Solid State Technology articles from January 2008

Solid State Technology archives from January 2008

Surface similarities hide big differences in display and photovoltaic needs.(PHOTOVOLTAICS)(Brief article)
January 1, 2008... At first glance, flat-panel displays and solar cells seem to have a lot in common: both depend on diodes and transistors, usually implemented in silicon, and both are highly competitive markets where throughput and process control are essential...

Revenue management key in the quest for better gross margins.(IC MANUFACTURING ECONOMICS)(Brief article)
January 1, 2008... An increasing number of forward thinking CEOs mad CFOs have made revenue management an integral part of their plans and some innovative companies have, on average, experienced 2-3% in gross margin growth year after year while improving...

Fitting many roads on one map.(Editorial)
January 1, 2008... While laudable for establishing consensus on the current state-of-the-art in semiconductor manufacturing, the International Technology Roadmap for Semiconductors (ITRS) has not been shown to be overly accurate as a predictor of the future. The...

SIA, WSTS stick to guns with 2008-2010 forecasts.(BUSINESS TRENDS)(Semiconductor Industry Association)(World Semiconductor Trade Statistics)(Brief article)
January 1, 2008... Despite a sluggish 1H07 due to pricing woes, the Semiconductor Industry Association (SIA) has now bumped up its outlook for 2007 chip sales to $257.1 billion, 3.8% growth vs. an anemic 1.8% projected at the end of a lousy 1H07. Beyond that, the...

Wafer shipments were down 1.2% sequentially in 3Q07 to 2174 millions of sq. in. (MSI), slightly lower than previous expectations, according to data from SEMI's Silicon Manufacturers Group (SMG).(WORLDWIDE HIGHLIGHTS)(Brief article)
January 1, 2008... Wafer shipments were down 1.2% sequentially in 3Q07 to 2174 millions of sq. in. (MSI), slightly lower than previous expectations, according to data from SEMI's Silicon Manufacturers Group (SMG). Following 12% sequential growth in both 1Q and...

The Silicon Valley Technology Center (SVTC) and Sematech's R&D foundry subsidiary Advanced Technology Development Facility (ATDF) in Austin, TX.(WORLDWIDE HIGHLIGHTS)(Brief article)
January 1, 2008... The Silicon Valley Technology Center (SVTC) and SEMATECH's R&D foundry subsidiary Advanced Technology Development Facility (ATDF) in Austin, TX, are merging to expand their "R&D foundry" capabilties, as an alternative to dedicated R&D fabs or...

Applied Materials is acquiring Italian firm Baccini.(WORLDWIDE HIGHLIGHTS)(Brief article)
January 1, 2008... Applied Materials is acquiring Italian firm Baccini, a supplier of automated metallization and test systems used in manufacturing crystalline silicon (c-Si) photovoltaic (PV) cells, for about [euro]225M (US ~330M) in cash.

Tokyo Electron (TEL).(WORLDWIDE HIGHLIGHTS)(Brief article)
January 1, 2008... Tokyo Electron (TEL) is the newest participant in SEMATECH's 3D Interconnect Program, the first supplier in the group launched in 2005 to evolve traditional copper/low-k interconnect technology to 3D chip stacking, including through-silicon...

Infineon Technologies and Intel have forged a technology partnership to develop optimized chips for high-density SIM cards combined with Intel's 65nm and 45nm process-based NOR flash memory.(WORLDWIDE HIGHLIGHTS)
January 1, 2008... Infineon Technologies and Intel have forged a technology partnership to develop optimized chips for high-density SIM cards combined with Intel's 65nm and 45nm process-based NOR flash memory. First samples are planned to ship in 2H08, followed...

Fujitsu.(WORLDWIDE HIGHLIGHTS)(Fujitsu Ltd. and Institute for Information Industry will jointly invest in WiMAX facility in Taiwan)(Brief article)
January 1, 2008... Fujitsu and Taiwan's Institute for Information Industry will invest "billions of yen" in a joint WiMAX chip R&D facility in Taiwan, according to the Taiwan Economic News and Japan's Nikkei daily.

