Solid State Technology articles from February 2004

Solid State Technology archives from February 2004

The excellent adventure continues.(Editorial)
February 1, 2004... Creating the foundation for the tools of the Information Age has never been easy, but as the semiconductor industry aims to cross the threshold of billion-transistor chips with features well under 100nm, the challenges grow ever more...

Worldwide chip sales continue double-digit growth.(Business Trends)(Brief Article)
February 1, 2004... Worldwide semiconductor sales continued to rebound in October, posting the eighth consecutive monthly increase and largest month-to-month gains since 1990, according to data from the Semiconductor Industry Association (SIA). Worldwide...

International SEMATECH (ISMT).(Worldwide Highlights)(Brief Article)
February 1, 2004... International SEMATECH (ISMT), Austin, TX, has qualified an ultralow-k material for dual-damascene copper processing at 0.13[micro]m features, using 193nm lithography on 300mm wafers. The porous methylsilsesquioxane (MSQ) film is comprised of...

Interuniversity MicroElectronics Center (IMEC).(Worldwide Highlights)(Brief Article)
February 1, 2004... The Interuniversity MicroElectronics Center (IMEC) in Belgium has demonstrated the use of high-k dielectrics and metal gates at sub-1 nm nodes. The material, which uses TiN of TaN gates and Hf[O.sub.2] as a dielectric, scaled down to 0.8nm...

Veeco Instruments Inc., Woodbury, NY, has completed its acquisition of Advanced Imaging Inc. (AII).(USA)(Brief Article)
February 1, 2004... Veeco Instruments Inc., Woodbury, NY, has completed its acquisition of Advanced Imaging Inc. (AII), Camarillo, CA, a manufacturer of precision bar lapping equipment for thin-film data storage technologies. Veeco will pay up to $69 million for...

Tokyo Electron Ltd. (TEL) and IBM have jointly developed a tunable etch-resistant, antireflective dielectric film for CMOS device patterning at the 65nm node and below.(USA)(Brief Article)
February 1, 2004... Tokyo Electron Ltd, (TEL) and IBM have jointly developed a tunable etch-resistant, antireflective dielectric film for CMOS device patterning at the 65nm node and below. The silicon-based material, which is deposited by plasma-enhanced CVD, aims...

International SEMATECH, Austin, TX, plans to form a new consortium of fabs and chipmakers to focus on manufacturing infrastructure, methods, standards, and productivity.(USA)(Brief Article)
February 1, 2004... International SEMATECH, Austin, TX, plans to form a new consortium of fabs and chipmakers to focus on manufacturing infrastructure, methods, standards, and productivity. The new subsidiary, International SEMATECH Manufacturing Initiative Inc.,...

ON Semiconductor.(USA)(Brief Article)
February 1, 2004... ON Semiconductor plans to shut down its manufacturing operations in East Greenwich, RI, by the end of 2004, which it predicts will save $20-$25 million/year. The company will assume a $15-$20 million charge in 4Q03. It's the second recent...

Corning Inc.(USA)(Brief Article)
February 1, 2004... Corning Inc. plans to consolidate its manufacturing operations for producing fused silica and fluoride crystal materials into its Canton, NY facility, resulting in the closure of operations in SC and MA. The company will take a $70-$80 million...

Nikon Corp.(USA)(Brief Article)
February 1, 2004... Nikon Corp., Belmont, CA, has unveiled plans to introduce ArF immersion-lithography equipment based on its NSR-S307E 193nm lithography tool. The company plans to have a trial model with a NA = 0.85 ready by 2H04, with a preproduction model (NA...

Toshiba Corp. and SanDisk plan to build a facility for producing NAND flash memory chips by 2005, according to the Kyodo News International.(Japan)(Brief Article)
February 1, 2004... Toshiba Corp. and SanDisk plan to build a facility for producing NAND flash memory chips by 2005, according to the Kyodo News International. The $1.9 billion plant in Yokkaichi, Japan, scheduled to begin construction in October 2005, will focus...

