensure production capacity...

Korea Semiconductor Industry Association (KSIA). (World News: Korea).(Korean semiconductor trade balance in April, 2003)(Brief Article)
July 1, 2003... The Korean semiconductor trade balance showed signs of recovery in April after posting its largest deficit in 1Q03. According to the Korea Semiconductor Industry Association (KSIA), outbound shipments of microprocessor chips hit $1.35 billion...

Hynix Semiconductor Inc. (World News: Korea).(will begin volume production on its next-generation Golden Chip platform)(Brief Article)
July 1, 2003... Hynix Semiconductor Inc., Seoul, will begin volume production on its next-generation Golden Chip platform using its 0.10[micro]m process technology. Hynix will focus on 512Mb DDR and 512Mb DDR2 SDRAM production, to be followed by a 1Gb DDR2...

Taiwan Semiconductor Manufacturing Co. (TSMC). (World News: Taiwan).(expecting stronger sales)(Brief Article)
July 1, 2003... Taiwan Semiconductor Manufacturing Co. (TSMC) expects its revenue to rise 20% this year, based mainly on strong orders for high-end chips. TSMC chairman Morris Chang said high-end orders are so strong that the company's advanced process...

ProMOS Technologies Inc. (World News: Taiwan).(dispute with Infineon Technologies AG)(Brief Article)
July 1, 2003... ProMOS Technologies Inc., Taipei, has asked the International Chamber of Commerce to arbitrate a dispute with Infineon Technologies AG, Munich, Germany, over a technology transfer pact. ProMOS wants the chamber's court to rule that it can use...

Soitec, Bernin, France, and ASM International. (World News: Eurofocus).(strategic partnership )(Brief Article)
July 1, 2003... Soitec, Bernin, France, and ASM International, Bilthoven, The Netherlands, have announced a strategic partnership to ensure the commercial manufacturability of strained silicon-on-insulator (sSOI) substrates. Soitec and ASM will team up to...

STMicroelectronics. (World News: Eurofocus).(acquires Incard assets)(Brief Article)
July 1, 2003... STMicroelectronics, Geneva, Switzerland, has acquired the assets and business of Italy-based Incard SpA from the IPM Group.

Altis Semiconductor. (World News: Eurofocus).(to build R&D center)(Brief Article)
July 1, 2003... Altis Semiconductor, Corbeil-Essonnes, France, a joint venture between IBM Microelectronics and Infineon Technologies AG, will invest $202 million over three years to build an R&D center. Research will focus on developing a new generation of...

Wacker-Chemie. (World News: Eurofocus).(to buy Nippon Steel's stake in their chip joint venture)(Brief Article)
July 1, 2003... Wacker-Chemie GmbH, Munich, Germany, will buy Nippon Steel's stake in their chip joint venture, which has silicon wafer production plants in Yamaguchi Prefecture, southern Japan, and Malaysia. The Wacker-Chemie group also plans to halt 6-in,...

Is THIS the industry's next killer app? (Technology News).
July 1, 2003... Pieter "Pete" Burggraaf The concept of "wearable electronics," which last year came out of the Emerging Technology Labs at Infineon Technologies, Munich, Germany, has now expanded to "smart textiles." Briefly, the basis of this technology...

Novel techniques for cost-effective high-Q inductors. (Technology News).(from IMEC)(Brief Article)
July 1, 2003... Pieter "Pete" Burggraaf IMEC, Leuven, Belgium, has developed a novel technique for fabricating high-Q inductors, cost-effectively, on top of processed state-of-the-art RF and microwave ICs (Fig. 1). Specifically, it is a wafer-level...

CSP RF-integration breakthrough. (Technology News).(Tessera has introduced a chip-scale packaging solution )
July 1, 2003... Pieter "Pete" Burggraaf Available for licensing and supported by design services, Tessera, San Jose, CA, has introduced a chip-scale packaging (CSP) solution -- trademarked Pyxis -- for integrating RF modules for cell phones and other...

Proving the value of bulk source flow for epi. (Technology News).
July 1, 2003... Pieter "Pete" Burggraaf Data from INFICON, East Syracuse, NY, demonstrates the value of precise in situ control of precursor gas concentration in an MOVPE process. Specifically, it shows sensing capability that measures bulk flow (i.e.,...

Ultra low voltage SEM's impact on metrology. (Technology News).
July 1, 2003... Pieter "Pete" Burggraaf Schlumberger Verification Systems, Concord, MA, foresees increased metrology capability in SEM technology at or below 250eV landing energies (i.e., "ultra low voltage"). Neal Sullivan, director of technology at the...