SEMI is partnering with the organizers of global solar trade fair Intersolar to cohost "Intersolar North America.(USA)(Semiconductor Equipment and Materials International)(Brief article)
January 1, 2008... SEMI is partnering with the organizers of global solar trade fair Intersolar to cohost "Intersolar North America," the largest event serving the solar energy technology supply chain in the US, at this year's SEMICON West (July 15-17, San...

MKS Instruments has acquired privately held Yield Dynamics for an undisclosed amount, combining their monitoring/control and yield management technologies.(USA)(Brief article)
January 1, 2008... MKS Instruments has acquired privately held Yield Dynamics for an undisclosed amount, combining their monitoring/ control and yield management technologies. Leo Berlinghieri, MKS president/CEO, stated that the deal opens up long-term...

Analog Devices has sold its central processing unit (CPU) voltage regulation and PC thermal monitoring product line to ON Semiconductor to ON Semiconductor for $185m in cash, plus a one-year manufacturing supply deal.(USA)(Brief article)
January 1, 2008... Analog Devices has sold its central processing unit (CPU) voltage regulation and PC thermal monitoring product line to ON Semiconductor for $185M in cash, plus a one-year manufacturing supply deal. The products, including core CPU voltage...

AMD is receiving $622m from Mubadala Development, an investment group owned by the government of the United Arab Emirates, in exchange for an 8.1% noncontrolling minority ownership stake (Mubadala does not gain a board seat).(USA)(Brief article)
January 1, 2008... AMD is receiving $622M from Mubadala Development, an investment group owned by the government of the United Arab Emirates, in exchange for an 8.1% noncontrolling minority ownership stake (Mubadala does not gain a board seat). Projected net...

Toshiba and NEC Electronics are in talks to extend their development partnership to 32nm system LSIs.(ASIAFOCUS)
January 1, 2008... Toshiba and NEC Electronics are in talks to extend their development partnership to 32nm system LSIs. "Derivative and differentiated" processes will be discussed separately, as will a possible joint manufacturing concern, with a decision...

Nippon Telegraph and Telephone has developed a semiconductor laser chip that functions as a carbon monoxide sensor.(ASIAFOCUS)(Brief article)
January 1, 2008... Nippon Telegraph and Telephone has developed a semiconductor laser chip that functions as a carbon monoxide sensor, measuring the gas based on how it absorbs light rather than a chemical reaction, notes the Nikkei Business Daily. NTT...

NEC Electronics.(ASIAFOCUS)(Brief article)
January 1, 2008... NEC Electronics has debuted 40nm system-on-chip devices with embedded DRAM, incorporating the same high-k dielectric features in its 55nm devices developed in late 2006. The 40nm process includes specific process technologies from NEC's 55nm...

STATS ChipPAC.(ASIAFOCUS)(Brief article)
January 1, 2008... STATS ChipPAC says it will expand its flip-chip offerings to its Shanghai, China operation, encompassing wafer bump, sort, assembly and final test. Volume production is expected to start in 1H08, followed by a second phase adding electroplated...

Four years after spinning off its original nonmemory business (now MagnaChip Semiconductor), Hynix Semiconductor Inc. is getting back into the sector through a partnership and undisclosed ownership stake in Korean CMOS image sensor designer SiliconFile Technologies.(ASIAFOCUS)
January 1, 2008... Four years after spinning off its original nonmemory business (now MagnaChip Semiconductor), Hynix Semiconductor Inc. is getting back into the sector through a partnership and undisclosed ownership stake in Korean CMOS image sensor designer...

Days after a Taiwan court struck down indictments against UMC execs for dealings with Chinese chip firm He Jian, the island's Ministry of Economic Affairs' Investment Commission has approved UMC's first official application to invest in the mainland.(ASIAFOCUS)(Brief article)
January 1, 2008... Days after a Taiwan court struck down indictments against UMC execs for dealings with Chinese chip firm He Jian, the island's Ministry of Economic Affairs' Investment Commission has approved UMC's first official application to invest in the...