Soitec and Seika Corp. plan to create a joint venture to provide SOI wafers and other substrates for customers in Japan, China, and Korea.(Japan)(Brief Article)
February 1, 2004... Soitec and Seika Corp. plan to create a joint venture to provide SOI wafers and other substrates for customers in Japan, China, and Korea. The Tokyo-based business, 70% owned by Soitec, is scheduled to be finalized in April 2004, at the end of...

Aviza Technology Inc., Scotts Valley, CA, has opened a subsidiary, Aviza Technology Japan KK, in Kawasaki.(Japan)(Aviza Technology Inc.,)(Brief Article)
February 1, 2004... Aviza Technology Inc., Scotts Valley, CA, has opened a subsidiary, Aviza Technology Japan KK, in Kawasaki. Aviza's Japan subsidiary was formed in October after the company bought ASML's thermal business. Aviza Technology has been in the thermal...

UMC.(Taiwan)(Brief Article)
February 1, 2004... UMC is the newest member of the X Initiative, a coalition of companies pushing a new method of designing chip circuitry. UMC is the first pure play foundry to support the X Architecture, which incorporates interconnects with diagonal pathways...

Applied Materials and Meidensha Corp. have opened a center in Shanghai to provide remanufactured chipmaking tools and services to Asian customers.(China)(Applied Materials Inc.)(Meidensha Corp.)(Brief Article)
February 1, 2004... Applied Materials and Meidensha Corp. have opened a center in Shanghai to provide remanufactured chipmaking tools and services to Asian customers. The facility is the fourth such site in Applied's worldwide remanufacturing network.

Fujitsu Ltd. plans to outsource production of its 8-bit microcontrollers used in "white goods" such as household appliances to China's Central Semiconductor Manufacturing Corp. (CSMC).(China)(Brief Article)
February 1, 2004... Fujitsu Ltd. plans to outsource production of its 8-bit microcontrollers used in "white goods" such as household appliances to China's Central Semiconductor Manufacturing Corp. (CSMC). Design work will be done by Fujitsu's local subsidiary....

South Korea plans to invest approximately $830 million over the next five years in semiconductor research and development.(Korea)(Brief Article)
February 1, 2004... South Korea plans to invest approximately $830 million over the next five years in semiconductor research and development. The majority would go toward development of system-on chip, memory, and nanoprocessing technologies, with the remainder...

ASML NV, Veldhoven, The Netherlands, and Dainippon Screen Manufacturing Co. Ltd., Kyoto, Japan, have agreed to co-develop methods for linking their track and lithography systems.(The Netherlands)(Brief Article)
February 1, 2004... ASML NV, Veldhoven, The Netherlands, and Dainippon Screen Manufacturing Co. Ltd., Kyoto, Japan, have agreed to co-develop methods for linking their track and lithography systems. The two will install Dainippon Screen's 300mm coater/developer in...

KLA-Tencor, San Jose, CA, and Soitec, Grenoble, France, are forming a joint development partnership to create wafer inspection systems.(France)(Brief Article)
February 1, 2004... KLA-Tencor, San Jose, CA, and Soitec, Grenoble, France, are forming a joint development partnership to create wafer inspection systems. The tools will be based on KLA-Tencor's Surfscan, optimized for silicon-on-insulator (SOI) wafers at the...

AMD.(Germany)(Brief Article)
February 1, 2004... AMD will build a new 300mm fab in Dresden, Germany. The $2.4 billion Fab 36, the first new chipmaking facility in Europe in years, will be built next to AMD's Fab 30 facility, with volume production scheduled to begin in 2006. The deal, which...

Communicant.(Germany)(Brief Article)
February 1, 2004... Plans to build a chip plant in eastern Germany have apparently been scrapped after investor and government funding has fallen through, according to media reports. Communicant's $1 billion plant in Frankfurt an der Oder was announced in February...

