ECN-Electronic Component News articles from February 2009

ECN-Electronic Component News archives from February 2009

Looking forward.(Editor's View)
February 1, 2009... By the time you read this column, Barack Obama will be the President of the United States of America. Politics aside, I think that this is a positive for many reasons, the most predominant being that this is a President that understands...

Licensing model dedicated to advanced verification for RFICs.(Leading Off)
February 1, 2009... Agilent Technologies announced a simulation licensing model for use with the company's GoldenGate RFIC simulation, analysis, and verification software suite. GoldenGate software is an advanced RFIC simulation and analysis solution for...

Single-chip set-top-box IC combines high-definition and interactive capabilities.(Leading Off)
February 1, 2009... A new cable set-top-box (STB) IC introduced by STMicroelectronics is said to cut the cost of STBs capable of accessing emerging high-value services. The STi7141 combines support for high-definition TV, up to 120 Mb/s broadband, and...

Control IC provides high density and scalable power for POL converter designs.(Leading Off)
February 1, 2009... International Rectifier introduced the XPhase IR3513 control IC for point-of-load (POL) converter designs. The IC provides overall control of a scalable number of phases along with an internal gate driver, current sense and sharing, and PWM to...

Oscillators.(PRODUCT TECHNOLOGY REVIEW)
February 1, 2009... oscillator and timing device vendors are addressing designers' needs in a variety of markets while continually making their devices smaller. This section presents some of the recently introduced oscillators, with a side-by-side presentation...

Linux update: designers can readily put Linux in everything from boards to MCUs.(EMBEDDED SYSTEMS)
February 1, 2009... A view of Linux from several perspectives will help embedded-system designers better understand how they can use this open-source operating system. Experts at Eurotech, Texas Instruments, and Rowebots share their approaches. [ILLUSTRATION...

Achieving a consistent software platform for embedded microcontrollers.(SEMICONDUCTOR HIGHLIGHT)
February 1, 2009... Typically, industries use standards to improve product quality and enable component sharing across projects. In practice, such standards achieve wide acceptance since the synergistic effects provide significant benefits to the user community....

Exploring in-vehicle entertainment and navigation technology.(Automotive Electronics)
February 1, 2009... Despite recent economic challenges facing the auto industry, many leaders are moving forward with new and innovative systems for in-vehicle entertainment and sophisticated audio-video capabilities. Industry analysts, such as iSuppli...

Distributed power goes from utilities down to ICs: a discussion of distributed power starts at the power line and progresses to individual components.(Distributed Power)
February 1, 2009... Distributed power means different things to engineers. Some think of it only as the distribution of different DC voltages on a circuit board or in a rack of equipment. But good power-distribution engineering starts at the power company's...

Building a secure collaborative infrastructure.(Systems Integration)
February 1, 2009... While it's possible to build strong security around multi-organization government collaborations, the tendency is for security policies and procedures to break down over time. Yet, putting only a few key practices in place can assure that...

System integration and EMI challenges.(Street Talk)
February 1, 2009... Systems integration presents unique challenges throughout the phases of a program--including Electromagnetic Interference (EMI) challenges. In the design phase, system-level priorities often create space constraints within subsystems. In...

Use PoE for connectivity in facilities.(Systems Integration)
February 1, 2009... Traditionally, system integrators have faced many different--and sometimes conflicting--design choices when it comes to powering and connecting to devices used for access control, surveillance, and building-management. [ILLUSTRATION...

Platform brings HD performance to desktop PCs, notebooks, embedded devices.(BOARDS, MODULES & EMBEDDED SYSTEMS)
February 1, 2009... Combining a VIA Nano processor, a unified digital media chipset, and an S3 Graphics PCIe discrete GPU, VIA Technologies' VIA Trinity three-chip silicon platform delivers HD video performance to desktop PCs, notebooks, and embedded devices while...

Evaluation kit explores power devices.(BOARDS, MODULES & EMBEDDED SYSTEMS)
February 1, 2009... Providing a first-evaluation solution to assess Nextreme's power generation technology, the eTEG Thermoelectric Power Generation Evaluation Kit requires only modest equipment to measure the power generated by the company's eTEG UPF40 devices. A...

Breadboard contains complete Linux PC.(BOARDS, MODULES & EMBEDDED SYSTEMS)
February 1, 2009... Consisting of a Quad-band GRPS module and a SiRF3 GPS module, Round Solutions' AarLogic C10/3 breadboard presents a complete Linux PC on a surface of 104 mm x 63 mm. The component includes interfaces for USB, RS-232, and Ethernet components, as...