Honda Soltec.(ASIAFOCUS)(Brief article)
January 1, 2008... Honda Soltec, a wholly owned solar cell subsidiary of the Japanese carmaker, has opened a new solar cell production plant in Kumamoto Prefecture, with full production capacity of 27.5MW expected by next spring, according to the company. The...

China Sunergy.(ASIAFOCUS)(Brief article)
January 1, 2008... China Sunergy says it has ramped to mass production of selective emitter cells, and entered into various agreements to supply up to 25MW of solar cells to Canadian Solar in 2008.

Systems on Silicon Manufacturing (SSMC), a JV between NXP Semiconductors and TSMC, plans to invest $44.8M over the next four years to establish a R&D center in Singapore to focus on developing specialized manufacturing process.(ASIAFOCUS)(Brief article)
January 1, 2008... Systems on Silicon Manufacturing (SSMC), a JV between NXP Semiconductors and TSMC, plans to invest $44.8M over the next four years to establish a R&D center in Singapore to focus on developing specialized manufacturing process, initially...

Solsonica, a spinoff from backend semiconductor manufacturing services provider EEMS, has contracted M+W Zander to partially retrofit an existing semiconductor manufacturing facility in Reiti (~80km north of Rome) into a PV cell manufacturing plant.(EUROFOCUS)(Brief article)
January 1, 2008... Solsonica, a spinoff from backend semiconductor manufacturing services provider EEMS, has contracted M+W Zander to partially retrofit an existing semiconductor manufacturing facility in Reiti (~80km north of Rome) into a PV cell manufacturing...

A partnership between SET, the former SUSS MicroTec device bonder division spun off earlier this year.(EUROFOCUS)(Brief article)
January 1, 2008... A partnership between SET, the former SUSS MicroTec device bonder division spun off earlier this year, and CEA Leti has resulted in a new high-accuracy (0.5[micro]m), high-force (4000 N) device bonder for Leti's backend process development,...

Oerlikon.(EUROFOCUS)(The company is planning to expanned its services)(Brief article)
January 1, 2008... Oerlikon says it will bring all solar core competencies and new technologies under its solar unit as a standalone segment. As part of the plan, the company will double production capacity at its facility in Truebbach, Switzerland, where it...

BASF.(EUROFOCUS)(electric materialcenter has been opened by BASF )(Brief article)
January 1, 2008... BASF has opened its expanded electronic materials center at its HQ in Ludwigshafen, Germany, following a 15-month, "double-digit million euro investment." Qualification and production were expected to start on Jan. 1. BASF is investing about...

Toshiba, SanDisk ramping 43nm NAND flash with HK+MG, 3b/cell.(TECHNOLOGY NEWS)
January 1, 2008... Toshiba Corp. and SanDisk Corp. aim to increase their share of the NAND flash market by bringing down costs, as they accelerate the ramp of their new Yokkaichi Fab 4 next year, introducing 43nm geometries, high-k/metal gates, second generation...

Spansion makes diversity play with SONOS-based MirrorBit technology.(TECHNOLOGY NEWS)
January 1, 2008... Pure-play flash memory provider Spansion has announced plans for its next-generation MirrorBit ORNAND architecture based on its proprietary charge-trapping storage technology. The "MirrorBit ORNAND2" family, utilizing 45nm processes, will use a...

KLA-Tencor ellipsometer now goes to 150nm; ONO stacks resolved.(TECHNOLOGY NEWS)
January 1, 2008... With greater complexity in ever thinner films used in manufacturing advanced CMOS transistors, such as the gate dielectric stacks formed by atomic layer deposition and graded diffusion, there is vital need for additional metrology capability in...

Sharp improves ozone water wafer cleaner.(Tech Briefs from Japan)(Brief article)
January 1, 2008... Sharp Manufacturing Systems has created a wafer cleaning system that uses hot, concentrated ozone water with sustained high concentrations to more effectively dissolve and remove photoresist and other organic contaminants, according to the...

