Circuits Assembly articles from May 2004

Circuits Assembly archives from May 2004

Burnout.(Editorial)
May 1, 2004... Rock-n-roll icon Neil Young said it's better to burnout than to fade away. Obviously, Neil never worked in electronics manufacturing. [TEXT NOT REPRODUCIBLE IN ASCII] This industry is suffering from burnout. The recent results from...

Web sites worth mentioning.(Net Gain)
May 1, 2004... www.pro-mation-inc.com Pro-Mation Inc., a provider of printed circuit board handling equipment, selective laser soldering, intelligent routing systems and assembly lines, has updated its Web site to reflect expanded product offerings. For...

Industry resources.(Net Gain)
May 1, 2004... www.smta.org/knowledge/knowledge.cfm The SMTA Knowledge Base is a searchable archive of all technical papers presented at SMTA conferences. It currently has over 1,400 technical articles, dating back as far as 1996 and covering a range of...

Surveys and guides.(Net Gain)
May 1, 2004... www.circuitsassembly.com/online/0404/0404salary.shtml The results of our 2004 salary survey are now available online. Would you like to contribute to NET gain? Contact Robin Norvell at rnorvell@upmediagroup.com

Celestica completes MSL acquisition.(Industry News)
May 1, 2004... Celestica Inc. (Toronto, Ontario, Canada, www.celestica.com), an electronics manufacturing services (EMS) provider, has completed its acquisition of Manufacturers' Services Limited (MSL, Concord, MA), another global EMS provider. Pursuant...

Dynatech to distribute Aegis Software with Samsung equipment.(Industry News)
May 1, 2004... Dynatech Technology Inc. (Horsham, PA, www.dynatechsmt.com), the North American distributor for Samsung surface-mount technology equipment, has signed a distribution agreement with Aegis Industrial Software Corp. (Horsham, PA, www.aiscorp.com)...

Assembleon, Tecnomatix extend collaboration agreement.(Industry News)
May 1, 2004... Assembleon (Eindhoven, The Netherlands, www.assembleon.com), a designer and manufacturer of surface-mount pick-and-place equipment for the global electronics industry, and Tecnomatix Technologies Ltd. (Herzlia, Israel, www.tecnomatix.com), a...

Jabil to implement Valor software worldwide.(Industry News)
May 1, 2004... Valor Computerized Systems (Yvane, Israel, www.valor.com), a provider of engineering software solutions to the electronics design and manufacturing industry, has reached an agreement with Jabil Circuit Inc. (St. Petersburg, FL, www.jabil.com),...

Agilent offers purchasing programs for pre-owned test instruments.(Industry News)
May 1, 2004... Agilent Technologies Inc. (Palo Alto, CA, www.agilent.com) has introduced Agilent CertiPrime and Agilent Advantage Assurance, two programs that provide options for purchasing pre-owned test equipment. [TEXT NOT REPRODUCIBLE IN ASCII] ...

SMTA launches Medical Electronics Symposium.(Industry News)
May 1, 2004... The Surface Mount Technology Association (SMTA, Minneapolis, MN, www.smta.org) Medical Electronics Symposium will take place May 19-20 in Bloomington, MN. It will explore devices, components, packaging and assembly technologies. Technical...

Circuits Assembly announces winners of 2004 Service Excellence Awards.(Industry News)
May 1, 2004... UP Media Group Inc. (Atlanta, GA, www.upmediagroup.com) announced the winners of the 2004 Service Excellence Awards (SEAs) for Electronics Manufacturing Services (EMS) Providers and Electronics Assembly Equipment, Materials and Software...

Universal Instruments, CyberOptics sign partnership agreement.(Industry News)
May 1, 2004... Universal Instruments Corp. (Binghamton, NY, www.uic.com) and CyberOptics Corp. (Minneapolis, MN, www.cyberoptics.com) have signed an agreement to integrate the new Embedded Process Verification (EPV) inspection technology from CyberOptics into...