Fanless panel PC incorporates resistive touchscreen.(BOARDS, MODULES & EMBEDDED SYSTEMS)
February 1, 2009... Sealing to IP54 via a stainless steel front bezel, BVM Limited's PT-170PF fanless panel PC uses a 1280 X 1024 LCD display with five-wire resistive touchscreen. The computer runs via a Celeron CPU with up to 1-GB of RAM, and offers VESA mounting...

Dual TLM transistors exhibit low [V.sub.CE(SAT)].(INTEGRATED CIRCUITS)
February 1, 2009... Functioning in a TLM832D package, Central Semiconductor's CTLM3410-M832D (dual NPN), CTLM7410--M832D (dual PNP), and CTLM3474-M832D (complementary NPN/PNP) dual TLM transistors have a typical [V.sub.CE(SAT)] [degrees]f 20 mV (NPN) and 25 mV...

Power MOSFETs provide high package current rating.(INTEGRATED CIRCUITS)
February 1, 2009... Offering TO-220, D2PAK, and D2PAK-7 packaging options, International Rectifier's new range of trench HEXFET power MOSFETs provide a package current rating of up to 195 A (TO-220 and D2PAK) and 240 A (D2PAK-7). The N-channel components...

Boost converter supports 5-[mu]A operating current.(INTEGRATED CIRCUITS)
February 1, 2009... Operating at 5-[mu]A of quiescent current, the TPS61220 2-MHz DC/DC boost converter from TI supports an input voltage of 0.7 V to 5.5 V and an output voltage range of 1.8 V to 5.5 V. The chip maintains 85 percent efficiency at light load,...

White LEDs implement advanced materials.(OPTOELECTRONICS & DISPLAYS)
February 1, 2009... Providing a thermal resistance of 25 K/W at power levels from 5,600 mcd to 14,000 mcd, the VLMW84xx Series SMT white LEDs is presented as the first InGaN/TAG on sapphire devices of their type to come in a CLCC-2 flat ceramic package. The...

Design kits calibrate optoelectronic devices.(OPTOELECTRONICS & DISPLAYS)
February 1, 2009... Mounting devices directly or remotely via a connectorized configuration, OPTEK Technology's OCB100 Series auto-calibration design kits calibrate optoelectronic devices. The systems regulate reflective, interruptive, and special opto sensors to...

LEDs deliver up to 76 lm at 350 mA.(OPTOELECTRONICS & DISPLAYS)
February 1, 2009... Addressing solid-state lighting applications, the ASMT-Ax00 family of 1-W LEDs from Avago has a 130[degrees] viewing angle and comes in a variety of colors, including white. Delivering up to 76 lm at 350 mA, the reflow-compatible emitters have...

Circular connector includes secondary locking mechanism.(PACKAGING & INTERCONNECTS)
February 1, 2009... Capable of withstanding harsh and wet-area environments, an APD (Automotive Product DIN) circular connector from ITT Interconnect Solutions features a secondary locking mechanism. The connector has 19 contacts with the option of increasing to...

Hybrid socket works with 0.30-mm-pitch devices.(PACKAGING & INTERCONNECTS)
February 1, 2009... Prototyping, testing, and burning in CSP (chip scale package), BGA (ball grid array), microBGA, and LGA (land grid array) devices, Aries Electronics' CSP/BallNest ZIF-style hybrid socket operates in devices with a 0.30-mm pitch or larger. The...

Shielded connectors serve rugged applications.(PACKAGING & INTERCONNECTS)
February 1, 2009... Coming preassembled for Profibus and Ethernet users, Binder-USA's Series 766 M12 shielded panel-mounted male or female connectors offer a receptacle that is attached to a shielded cable with a twisted pair of AWG 22 wires. The Profibus...

Plug connectors mate with SMA jack connectors.(PACKAGING & INTERCONNECT)
February 1, 2009... Using inner contact fingers, which slide over the threads of the mating SMA jack and lock into place by engaging the outer collar, Tyco Electronics' Snap-Lock SMA Series plug connectors snap into standard SMA jack connectors. Disengagement is...

ESD protection diodes possess 0.18-[mm.sup.2] footprint.(PASSIVE & DISCRETE COMPONENTS)
February 1, 2009... Matching the 0201 outline, STMicroelectronics' ESDALCxx-lU2 family of ESD protection diodes have a footprint of 0.3 mm x 0.6 mm. The ESDALC3V9-1U2, ESDALC6V1-1U2, and ESDALC14V2-1U2 units offer a breakdown voltage of 3.9 V, 6.1 V, and 14.2 V,...

Capacitors last 200,000 hours.(PASSIVE & DISCRETE COMPONENTS)
February 1, 2009... Performing at up to 105[degrees]C, Epcos' DC Link HD (B3277*) and DC Link HP (B3267*) Series MKP link circuit capacitors demonstrate a service life of up to 200,000 hours. The self-healing HD Series offers capacitance values from 1.5 [micro]F...