Wacker Group, Munich, Germany, is restructuring sales of polysilicon away from Wacker siltronic and into the hands of an independent organizational unit, Wacker Polysilicon.(Germany)(Brief Article)
February 1, 2004... Wacker Group, Munich, Germany, is restructuring sales of polysilicon away from Wacker siltronic and into the hands of an independent organizational unit, Wacker Polysilicon. The deal, effective in January, will help boost polysilicon production...

ON Semiconductor.(Czech Republic)(Brief Article)
February 1, 2004... ON Semiconductor has announced plans to move backend manufacturing operations from its facility in Roznov, Czech Republic, to its assembly and test facility in Malaysia. The company says it will keep a frontend manufacturing and design center...

Clarification.(Brief Article)(Correction Notice)
February 1, 2004... In the article "Increase device yield with FEOL dry-clean processes," December 2003, p. 38, Reference 5 should read: W. Graff, M. Matson, T. Kellner, T. Pluym, S.O. Nelson, et al., "RF and Microwave Plasma for Resist and Post-Etch Polymer...

Intel makes 0.57[micro][m.sup.2] SRAM cell using 65nm logic.(Technology News)
February 1, 2004... Fully functional 4Mbit SRAM arrays have been fabricated using 65nm logic technology--with all bits working--in a 0.57[micro][m.sup.2] cell containing six transistors by Intel Corp (Fig. 1). The announcement comes 20 months after Intel released...

Structured ASICs may lower mask costs.(Technology News)(Brief Article)
February 1, 2004... By combining preprocessed wafers from TSMC--up to metal level 2--and then providing custom programming for as many as five metal levels, AMI Semiconductor says it can cut the cost of reticles to about one-quarter of the usual cost. "We make the...

Suppliers reduce costs of blanket epitaxial strained silicon.(Technology News)
February 1, 2004... Suppliers of strained silicon say they're not seeing any letup in interest in evaluations of their blanket epitaxial products, despite the fact that none of the first announced strained silicon applications have actually used the costly new...

ASML demos immersion lithograph.(Technology News)(Brief Article)
February 1, 2004... This SEM image from an ASML Twin-Scan scanner shows 90nm lines that were printed through focus using immersion optics on an ASML Twin-Scan scanner platform. ASML modified a 0.75NA 193nm dry lens to provide full-field immersion imaging, with the...

IEDM '03: production-ready solutions and way-out ideas.(Conference Report)(Taiwan Semiconductor Manufacturing Company Ltd.)(Advanced Micro Devices Inc.)(Intel Corp.)
February 1, 2004... Washington, DC, buzzed with clever process tricks, novel device structures, and some potential disruptive technologies for the future at the IEEE's International Electron Device Meeting, held Dec. 8-10. Highlights included: * intensive...

Enabling next-generation ICs with photonics tools.(Front End Of Line)
February 1, 2004... Reduction in feature size drives a reduction in the source wavelength as well as an increase in the required illumination uniformity and overall source stability, tighter overlay conditions, and more critical inspection stations. To keep up...

Advanced device applications using single-wafer epitaxy.(Compound Semiconductors)
February 1, 2004... The enabling capabilities of single-wafer epitaxial technology have quickly emerged since its introduction in the late 1980s. Originally adopted to address issues like layer-thickness uniformity or dopant incorporation, single-wafer epitaxy was...

Today's binary and EAPSMs need advanced mask cleaning methods.(Mask Cleaning)(Cover Story)
February 1, 2004... OVERVIEW The increased demands of high-performance photomasks required for lithography advancement have brought with them a need to tweak and update the various aspects of mask processing. For example, engineers have resolved some of the...

Controlling the margins in 300mm manufacturing.(Automation/Robotics)
February 1, 2004... OVERVIEW Semiconductor companies converting to 300mm manufacturing will need to implement advanced process control to keep capital investment and operating costs low while maximizing the value of each wafer. Semiconductor companies are...

S-FIL for sub-80nm contact hole patterning.(Lithography Part I Of A Series)
February 1, 2004... OVERVIEW Reliable printing of sub-80nm contact holes is a challenge that manufacturers of state-of-the-art DRAM and MPU devices must overcome within the next few years. Step-and-flash imprint lithography (S-FIL) has already demonstrated the...

