Electro Manufacturing articles

Recent articles from Electro Manufacturing

SIEMON Z-MAX PATCH CORDS USE PCB-BASED SMART PLUG.
July 1, 2009... Siemon, Watertown, Conn., has introduced its innovative category 6A Z-MAX patch cords. Available in both UTP and shielded configurations, the Z-MAX cords feature an exclusive RJ-45 Smart-Plug design which integrates a precisely tuned printed circuit board (PCB) into every plug. Normally found...

EV GROUP WINS ORDER FROM RF COMPONENTS MAKER EPCOS.
July 1, 2009... EV Group (EVG), St. Florian, Austria, a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, has announced that EPCOS - a leading electronic components, modules and systems manufacturer - selected EVG's fully automated GEMINI...

RFMD UNVEILS LINEAR POWER AMPLIFIER FOR WIFI/WIMAX.(Company overview)
July 1, 2009... RF Micro Devices, Inc. (Nasdaq:RFMD), a global leader in the design and manufacture of high-performance semiconductor components, has introduced the RF5602 high-power, high-efficiency and high-linearity power amplifier (PA). The RF5602 is a 2 GHz linear PA designed for medium power...

MAGMA DEBUTS TALUS 1.1 WITH TALUS CORE TECHNOLOGY.
July 1, 2009... Magma(r) Design Automation Inc. (Nasdaq:LAVA), San Jose, Calif., a provider of chip design software, has announced the release of Talus(r) 1.1, a new RTL-to-GDSII chip implementation system that delivers the fastest timing closure on the largest and most complex semiconductor designs. Talus...

MARVELL ENABLES SEAMLESS CONNECTIVITY WITH SINGLE CHIP.
June 1, 2009... Marvell (NASDAQ: MRVL), Santa Clara, Calif., a leader in storage, communications, and consumer silicon solutions, supports the recently announced Bluetooth 3.0 + HS (High Speed) specification. Marvell demonstrated Bluetooth 3.0 HS at Mobile World Congress in Barcelona and at the Consumer...