TDK tips way to purge FOUP gases.(Tech Briefs from Japan)(Brief article)
January 1, 2008... TDK has developed a way to quickly expunge air inside 300mm wafer front-opening uni. ed pods (FOUPs) when entering or leaving cleanrooms, which otherwise can oxidize and damage wafers and lower yields, notes the Nikkei Business Daily. The...

New additive limits tin whiskers.(Tech Briefs from Japan)(C. Uyemura & Co.)(Brief article)
January 1, 2008... C. Uyemura & Co. says it has developed an additive that prevents formation of "tin whiskers" on circuit boards and other electronic components. Circuit boards historically have been plated with tin-lead plated finish to prevent oxidation and...

IEDM shows real details of materials technology, devices.(IEDM SPECIAL REPORT)
January 1, 2008... EXECUTIVE OVERVIEW Over 1600 technologists gathered in Washington, DC, last month to explore a wide range of innovative ideas at the 2007 International Electron Devices Meeting (IEDM). Boosting performance as the shrink heads below 45nm...

Surface engineering for microfabrication.(M E M S)
January 1, 2008... EXECUTIVE OVERVIEW Richard Feynman predicted the emergence of the nanotechnology field during a now famous Caltech lecture in 1959 [1]. Today, from cellular phone microphones to stain-resistant fabrics, the products engineered using...

The problems and possibilities of thin film CIGS solar cells.(SPECIAL REPORT: SOLAR CELLS)
January 1, 2008... EXECUTIVE OVERVIEW Among the most promising of thin-. lm solar cells are those made of copper indium gallium diselenide (CIGS), but controlling film composition is a big hurdle to commercialization. Some companies producing CIGS solar...

Embedded DRAM makes inroads into SoC devices.(CHIP FORENSICS)
January 1, 2008... EXECUTIVE OVERVIEW This month, SST presents a special preview of the January edition of Chip Forensics, an SST online column by Dick James, senior technology adviser at Chipworks, a specialty reverse engineering company that takes apart...

Reducing USJ-related device variability at 32nm.(IMPLANT)
January 1, 2008... EXECUTIVE OVERVIEW Single-wafer high current implanter designs with diffusion-less annealing . ash or laser equipment result in both global and local micro-uniformity variations. These can directly cause local parametric device variation...

3D control of photomask etching using advanced CD AFM metrology.(METROLOGY)(critical dimension)(atomic force microscopes)
January 1, 2008... EXECUTIVE OVERVIEW A new generation of atomic force microscopes (AFM) has been designed for critical dimension (CD) metrology applications. Complex tip shapes, automated tip calibration capabilities, and a novel surface sampling protocol...

Laterally resolved phase measurements at 45nm using photomask phase metrology.(METROLOGY FOR LITHOGRAPHY)
January 1, 2008... EXECUTIVE OVERVIEW As the lithography process moves toward the 45nm and 32nm nodes, phase control on the mask is becoming more important than ever. To ensure an accurate printing, both attenuated and alternating phase shift masks (PSMs)...

Nano-engineering enables practical portable fuel cells.(NANOTECHNOLOGY)
January 1, 2008... EXECUTIVE OVERVIEW A variety of approaches to nano- and micro-engineering have begun to yield portable fuel cells--with dramatic cost and size advantages--for niche markets. A host of start-ups say that radical new approaches to the...

Eliminating micro-cracks, crystal dislocations with single-wafer surface conditioning.(DEPOSITION)
January 1, 2008... EXECUTIVE OVERVIEW Stacked-die-attach package applications require backside metal deposition for device contact within the package. This needs an optimized surface for backside metal adhesion. Wet chemical etching can provide a uniform,...

DUV brightfield wafer inspection tool.(PRODUCT NEWS)
January 1, 2008... [ILLUSTRATION OMITTED] The Applied UVision 3 DUV brightfield wafer inspection tool has the critical-defect detection sensitivity required for 45nm FEOL and immersion lithography. This next-generation system triples the number of laser...