Vanguard EMS selects Den-on's lead-free rework equipment.(Industry News)
May 1, 2004... FocalSpot, Inc. (San Diego, CA, www.focalspot.com), a provider of inspection and rework/repair solutions and services, recently announced that contract manufacturer Vanguard EMS (Portland, OR, www.vanguardems.com) has selected Den-on...

ECA: industry comeback continues in February.(Market Watch)
May 1, 2004... The monthly order index compiled by the Electronic Components, Assemblies & Materials Association (ECA, Arlington, VA, www.ec-central.org) continued its upward movement in February, extending an industry comeback that began last fall. ECA's...

China, Mexico lock horns to woo North American market.(Market Watch)
May 1, 2004... Rising business costs in Mexico have compelled North American electronics manufacturing services (EMS) providers and electronics assemblers to reevaluate the viability of continuing manufacturing operations in that region. New analysis...

February 2004 book-to-bill.(Market Watch)
May 1, 2004... The North American IMS/PCB Industry Book-to-Bill Ratio for February 2004 remained firm at 1.08. The ratio is calculated by averaging the index numbers for orders booked over the past three months and dividing by the average index numbers for...

Q&A with Nicholas Brathwaite, chief technology officer, Flextronics Corp.(The Fine Pitch)
May 1, 2004... Circuits Assembly: Explain your top three goals, technology-wise, for Flextronics in 2004? [TEXT NOT REPRODUCIBLE IN ASCII] Nicholas Brathwaite: I can probably summarize our goals into one statement: To leverage our capabilities,...

Universal, DaimlerChrysler announce China partnership.(Asia Watch)
May 1, 2004... Universal Instruments Corp. (UIC, Binghamton, NY, www.uic.com) has established requisites for a long-term partnership with Shanghai, China-based DaimlerChryslerSIM Technology (DCSIM Tech.). DCSIM Tech. is a joint venture between DaimlerChrysler...

TKK, Enthone to strengthen plating process in Asia.(Asia Watch)
May 1, 2004... Tanaka Kikinzoku Kogyo K.K. (TKK) and Enthone Inc. (West Haven, CT, www.enthone.com), a Cookson Electronics company, have reached an agreement to strengthen their precious metal plating process business in Asia. The agreement includes...

InteliCoat names Oblong China distributor.(Asia Watch)
May 1, 2004... InteliCoat Technologies (South Hadley, MA, www.intellicoat.com), a manufacturer of coated paper, film and specialty substrates for imaging and electronic technologies, has appointed Ricky Wu and Oblong Technology (Taipai, Taiwan) as its new...

China: still the hot spot for high technology; China's electronics and semiconductor industries continue to grow, as do trade frictions.(On the Forefront)
May 1, 2004... According to Semiconductor Equipment and Materials International (SEMI), the 1[4.sup.th] annual SEMICON China, held in Shanghai in March, drew a large crowd of more than 15,000 attendees. The increased number of exhibitors--10% more than...

What quiet packaging revolution? The drive for low-cost packages is pushing thermoplastics into the mainstream.(Emerging Technology)
May 1, 2004... Electronic packaging is a hot technology topic that is evolving and unfolding ever faster as we follow our roadmap to three-dimensional (3-D) stacked designs and wafer-level package (WLP) processes. Quiet might not seem appropriate to describe...

Lean manufacturing and modern placement equipment; finding the perfect fit.(Cover Article)(Cover Story)
May 1, 2004... Lean manufacturing is more than a buzz phrase. To be truly competitive on a global scale, smart surface-mount equipment suppliers and electronics manufacturers have dedicated their efforts to supporting this concept throughout their facilities....