High-frequency capacitance measurements monitor EOT of thin gate dielectrics.(Metrology)
February 1, 2004... OVERVIEW Increasing measurement frequency and using a vector network analyzer permits accurate EOT measurements at thicknesses [less than or equal to] 0.9nm, aiding the move to smaller device dimensions and thinner gate oxides. ...

Capabilities and lessons from 10 years of APC success.(Advanced Process Control)
February 1, 2004... OVERVIEW The current vision for semiconductor manufacturing is that wafer labs will increasingly use advanced process control--an automated form of tweaking processing on the fly. The concept itself, however, is not new. One branch of its...

System integrates SEM with automated FIB capability.(Product News)(Applied Materials Inc.)(Brief Article)
February 1, 2004... The SEMVision G2 FIB defect-analysis system integrates SEM capability with automated focused ion-beam (FIB) cross-sectioning and energy-dispersive x-ray (EDX) analysis technology for high-speed, high-resolution defect review and analysis in one...

STI slurry delivers silica-like defectivity.(Product News)(Nanophase Technologies Corp.)(Rodel Inc.)(Celexis)(Brief Article)
February 1, 2004... Celexis slurry for direct shallow-trench isolation (STI) is a high selectivity, low-defectivity slurry that supplies a one-step replacement for multiple-step reverse mask processes. The slurry features NanoArc Synthesis cerium oxide (ceria)...

Die-attach adhesive works for tight-tolerance die-stacking.(Product News)(Brief Article)
February 1, 2004... The AAA 1000 adhesive is a Teflon (PTFE)-filled nonconductive paste used in applications where a soft, nonabrasive electrical insulator is required. The low-bleed adhesive passes high JEDEC moisture-level testing and 260[degrees]C reflow. AAA...

Defect-detection tools provide single-scan monitoring and detection.(Product News)(KLA-Tencor Corp.)(Brief Article)
February 1, 2004... The Surfscan SP1 series of defect-detection tools features new Monitor expert (MX 4.0) software to provide process monitoring information and benchmark defect detection in a single scan with no additional overhead, reducing manual...

BOC Edwards: corporate profile.
February 1, 2004... BOC Edwards is a leading supplier of integrated solutions for the manufacture of microelectronics devices, including silicon semiconductors, compound semiconductors and flat panel displays. Partnering with labs, foundries and process tool...

Defect removal process for low-k structures.(Product News)(FSI International Inc.)(Brief Article)
February 1, 2004... The AspectClean CryoKinetic process used in the ANTARES system removes defects from back-end-of-line patterned low-k structures without altering the k value or causing physical damage, The CryoKinetic process is an all-dry, nonreactive process...

TFT-LCD mask metrology system.(Product News)(Brief Article)
February 1, 2004... The MMS15000 TFT-LCD is a registration measurement system for TFT-LCD photomasks used to verify that the pattern placement among different photomasks matches the high-accuracy demands of advanced displays. The system features measurement...

Thermosonic die attach services.(Product News)(Brief Article)
February 1, 2004... Thermosonic die attach is preferred for thin, brittle dies or those that are intolerant of high heat. This interconnect method is an alternative to solder reflow when used with gold-stud bumping for flip-chip applications; it improves thermal...

Mass spectrometer.(Product News)(Brief Article)
February 1, 2004... The MiniSIMS is a compact secondary-ion mass spectrometer that provides elemental analysis, species mapping, and depth profiling. The MiniSIMS has three operational modes: static SIMS, scanning SIMS, and dynamic SIMS. The spectrometer may be...

Pressure transducers.(Product News)(Brief Article)
February 1, 2004... The models 546 and 547 strain gauge pressure transducers are optimized for high overpressure applications such as HVAC compressors, robotics applications, and semiconductor processing. The transducers incorporate submersible or general-purpose...