Multilayer resist strategies. (Front End of Line).
July 1, 2003... IC manufacturers face a number of economic pressures today, not the least of which is the high cost of transitioning to tools with shorter wavelengths or higher numerical apertures. This, in turn, challenges lithographers to maximize the life...

Learning from recording head manufacturing about 3-D structural process control. (Interconnect).
July 1, 2003... The industry's trend to more device structures stacked on a die, increasingly including copper interconnects and low-k dielectrics, has forced the need to develop techniques that will let us see, measure, and ultimately control these...

Seminar series 03: Process Outlook Forum.
July 1, 2003... Join the more than 300 industry professionals already participating in the Process Outlook Forum! Find out what's ahead for semiconductor process technology in the next five years from the industry's leading experts. Each one-hour web-based...

Using learning curve theory to redefine Moore's Law. (Fab Management).
July 1, 2003... OVERVIEW In the past 40 years, Moore's Law has grown beyond its original intentions. As a result, it is in danger of losing its meaning, and possibly its usefulness. But questions about the law can be addressed by looking at its history. In...

Grain control. (Electronic Materials Integrated Solutions).(Honeywell Electronic Materials' patented Equal Channel Angular Extrusion technology )(Brief Article)
July 1, 2003... Exclusive ECAE[R] Technology Provides Total Performance Benefits Honeywell Electronic Materials' patented* Equal Channel Angular Extrusion (ECAE) technology is an advanced target process for Aluminum (Al) and Al alloys. Targets processed...

A critical analysis of techniques and future CD metrology needs. (Metrology Series:).
July 1, 2003... Part 1 Determining the limits of various CD-metrology methods is extremely important for future IC manufacturing. Venerable CD-SEM is at a crossroad where new direction is needed; the limits of scatterometry are not well characterized; and...

ArF and [F.sub.2] lithography using bilayer resists. (Resists).
July 1, 2003... OVERVIEW Contamination of the exposure system optics with silicon has been identified as a major issue for the adoption of bilayer technology across all wavelengths. A laser outgassing system was developed and calibrated using model...

Junction scaling using lasers for thermal annealing. (Thermal Processing).
July 1, 2003... The desire for ever-higher drive currents from MOS transistors has forced aggressive scaling of physical gate lengths over the past three decades, with no end in sight. Continued scaling alone cannot achieve significant performance improvement;...

Using an HDP reactor to make barrier stack etches for MEMS devices. (MEMS).
July 1, 2003... OVERVIEW Corrosion resistance, electromigration resistance, and compatibility with standard IC fabs make platinum attractive as an interconnect in MEMS applications. Platinum and lead zirconate titanate etch rates greater than 1000A/min...

Greene Tweed: reliable products, advanced technology, and collaborative services yield performance.(Company Profile)
July 1, 2003... FROM SEALS TO ENGINEERED COMPONENTS. With the precise demands of semiconductor processing, equipment must operate flawlessly--even down to the elastomeric seal or smallest plastic component. Because even the smallest failure could mean...

Diffusion barrier material for Cu metallization using ALD-[WN.sub.x][C.sub.y]. (Deposition).(atomic layer deposition)
July 1, 2003... OVERVIEW Currently, PVD-Ta-based thin films are the most commonly used materials as a diffusion barrier in the semiconductor industry. The maturity of the process makes it hard to replace or even change materials. Future requirements for...

Praxair Electronics. .(products)(Advertisement)
July 1, 2003... Praxair Electronics serves as a strong, integrated source for a wide array of materials, equipment and services used in the production of advanced silicon and compound semiconductors. With manufacturing facilities and technical support...

Moving from today's SOI to advanced substrate engineering. (Materials (Wafers)).(silicon-on-insulator)
July 1, 2003... As IC technology continues to grow, there will be an increasing need for engineered substrates tailored for specific applications. A viable route grows on wafer engineering that is already used for a high percentage of SOI wafers today. While...

Narrow n+/p+ isolation in retrograde well implants. (Ion Implant).
July 1, 2003... OVERVIEW As device dimensions continue to shrink, the lateral offset of the dopant due to shadowing effects becomes increasingly large relative to the size of the implanted well. This leads to variations in device and isolation performance...

Maximizing process latitude by specifying via/contact layer reticles. (Metrology for Lithography).
July 1, 2003... OVERVIEW Shrinking [k.sub.1] factors are making via and contact layers more difficult to print with acceptable latitude and low defectivity. A typical method for improving the common process window is to use embedded attenuated phase...