Plasma-based bevel cleaning system.(PRODUCT NEWS)
January 1, 2008... The Coronus plasma-based bevel cleaning system is designed to reduce yield loss caused by defects that originate near the wafer's edge. The Coronus system combines the multiple-material cleaning capability of plasma with a proprietary...

Excimer laser implant activation system.(PRODUCT NEWS)
January 1, 2008... [ILLUSTRATION OMITTED] The ELIAS series of machines for annealing wafer-based and thin-film microelectronic devices features full automatic operation, a sophisticated production and R&D mode, a clean environment by built-in flow box (Class...

Multibeam SEM/FIB for simultaneous micro-milling.(PRODUCT NEWS)
January 1, 2008... A new high-throughput SEM/FIB combines focused ion beam micro-milling with the high-resolution imaging of the JEOL LaB6 electron column. The MultiBeam is a high-productivity tool for IC defect analysis, circuit modification, TEM thin film...

Noncorrosive BEOL post-etch residue remover.(Equipment Subsystems)
January 1, 2008... The ACL-585 HiPER-Solv noncorrosive, environmentally benign post-etch residue remover is a high-performance solvent that provides reduced cost of ownership and prevents corrosion when compared with conventional hydroxylamine or solvent-amine...

All-wetted PTFE flow-control needle valve.(Equipment Subsystems)
January 1, 2008... The NVM series of all-wetted, manually operated, PTFE flow-control needle valves offers precise manual linear-flow control for aggressive and high-purity chemicals. The needle plug has a PTFE diaphragm seal. Constructed from high-purity PTFE,...

Turbomolecular vacuum pump.(Equipment Subsystems)
January 1, 2008... The iXA series of magnetic-bearing turbomolecular vacuum pumps exhaust process gases from physical vapor deposition, etching, chemical vapor deposition, or ion implant equipment in semiconductor, flat panel display, solar energy and industrial...

450mm wafer handling vacuum wand.(Equipment Subsystems)
January 1, 2008... The Freedom Wand wafer handling vacuum wand is battery-powered, portable, Class 1 (ISO-3) cleanroom compatible, and has ample vacuum pressure to assure safe handling of 450mm wafers. It is good for virtual fabs and pilot lines. The vacuum tip...

Solar cell surface cleaner.(Equipment Subsystems)
January 1, 2008... The BakerClean PV-160 solar cell surface cleaner is a wet chemical cleaning solution incorporated in the Energy Research Centre of the Netherlands' (ECN) ECN-CLEAN process for manufacturing multicrystalline silicon solar cells. Solar cells...

Static conductive vacuums.(Equipment Subsystems)
January 1, 2008... A new line of static conductive vacuums is designed to eliminate nuisance static shocks commonly associated with vacuuming operations. This pneumatic vacuum eliminates static electricity by incorporating static conductive components to suppress...

Quadrupole mass spectrometer.(Equipment Subsystems)
January 1, 2008... The HiQuad quadrupole mass spectrometer with next generation Quadera software is reportedly 4 times faster than previous models, providing high measurement speeds up to 8000 data points/sec and sensitivity with a dynamic range of 10 orders of...

Multistage vacuum system.(Equipment Subsystems)
January 1, 2008... COAX is an improved design based on this company's multistage concept for creating vacuum with compressed air. It can be easily integrated into the body of manufacturing machinery with multistage cartridges, making maximum use of energy by...

Concentration monitor.(Equipment Subsystems)
January 1, 2008... The CR-288 concentration monitor is installed in the process stream or at point of use where chemicals are delivered or blended, and delivers measurements of the concentration and temperature of process fluids. Designed specifically for the...

Gas composition sensor with ppb sensitivity.(Equipment Subsystems)
January 1, 2008... The Vx-3100 gas composition sensor analyzes process gases and chemistries conducted in moderate vacuum to above atmospheric pressures (1 Torr to 15 psig). Mated to any process chamber, gas supply, or exhaust line, the compact sensor detects...