Laser particle counter.(Product News)(Brief Article)
February 1, 2004... The Anatel Ultrapure-100 laser particle counter helps address contamination control issues in ultrapure water applications relating to precision manufacturing, such as microelectronics, MEMS/MOEMS, and heads for disk drives. The device combines...

Wafer-handling equipment frontend module.(Product News)(Brief Article)
February 1, 2004... The Apex EFEM platform combines a direct-drive wafer-handling robot with SmartServo distributed controls architecture that handles wafers up to 300mm and is configurable with any combination of open cassette, SMIF, and FOUP loadports. The...

Gripper fittings for high-pressure applications.(Product News)(Brief Article)
February 1, 2004... The polypropylene gripper fittings for connecting laboratory tubing offer zero dead volume at pressures [less than or equal to] 1000psi. They can be hand-tightened without a special tool and will not compress or twist tubing if over-tightened....

XVP added to family of SEMs.(Product News)(Brief Article)
February 1, 2004... The EVO family of scanning electron microscopes now includes XVP (extended variable pressure) technology, with the ability to image hydrated, insulating, and outgassing specimens by imaging in either water vapor or air at pressures from...

Multiaxis stage for scanning microscopy.(Product News)(Brief Article)
February 1, 2004... The P-733.DD piezo stage has a high resonant frequency of 2.3 kHz (400% higher than conventional stages) to allow scanning rates of hundreds of hertz for capturing transient data. The parallel-kinematics layout of the x-and y-axes achieves...

Process-simulation tool for sub-90nm manufacturing.(Product News)(Synopsys Inc.)(Brief Article)
February 1, 2004... The Taurus Process Atomistic process-simulation tool reportedly offers up to 40% faster and more accurate simulation of nanoscale semiconductor device structures, reducing test silicon runs. The Process Atomistic simulates the diffusion of...

Semiconductor characterization software.(Product News)(Keithley Instruments Inc.)(Brief Article)
February 1, 2004... The Model 4200-SCS semiconductor characterization system is available with KTEI v5.0 software with new stress-measure and reliability test capabilities for device lifetime analysis and quality assurance. Running in either Windows NT or XP...

Tantalum sputtering targets.(Product News)(Brief Article)
February 1, 2004... Tantalum sputtering targets are now available for evaluation by semiconductor manufacturers for all leading PVD systems, with volume production expected in 3Q04. Cabot tantalum thin-film materials are available in purities for 3N5 to 5N with...

Frame grabber for high-speed analog cameras.(Product News)(Brief Article)
February 1, 2004... The MVS-8501 is a half-slot frame grabber that is PCI 2.31 compliant, and is designed for high-speed analog cameras that use the latest progressive-scan CCD sensor technology. The frame grabber is backward-compatible with standard-speed analog...

Correction engine for CD control.(Product News)(Brief Article)
February 1, 2004... The AutoCal dynamic correction engine for advanced photolithography track systems is designed to improve critical dimension (CD) control and extend the life of lithography tools. AutoCal uses BakeTemp SensorWafers to obtain an accurate baseline...

Ask the expert.(Brief Article)
February 1, 2004... Q. I'm experiencing pattern collapse in my lithography process. What can help me overcome this problem? A Pattern collapse can be a major obstacle in 93 nm and 248 nm photolithography processes. Air Products' OptiPattern[TM] Surface...

Calendar.(Calendar)
February 1, 2004... * MARCH 2004 2--AVEM Seminar--Santa Clara, CA. The Association of Vacuum Equipment Manufacturers will host an international seminar called "The Latest Market Trends, Vacuum Techniques, and Technologies" during the AVS 5th International...

An uncertain future for EUVL.(Perspectives)(extreme ultraviolet lithography)
February 1, 2004... Consensus, collaboration, and checkpoints are needed Kevin Kemp, EUV program manager, International SEMATECH, Austin, Texas I am frequently asked, "What is the future of EUV lithography? Will it happen? When will it happen?" Of course,...

Japanese equipment orders impress, while sales regress.(News)(Industry Overview)
February 1, 2004... Global orders in October of Japanese semiconductor equipment soared above [yen] 100 million for the third consecutive month at their highest levels in nearly three years, according to the latest figures from the Semiconductor Equipment...