Analyzing available alternatives for point-of-use abatement. (Waste/Effluent Treatment).
July 1, 2003... OVERVIEW The continually growing array of materials used in deposition and other wafer processing applications requires continuous evaluation of exhaust abatement methods. In addition, newer point-of-use methods of abatement may provide...

Evaluating different approaches to critical HF-last cleaning. (Wafer Cleaning).
July 1, 2003... OVERVIEW While the basic chemistry used for cleaning silicon wafers still relies on HF and HCI, among others, increasingly the success of cleans for advanced processing lies in how these chemicals are controlled. One variation in control...

Metrology tool measures thin films. (Product Panorama).(Technos International S-MAT 2300)(Brief Article)
July 1, 2003... The S-MAT 2300 tool accurately measures thin films, including those of future device generations, including the 45nm node. Among parameters that can be measured are layer thickness, density, composition, and roughness. For porous layers, the...

Mass flow controller programmed with 10 gases. (Product Panorama).(Sierra Instruments Smart-Trak)(Brief Article)
July 1, 2003... The Smart-Trak digital mass flow controller offers an easy-to-use interface, rugged stainless steel construction, and digital performance. For applications where elastomer seals are acceptable, it is now possible to have premium digital...

Microscope camera delivering full view. (Product Panorama).(Optronics MacroFire)(Brief Article)
July 1, 2003... The MacroFire is a mega-pixel digital microscope camera designed to digitally capture the full 22mm field-of-view from a variety of microscopic imaging applications. MacroFire incorporates a four-megapixel CGD that measures 21.4mm in diagonal...

e-beam inspection system combines speed and sensitivity. (Product Panorama).(KLA-Tencor eS30)(Brief Article)
July 1, 2003... The eS30 e-beam inspection system provides the throughput and production worthiness required for electrical line monitoring. The eS30 combines speed, sensitivity, and ease-of-use into a single platform for all phases of the IC technology...

Analyzer detects many gases. (Product Panorama).(Tiger Optics LaserTrace)(Brief Article)
July 1, 2003... The LaserTrace moisture and oxygen analyzer is based on an emerging technology called cavity ring-dawn spectroscopy, which allows for fast, accurate, and easy detection of contaminants. The LaserTrace is a multispecies, multipoint, and multigas...

X-ray metrology tool is highly versatile. (Product Panorama).(Jordan Valley Semiconductors JVX 5200)(Brief Article)
July 1, 2003... The JVX 5200 x-ray metrology tool nondestructively measures film thickness, density, roughness, and elemental composition. Single films or complex stacks of all types can be measured with angstrom-level resolution and precision. Pattern...

Robot handles 300mm wafers. (Product Panorama).(from Ludl Electronic Products)(Brief Article)
July 1, 2003... This 300mm wafer-handling robot allows easy upgrade of 200mm or nonautomated systems with minimal investment. An over-under transfer scheme permits wafer handling within a small envelope and minimizes wafer exchange time. The robot's low height...

Dielectric etch system. (Product Panorama).(Applied Materials Enabler Centura)(Brief Article)
July 1, 2003... The Enabler Centura targets processing challenges arising from the growing variety of integration schemes and the increasing use of low-k films. The Enabler delivers high on-wafer etch rate and CD uniformities, and high-volume repeatability on...

Spectroscopic ellipsometer handles many films. (Product Panorama).(SOPRA IRSE-300)(Brief Article)
July 1, 2003... The model IRSE-300 automated, high-resolution, high-sensitivity infrared spectroscopic ellipsometer can characterize a wide diversity of advanced materials and films, including low-k dielectric films, thin epitaxial layers, thin diffusion...

Technology platform merges four systems. (Product Panorama).(Unaxis Semiconductors' Shuttleline)(Brief Article)
July 1, 2003... The Shuttleline platform for R&D and pilot production merges the technology of four of this company's systems, leveraging experience gained from an installed base of more than 650 tools. The multiprocess platform for thin-film etching and...

Wafer inspection tool offers high sensitivity. (Product Panorama).(Negevtech 302)(Brief Article)
July 1, 2003... The Negevtech 302 is a wafer inspection tool designed for entry at the 9Onm level with extension to the 65nm level and beyond. The tool is a high-resolution brightfleld imaging system that provides high sensitivity and throughput, as well as...

ArF scanner projects 85nm features. (Product Panorama).(numerical aperture)(Brief Article)
July 1, 2003... The FPA-6000AS4 ArF scanner boasts a numerical aperture (NA) of 0.85 and an ultralow-aberration lens system. Used in conjunction with a dual-chamber 193nm light source, the scanner can project features as small as 85nm. Synchronized wafer scan...