Solid-state UV laser for drilling and micromachining.(PRODUCT NEWS)
January 1, 2008... The AVIA 355-7 Q-switched, frequency-tripled, solid-state laser delivers over 7W of average power at 355nm. The highest average power is achieved at repetition rates near 60kHz, but the laser can be operated at pulse rates as high as 100 kHz,...

Focused ion beam system.(PRODUCT NEWS)
January 1, 2008... The OptiFIB-IV focused ion-beam (FIB) system is the latest generation of this company's coaxial photon ion microscope FIB systems that can now quickly edit devices targeted for 45nm process technology and below. The system features...

Laser upgrade increases scanner output.(PRODUCT NEWS)
January 1, 2008... The gas lifetime eXtension (GLX) product is a stand-alone upgrade package consisting of both soft ware and hardware to support increased intervals between gas exchanges for lithography laser systems. Laser gas exchanges typically occur 2-3x...

Backside edit upgrade for FIB system.(Equipment Subsystems)
January 1, 2008... A field upgradeable option adds backside circuit edit capabilities to the recently announced V600CE focused ion beam (FIB) system. The available enhancement adds an infrared camera and bulk silicon trenching capabilities to the automated FIB...

New drying chamber for LEDs.(PRODUCT NEWS)
January 1, 2008... The MDS/250/LED is a critically clean, HEPA-filtered drying console adapted for LED manufacturing processes. The touch-panel controlled design goes beyond this company's patented technique of incorporating HEPA or ULPA filtration within the...

Advanced films metrology system.(PRODUCT NEWS)
January 1, 2008... The Aleris 8500 advanced films metrology system is this company's modified broadband SE tool to push the wavelength from a 190nm lower wavelength limit down to 150nm. Laser desorption removes airborne molecular contamination from up to 8 hrs of...

Single-axis actuators.(PRODUCT NEWS)
January 1, 2008... These single-axis actuators, available in 208 configured styles, are compatible with most servo motors. By configuring the precision grade C10 ball screw diameter (12-20mm) and lead (4-20mm), as well as the base width, stroke, and table length,...

Dry etch tool.(PRODUCT NEWS)
January 1, 2008... The Plasmalab[micro]EtchEL dry etch tool is a flexible and economic entry-level tool with switchable dual-mode PE/RIE (plasma etch/reactive ion etch) capability. It offers a range of processes for failure analysis from isotropic passivation...

Interface performs actionable critical area analysis.(PRODUCT NEWS)
January 1, 2008... This interface between Ponte's YA System and Cadence's Virtuoso platform lets designers efficiently perform critical area analysis (CAA) and repair during layout. Developed under the auspices of the Cadence Connections Program, the interface...

High force device bonder with nanoimprint capabilities.(PRODUCT NEWS)
January 1, 2008... The FC300 high-force (4000N), high accuracy (0.5[micro]m) device bonder for wafer diameters up to 300mm is the first step in a joint development program between CEA Leti and S.E.T. It includes a built-in chamber for collective reflow in a gas...

Automatic test pattern generation.(PRODUCT NEWS)
January 1, 2008... The TetraMAX automatic test pattern generation (ATPG) diagnostics creates high-quality manufacturing tests and identifies logic in a design that could contribute to observed tester failures. TetraMAX failure diagnostics data is exported to the...

Sealing compound.(PRODUCT NEWS)
January 1, 2008... The Isolast Fab Range J9675 sealing compound is engineered to offer good chemical resistance with minimal particulation across a wide range of semiconductor wafer processes. It is said to have enhanced performance in fluorine- and oxygen-based...

Eco-friendly manufacturing--the green path to profitability.(INDUSTRY FORUM)
January 1, 2008... The semiconductor industry value chain, including materials, equipment, manufacturing, and consumer products, has a long history of creativity and innovation in the "greening" of its operations. In his best-selling book, Green to Gold--How...