Selete.(Brief Article)
February 1, 2004... Selete says it has etched and copper-plated 80nm-dia. vias at 200nm pitch intervals using its experimental Nikon e-beam tool, according to early press reports from the E-beam Projection Lithography forum in Tokyo. The tool is apparently still...

Super Silicon Crystal Research Institute Corp. has licensed its wafer-processing equipment to South Korea's Tera Semicon Corp. and Japan's Shinkugiken Co.(Brief Article)
February 1, 2004... Super Silicon Crystal Research Institute Corp. has licensed its wafer-processing equipment to South Korea's Tera Semicon Corp. and Japan's Shinkugiken Co. The companies plan to produce tools by September 2004 that can deposit films...

Shanghai Belling Co. plans to buy an 11% stake in its JV with Japan's NEC Corp. for $86 million, according to Dow Jones.(Brief Article)
February 1, 2004... Shanghai Belling Co. plans to buy an 11% stake in its JV with Japan's NEC Corp. for $86 million, according to Dow Jones. NEC and its China unit own about 20% of Shanghai Hua Hong NEC Electronics Co., which opened China's first 200mm wafer...

Matsushita Electric Industrial Co.(Brief Article)
February 1, 2004... Matsushita Electric Industrial Co. says it will spend up to [yen] 130 billion ($1.21 billion) to build a new production facility in Uozo. The new site will reportedly use 90nm- and 65nm-processes and have a capacity of roughly 10,000 300mm...

Government to take over Japan industry research consortium.(News)(Brief Article)
February 1, 2004... Japan's government funded Mirai 45nm research project will take over the work of the industry's joint Asuka 65nm development program this summer, in what the Nihon Keizai Shimbun says is an attempt to do a better job moving research on advanced...

Korean firms fatten budgets for 2004.(News)(Brief Article)
February 1, 2004... Several of South Korea's big electronics companies are planning to significantly increase their investments in the coming year, according to the Korea Herald. Conglomerate Samsung Group plans to invest up to $4.2 billion in 2004, up 20% from...

Water shortage in Taiwan does not affect semi companies.(News)(Brief Article)
February 1, 2004... Due to the lowest rainfall levels in 40 years in the Shihmen Dam area, which supplies water to the northern part of Taiwan, government officials have chosen to withhold water supplies from rice crops in order to supply homes and manufacturing...

Chip group challenges Philippine export figures.(News)(Brief Article)
February 1, 2004... A trade group representing domestic electronics firms is protesting the latest government figures for November's electronics exports, calling them "strange" and "impossible," according to a report in the Philippine Daily Inquirer. The...

Taiwan's biggest contract chipmakers are boosting their investments in 2004.(Brief Article)
February 1, 2004... Taiwan's biggest contract chipmakers are boosting their investments in 2004. TSMC has reportedly approved $1.43 billion to expand production capacity of 130-90nm copper processes at its Fab 12 facility, with some investment in 0.18-0.15...

Two pure-play III-V compound-semiconductor foundries based in the US and Taiwan plan to combine operations.(Global Communications Semiconductor Inc., and Global Communication Technology Corp.)(Brief Article)
February 1, 2004... Two pure-play III-V compound-semiconductor foundries based in the US and Taiwan plan to combine operations. Together, Global Communications Semiconductor Inc. (GCS), and Global Communication Technology Corp. (GCTC), both of which included 6-in....

Hsinchu Science-based Industrial Park.(Brief Article)
February 1, 2004... Taiwan's Hsinchu Science-based Industrial Park expects record sales of $29.24 billion in 2004, according to local reports. The park posted $20.5 billion from January-October 2003, a 21.3% increase from a year ago. Overall, 2003 revenue is...

TSMC and Omnivision Technologies plan to form a $50 million joint venture to offer backend chip production for image-capturing devices.(Taiwan Semiconductor Manufacturing Company Ltd.)(Brief Article)
February 1, 2004... TSMC and Omnivision Technologies plan to form a $50 million joint venture to offer backend chip production for image-capturing devices. The investment in the new company, VisEra Technology Co., is part of an overall effort by TSMC to expand its...