Analyzer provides ultrahigh resolution. (Product Panorama).(n&k Technology 3700RT)(Brief Article)
July 1, 2003... The high-throughput 3700RT analyzer address maskmakers' need for ultrahigh-resolution metrology for advanced photomasks. Both reflectance and transmittance are measured simultaneously by this dual spectrophotometer-based system. Measurements of...

FOUP eliminates vacuum cups. (Product Panorama).(front opening unified pod from Newport Corp.)(Brief Article)
July 1, 2003... The ADO (automatic door opener) 300mm loadport front-opening interface mechanical standard product features a patented latchkey design. This FOUP (front opening unified pod) loadport latch-key ADO opening mechanism eliminates the need for...

Parametric test system offers DC/RF wafer testing. (Product Panorama).(dual channel/radio frequency, from Keithley Instruments)(Brief Article)
July 1, 2003... The Model S600DC/RF APT system is a single-insertion DC/RF parametric test solution that can be used to assure reliability in product designs and processes by measuring critical device parameters during development, characterization, and...

High-throughput wafer inspection systems. (Product Panorama).(from August Technology Corp.)(Brief Article)
July 1, 2003... The AXi series of automated wafer inspection systems are for applications in front-end wafer fabs. These systems provide affordable macro-defect detection, review, and classification, and can detect defects 0.5[micro]m and larger. The Axi...

Photomask metrology tool. (Product Panorama).(from Rigaku/MSC)(Brief Article)
July 1, 2003... The GXR-EUV is an x-ray based metrology tool for characterization of multilayer mirror photomasks and blanks as used in EUV photolithography. The GXR-EUV measures such critical properties as the period of the multilayer (the thickness of Mo/Si...

Picking device. (Product Panorama).(from Bosch Rexroth)(Brief Article)
July 1, 2003... The noncontact transfer (NGT) is a picking device that operates by the Bernoulli principle, which applies airflow under the device to create a vacuum and lift force between the center and the circumference. The dynamic vacuum and continuous...

Laser thermal processing systems. (Product Panorama).(from Ultratech Stepper)(Brief Article)
July 1, 2003... These laser thermal processing (LTP) systems combine projection optics and laser thermal annealing to enable a new generation of semiconductor devices. This chip manufacturing technology overcomes process barriers associated with advanced...

Low-k dielectric resin. (Product Panorama).(from Dow Chemical)(Brief Article)
July 1, 2003... Developed with input from a key customer, SiLK D semiconductor dielectric resin improves upon the performance of SiLK I resin products by maintaining a dielectric constant of 2.6, but offering a more controlled coefficient of thermal expansion...

Clean process ovens. (Product Panorama).(from Despatch Industries)(Brief Article)
July 1, 2003... These clean process ovens offer a 350[degrees]C maximum operating temperature while maintaining Class 100 conditions throughout the entire process cycle. The LCD stackable clean process oven and the LCD 2-14 reach in cleanroom oven are suitable...

Low-pressure monitor. (Product Panorama).(from Precision Sensors)(Brief Article)
July 1, 2003... The Echoline low-pressure monitor has been UL 991 tested. It provides remote or point-of-use low pressure monitoring of gas cabinet exhaust systems during semiconductor manufacturing processes, alerts plant engineers to problems, and provides...

Inspection system. (Product Panorama).(from FeinFocus)(Brief Article)
July 1, 2003... The [mu]CT-F.O.X. system is for detailed 3-D inspection and analysis of complex electronic devices. It includes functional 2-D and 3-D modules in a single system, and visualizes the innermost components and precise structural modeling of a...

Vacuum soldering. (Product Panorama).(Brief Article)
July 1, 2003... The VLO40 vacuum soldering system is a freestanding bench-type vacuum soldering system that offers easy access, loading, and programming. The VLO40 was developed for R&D and small batch applications that require high quality solder processing...

Easily networked furnace system. (Product Panorama).(Brief Article)
July 1, 2003... The SuperTMX furnace system replaces Termco's TMX 9000, 10,000, and 12,000 series MUX controllers, as well as UNIX-based systems for Thermco furnaces. The Super TMX software provides complete recipe and configuration editing, process status,...

Reticle evaluation station. (Product Panorama).(Brief Article)
July 1, 2003... The AIMS "fab plus" station for actinic reticle evaluation combines the AIMS fab with handling functionality. The station now enables flexible automated mask loading from a SMIF interface or from reticle boxes, required for use in wafer fabs....

Thin-film SOI wafers. (Product Panorama).(silicon on insulator, from Soitec)(Brief Article)
July 1, 2003... The complete line of Unibond SOI wafers is available up to 300mm, including both thin film and thick film versions, in high volumes. Proprietary Smart Cut Technology, based on ion implantation and wafer-bonding techniques, is used to produce...