Apec2000[TM]: Etch-cut workstation.(Assembly Insider: Special Advertising Section)(Advertisement)
May 1, 2004... For Etch-cut service, contact: 8 Winn Ave., Hudson, NH 03051 Tel: (603) 889-1999, Fax: (603) 889-1324 www.additive.com [ILLUSTRATION OMITTED] [ILLUSTRATION OMITTED] For workstation purchase, contact: APEC-CO,...

South East Asia wireless ECO process.(Assembly Insider: Special Advertising Section)(Advertisement)
May 1, 2004... NEW FACTORY FOR WIRELESS ECO PROCESS OPEN PENANG, MALAYSIA EARLY 2004 Eliminates Hand Rework new traces, pads, etch-cuts BEST ACM TECHNOLOGY EVER! * Proven process for ECOs in North America and soon in South East Asia....

Join our EAX program today!(Assembly Insider: Special Advertising Section)(Advertisement)
May 1, 2004... * MAXIMIZE THE RETURN OF SURPLUS ASSETS with global exposure through online auctions * EAX program delivers $20M in gross proceeds over one year to clients worldwide * Proven effective asset disposition solution for surplus assets ...

ESSEMTEC[R] production equipment for electronics.(Assembly Insider: Special Advertising Section)(Advertisement)
May 1, 2004... LEAD FREE SOLDERING ESSEMTEC--the leading Swiss manufacturer of low/midsize volume production equipment presents the latest technology in lead free capable REFLOW OVENS. RO300FC Table top or stand alone full convection reflow oven...

Advanced laser technology produce superior stencils; IIT's proprietary lasers exceed industry standards.(Assembly Insider: Special Advertising Section)(Advertisement)
May 1, 2004... Premier SMT stencil manufacturer Integrated Ideas & Technologies (IIT), utilizes proprietary laser technology to create superior stencils. Exceeding the industry standard in cutting technology, IIT's lasers feature proprietary optical tuning...

Total process control and management, part II: from reliability, stability and traceability to predictability.(Process Control)
May 1, 2004... Part I of this article was featured in the April issue, and Model I (Reliability) and Model II (Stability) of the experiment were discussed. [TEXT NOT REPRODUCIBLE IN ASCII] Model III: Traceability As a consequence of the Internet...

Assembly and reliability of a wafer-level CSP; an experiment reveals that wafer-level devices can be assembled in high yield using standard surface-mount practices.(Component Placement)
May 1, 2004... Chip-scale package (CSP) technology continues to push the limits of miniaturization on both the package and printed circuit board (PCB) level. Wafer-level CSPs are individual silicon chips that contain a thin film redistribution layer to route...

The emergence of high-volume copper ball bonding; as copper ball bonding establishes a strong-hold in low-cost packaging, it will eventually migrate to and dominate fine-pitch ICs.(Focus on: HDI/Advanced Technology)
May 1, 2004... Although copper ball bonding development programs were conducted by virtually every major semiconductor manufacturer during the late 1980s and early 1990s, copper ball bonding failed to enter high-volume integrated circuit (IC) manufacturing...

Kester - changing to meet the future of electronics.(ADVERTORIAL)(Advertisement)
May 1, 2004... For over a century, Kester, a Chicago solder company has been delivering superior products and technology to customers worldwide. Before the latest 90 nm wafer technology hit, before the electronics boom, before the industrial age, there was...

Lean production in electronics assembly; to be competitive, production managers must have a lean organization with increased flexibility.(Process Optimization)
May 1, 2004... Many ways exist to waste time, money and material in electronics assembly, as in every production environment. Unfortunately, these money pits are not always visible. If you feel your company may be wasting too much, here are some of the...

Depaneling requires a closer look: press-type depaneling can be an accurate and gentle singulation method.(Depaneling)
May 1, 2004... Depaneling is a process that you cannot avoid if you are involved in the assembly of printed circuit boards (PCBs). It is found, in one form or another, in just about every electronics manufacturing environment. Whether you route, punch, snip,...