Korea International Trade Association.(Brief Article)
February 1, 2004... South Korea's semiconductor trade deficit reached a new high during the period from January to October, suggesting a deeper reliance on Japanese chipmaking equipment and nonmemory chips, according to the Korea International Trade Association....

Samsung, Hynix, and Hyundai Motor are among a group of Korean chipmakers and car manufacturers exploring ways to develop SoCs for use in automobiles.(Brief Article)
February 1, 2004... Samsung, Hynix, and Hyundai Motor are among a group of Korean chipmakers and car manufacturers exploring ways to develop SoCs for use in automobiles. A total of nine companies have participated in recent talks, according to the Ministry of...

ON Semiconductor.(ON Semiconductor L.L.C.)(Brief Article)
February 1, 2004... Nearly 14 billion semiconductors worth $104 million were exported from China's Sichuan province through October 2003, a 23.8% increase compared with the same period a year ago. Semiconductor exports to Singapore were up 27.5%, accounting for...

AMD says it plans to spend $30 million over the next two years to open a wholly-owned subsidiary, Advanced Micro Devices (China) Co. Ltd. in Beijing, pending final approval from the Chinese government.(Advanced Micro Devices Inc.)
February 1, 2004... AMD says it plans to spend $30 million over the next two years to open a wholly-owned subsidiary, Advanced Micro Devices (China) Co. Ltd. in Beijing, pending final approval from the Chinese government. The announcement was made by CEO Hector...

SEMICON China, Shanghai.(Conference Preview)
February 1, 2004... SEMICON China will be held March 17-19 at the Shanghai New International Expo Centre in Shanghai. Exhibit hours are Wednesday, March 17, and Thursday, March 18, 9 am to 5 pm; and Friday, March 19, from 9 am to 4 pm. At last year's SEMICON...

Providing outsourced assembly and test in China.(China)(semiconductor market)
February 1, 2004... The market drivers for assembly and test manufacturing in China start with the region's strong economic growth: the GDP expands about 8% per year. Already, multinational OEMs are seeking market share through localization, and mainland China...

China is catching up to leading-edge technology.(China)
February 1, 2004... Foundries are developing manufacturing technologies that will allow second-generation products to transition to China, further speeding the rise of semiconductor manufacturing there. Though Chinese technologies currently are two generations...

A learning laboratory for China's next generation of talent.(China)(semiconductor industry hub)
February 1, 2004... With several indigenous companies producing integrated circuits (ICs) to serve the emerging domestic and international consumer-electronics markets, the People's Republic of China (PRC) is fast becoming a semiconductor-manufacturing hub. Much...

The shift to Asia: cause for concern in the US?(Regional Trends)
February 1, 2004... The shift of IC manufacturing to Asia--always an issue--has cropped up recently as a growing concern. While significant, it is not as overwhelming as some might think, as the data in the table show. Because equipment is the font of all chip...

Honeywell Electronic Materials.(People)(appointments)(Brief Article)
February 1, 2004... Honeywell Electronic Materials, Sunnyvale, CA, has appointed Oliver Shon, formerly general manager of Ashland Taiwan Co. Ltd., as the Greater China sales leader. He will focus on implementing sales strategy in China and strengthening the...

Teradyne.(People)(executive promotions)(Brief Article)
February 1, 2004... Teradyne, Boston, MA, has promoted John Casey to senior VP responsible for all of its activities in Asia, with Jeffrey Hotchkiss stepping in as president of the company's assembly test division. Casey became a Teradyne VP in 1990 and was...

Chartered Semiconductor Manufacturing.(People)(appointments)(Brief Article)
February 1, 2004... Chartered Semiconductor Manufacturing, Singapore, has appointed Arthur T.C. Kuo as president for the Americas region, overseeing customer support activities and field engineering as well as day-to-day business operations for the region. He...