Tabletop vacuum solder reflow station. (Product Panorma).(Brief Article)
July 1, 2003... The Model 1200 tabletop vacuum solder reflow station is designed for process development and low volume production of flux-free and void-free soldered joints in microelectronic packages and components. The station is easy to profile for a wide...

MEMS wafer and substrate handling. (Product Panorama).(micro-electromechanical systems from H-Square Corp.)(Brief Article)
July 1, 2003... Handling tools for MEMS wafers and substrates include mechanical wafer edge pick devices, edge-grip vacuum tips, small metal process cassettes, miniature flat finders, mass transfer machines, and inspection stations. These tools overcome the...

Equipment platform for low cost/die solutions. (Product Panorama).(Surface Technology Systems)(Brief Article)
July 1, 2003... The Pro generation of equipment platforms delivers low cost/die solutions for single-wafer plasma processes across a range of applications. Equipment is available with the manufacturer's plasma etch and deposition sources in loadlocked or...

Ion emitter bar. (Product Panorama).(from Simco)(Brief Article)
July 1, 2003... The ScorpION ion emitter bar controls electrostatic charges in semiconductor and display manufacturing facilities. The bar's aerodynamic shape minimizes disturbance of unidirectional airflow, and its small size and 24VDC supply requirements...

X-ray detectors. (Product Panorama).(from EDAX)(Brief Article)
July 1, 2003... Additions to the Genesis XMS x-ray detector systems include CryoSpec, a reliable LN free Si(Li) EDS detector for the electron microscope; MegaSpec, a silicon-drift EDS detector that incorporates the manufacturer's latest digital pulse...

Plasma treatment system. (Product Panorama).(from March Plasma Systems)(Brief Article)
July 1, 2003... The XTRAK-IFP plasma treatment system incorporates ion-free plasma technology for treatment of devices without exposure to direct plasma glow discharge. The system is for both high-speed, in-line manufacturing operations and stand-alone...

Controlled inner chamfer capillary. (Product Panorama).(from Kulicke and Soffa)(Brief Article)
July 1, 2003... The CIC capillary permits the use of thicker wires in fine-pitch and ultrafine-pitch applications, improving yields and bonding performance. The GIG (controlled inner chamfer) capillary contains most of the additional gold generated from a free...

High-purity water system. (Product Panorama).(from US Filter)(Brief Article)
July 1, 2003... The CDI-LX electrode ionization system provides an uninterrupted supply of high-purity water, up to 18megohm-cm, without any need for regeneration materials. The system is pre-engineered to meet the stringent requirements of semiconductor...

Valve for precise fluid delivery. (Product Panorama).(from Asymtek)(Brief Article)
July 1, 2003... The Dispense jet DJ-2 100 series valve for jetting underfill achieves precise fluid delivery control at production speeds. jetting underfill enables users to produce "wet-out zones" -- areas where fluid wets the substrate away from the edge of...

Dry pump. (Product Panorama).(from Busch Semiconductor Vacuum Group)(Brief Article)
July 1, 2003... The BA 100 cooled dry pump offers 77 [ft.sup.3]/hr and uses dry screw technology in a compact package. The pump can replace oil-filled rotary pumps, offering reduced cost of ownership because the BA 100 requires no water cooling, no nitrogen...

Front and backside wafer probe. (Product Panorama).(from Micromanipulator)(Brief Article)
July 1, 2003... This double-sided probing station can probe the backside and front side of the wafer simultaneously, front side only, or back side only. The station is designed for emission microscopy, optical device characterization, and MEMS analysis. The...

Moisture analyzers. (Product Panorama).(from Ametek Process Instruments)(Brief Article)
July 1, 2003... The models 3050-AM, 5830, and 5920 moisture analyzers provide multi-gas capability, high accuracy, fast response, and online verification. Each analyzer features a quartz-crystal moisture microbalance sensor and sampling system, a display that...

Thermal processing furnace systems. (Product Panorama).(from MRL Industries)(Brief Article)
July 1, 2003... These high and low-temperature thermal processing furnace systems for small-batch, semiconductor process requirements feature a small footprint, like a tabletop or bench model, yet provide many high production features. The furnace systems have...

Pressure transducers. (Product Panorama).(from Swagelock)(Brief Article)
July 1, 2003... PTU series ultrahigh-purity pressure transducers feature metal thin film sensing technology to promote consistent, accurate performance. The sensing technology enables reliable readings over a wide range of temperatures and offers a stability...