R-C protection devices target 3G handset LCD interfaces.(PASSIVE & DISCRETE COMPONENTS)
February 1, 2009... Operating in frequencies from 1.8 GHz to 2.5 GHz, Semtech's EClamp237xK family resistor-capacitor (R-C) protection devices serve high-resolution color LCD interfaces in GSM- and CDMA-based 3G handsets. The RoHS- and WEEE-compliant units exhibit...

VCOs deliver up to 9 dBm.(PASSIVE & DISCRETE COMPONENTS)
February 1, 2009... Supplying output power of up to 9 dBm, two SMT MMIC VCOs from Hittite Microwave Corporation suit point-to-point, point-to-multipoint, VSAT, military, and test equipment applications from 20.9 GHz to 26.8 GHz. With SSB phase noise of -95 dBc/Hz...

SMT DC/DC converter modules supply 1 W.(POWER SOURCES)
February 1, 2009... Appropriate for ground loop elimination and voltage isolation in digital interface applications, Tracopower's TES-1 Series SMT DC/DC converter modules deliver 1 W of output power. The 18 models exhibit input voltages of 5 VDC, 12 VDC, or 24 VDC...

Power supplies provide various protections.(POWER SOURCES)
February 1, 2009... Complying with UL/EN 60601 - 1 and CSA C22.2 No. 601.1 medical standards, Tumbler Technologies + TRUMPower's TM650 Series AC/DC switching power supplies demonstrate PFC, PFD, remote inhibit, remote sense, overvoltage, overcurrent, and thermal...

Power supplies offer high efficiency.(POWER SOURCES)
February 1, 2009... With efficiencies up to 85 percent, the AEB Series of external AC/DC power supplies from XP Power is available with outputs from 5 VDC to 48 VDC in versions providing 36 W, 45 W, or 70 W. The supplies meet current U.S. and European energy...

Technology integrates inductive touch sensing into existing application code.(SENSORS)
February 1, 2009... Performing in a single 8-, 16-, or 32-bit PIC MCU or 16-bit dsPIC DSC, Microchip's mTouch inductive touch sensing technology allows designers to incorporate inductive touch-sensing functionality with their existing application code. It enables...

Sensor film measures and maps low contact pressures.(SENSORS)
February 1, 2009... Placed between contacting or mating surfaces, Sensor Products' Pressurex Zero tactile pressure-indicating sensor film characterizes contact surface pressures from 7.20 psi to 28 psi (0.50 kg/[cm.sup.2] to * 1.97 kg/[cm.sup.2]). The product...

Infrared detector demonstrates 25-[micro]m pitch.(SENSORS)
February 1, 2009... Incorporating an on-chip ADC, ULIS'UL03 16 2 resistive amorphous silicon infrared detector exhibits a pitch of 25 [micro]m in an array format of 384 x 288 pixels. The 24.2-mm x 24.2-mm x 4.10-mm unit provides a thermal time constant of 99.9...

Proximity sensors rated to 50 G.(SENSORS)
February 1, 2009... Shock test rated to 50 G, Mobile Equipment Sensors from Pepperl+Fuchs are IP69K rated. Temperature range is-40[degrees]F to 185[degrees]F. Sensors are available in 12-mm, 18-mm, and 30-mm diameters to deliver 4-mm, 8-mm and 15-mm sensing...

Counterfeit IC detector covers multiple package types.(TEST & MEASUREMENT)
February 1, 2009... Coming in a desktop case with separate interchangeable PCBs for accepting the ICs under test, ABI Electronics' SENTRY counterfeit IC detector tests integrated circuits in DIL, SOIC, PLCC, QFP, and BGA packaging. The device uses PinPrint test...

AUX channel controller enables DisplayPort testing.(TEST & MEASUREMENT)
February 1, 2009... Controlling a device under test through the DisplayPort connector only, Agilent Technologies' and Quantum Data's W2642A AUX channel controller fully automates physical layer testing of the DisplayPort main link for sink- and source-device...

Security is all in vein.(ON THE LIGHT SIDE)
February 1, 2009... We've seen biometric scanning devices so often in movies and television shows that many people feel that they are commonplace. You even have a choice of notebook computers that have fingerprint scanners built in as a security device. ...

Brainstorm: technology obsolescence.
February 1, 2009... Q: What technology will become obsolete in the near future? Paul Nickelsberg Orchid Technologies www.orchid-tech.com Electronic components and electronic product design requirements change constantly. The design process is one of...

Mini-E is highway legal pure electric vehicle.(efficiency Zone)
February 1, 2009... Hipsters of the world rejoice! Mini has announced the greatest thing since arthouse theater--an electric version of the Mini Cooper. Unveiled at the 2008 Los Angeles Auto Show, the Mini-E is one of the first highway legal all-electric vehicles....