X-ray inspection system.(Product Spotlight)
May 1, 2004... The TIGER x-ray system features collision-free inspection and is controlled by an automatic mechanism. The anti-collision feature protects the sample from collision damage during the inspection process. The anti-collision capability eliminates...

Dispensing system.(Product Spotlight)
May 1, 2004... The Ultra 2400 dispensing system applies consistent amounts of solder paste, flux, adhesives, epoxies and other fluids--from uniform dots as small as 0.10160 mm (0.004 in.) in diameter to neat, controlled beads. The workstation features a...

Traceability software module.(Product Spotlight)
May 1, 2004... MIMTRACE is a traceability software module to help electronics manufacturers meet new traceability requirements. It traces all details of the placement process, including job, lot, panel, board and placed component, with 24 data levels stored...

Motion feedback encoder.(Product Spotlight)
May 1, 2004... The Mercury 1800 (M1800) digital kit encoder provides 50-nanometer resolution from the sensor and measures 8.9 mm tall. The encoder is available in two resolutions: 50 or 100 nanometers, linear, or up to 6.5 million CPR rotary. All electronics...

Workstation systems.(Product Spotlight)
May 1, 2004... Series 8000 modular workstation systems can be assembled and reconfigured quickly. Each workstation can be configured in a variety of heights and lengths, providing effective use of vertical space up to 84 in. The workstations are easily...

Lead-free wave solder alloy.(Product Spotlight)
May 1, 2004... The ALPHA Vaculoy SACX307 lead-free wave solder alloy delivers high yield and fast throughput while meeting the strict lead-free environmental mandates. Its fast wetting speed delivers improved solderability. It provides drainage and minimizes...

Flux-coated solder preforms.(Product Spotlight)
May 1, 2004... Indium's flux-coated solder preforms support the optimization of electronic assembly processes. Advantages over plain solder preforms include improved process time--using the pre-applied, fused flux, the preforms eliminate the need to add flux...

IC ball bonder.(Product Spotlight)
May 1, 2004... The Max[mu]mplus ultra high speed ball bonder is for all types of ultra-fine pitch applications, including 35 micron in-line pitch. The bonder delivers bond placement accuracy of 2.5 [micro]m. An improved servo control system for the xy table...

Wire bond encapsulant.(Product Spotlight)
May 1, 2004... NoSWEEP wire bond encapsulant encapsulates narrow diameter, long and ultra-fine pitch wires on semiconductor devices without causing sweep. The silica-filled liquid polymer encapsulates wires, locking them in place and prohibiting their...

UV laser marking.(Product Spotlight)
May 1, 2004... JPSA Laser offers ultraviolet (UV) laser marking services on difficult materials such as glass, crystals, diamonds, sapphire, polymers, metals and glass. UV excimer laser systems vaporize submicron layers of material to create a non-destructive...

Thin film chip component trim system.(Product Spotlight)
May 1, 2004... TrimSmart W778 thin film chip component trim system is optimized specifically for use in adjusting the resistive values of the latest generation of thin film chip resistors and resistor networks. The new system provides a combination of laser...

Stacked MicroVia technology.(Product Spotlight)
May 1, 2004... Stacked MicroVia (SMV) technology reduces layer count and improves performance of printed circuit boards (PCB) currently using standard and fine-pitch (compact) devices. It consists of .004 in. laser drilled holes that contain a solid copper...

Single-chip controller.(Product Spotlight)
May 1, 2004... Agere's Pl-301 single-chip controller for inkjet and thermal fax applications is multi-processor system-on-a-chip (SoC) that combines as many as eight separate electronics components. The controller supports existing thermal fax designs while...

Outsourcing the blame? Split responsibilities can cause complications, so be sure that both companies document and report important process results.(Ask Les)
May 1, 2004... Q: We outsource the placement and soldering of most of the components on our printed wiring assemblies to a contract manufacturer (CM). To complete the assembly, we then customize the outsourced assemblies that the CM has produced and shipped...